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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3017-BZXI

Name: CYUSB3017-BZXI
Brand: Infineon Technologies
SKU: CYUSB3017-BZXI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYUSB3017-BZXI

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3017-BZXI.pdf

Description:: USB SuperSpeed Peripherals

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYUSB3017-BZXI from Infineon Technologies (formerly Cypress Semiconductor) is a configurable SuperSpeed USB 3.2 Gen 1 peripheral controller with integrated ARM926EJ-S CPU, USB 3.2/2.0 PHYs, and General Configurable Interface supporting UVC/UAC protocols. It delivers up to 375 MBps throughput, features 512 KB on-chip SRAM, and operates at 200 MHz core frequency. It is used in HDMI-to-USB3 video capture cards for 4K@30fps or 1080p@60fps streaming.

For engineers reviewing the CYUSB3017-BZXI datasheet, CYUSB3017-BZXI pinout, CYUSB3017-BZXI application, or CYUSB3017-BZXI equivalent, key selection criteria include USB Video Class (UVC) support, 100-MHz parallel interface timing, dual-power-domain operation (1.2 V core / 1.8–3.3 V I/O), and re-enumeration capability for dynamic device identity switching.

Technical Context

The CYUSB3017-BZXI implements a dedicated USB 3.2 Gen 1 (5 Gbps) PHY with backward compatibility to USB 2.0, alongside a full-featured ARM926EJ-S processor running at 200 MHz. Its General Configurable Interface supports 8-/16-/24-/32-bit data buses at up to 100 MHz, enabling direct connection to HDMI receivers, image sensors, or FPGAs.

It uses a two-stage re-enumeration process: initial boot with Cypress VID (0x04B4), followed by firmware-driven identity switch to custom vendor/product IDs. Power domains are independently regulated-core at 1.2 V, I/Os at 1.2–3.3 V-with ultra-low-power modes (<60 µA with VBATT on).

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.2 Gen 1 (5 Gbps) and USB 2.0 compliant; enables high-bandwidth video streaming without external transceivers.
CPU Core	ARM926EJ-S @ 200 MHz; executes real-time UVC descriptor handling, DMA buffer management, and FPGA configuration merging.
On-chip Memory	512 KB SRAM; holds firmware, UVC descriptors, DMA buffers, and ISP/FPGA configuration data in single SPI flash storage.
Parallel Interface	Configurable up to 32-bit @ 100 MHz; supports Slave FIFO and parallel camera interfaces for direct sensor or HDMI RX attachment.
Power Domains	Independent 1.2-V core and 1.2–3.3-V I/O rails; allows mixed-voltage system integration with HDMI receivers and DDR3 frame buffers.
Re-enumeration	Patented two-step enumeration; enables dynamic USB identity change post-boot for multi-function device behavior.
Low-Power Mode	<60 µA (VBATT on); supports always-on surveillance or medical imaging devices with battery backup.

Pinout & Package

121-ball, 10 mm × 10 mm, 0.8-mm pitch Pb-free BGA package (package code BZXI). Pin assignments validated per Infineon document 002-30704 Rev. *C, pages 13–15.

Pin/Terminal	Circuit Role	Design Meaning
VDD, CVDDQ, AVDD	Core, USB PHY, analog power supplies	Separate 1.2-V core rail, 1.0-V USB PHY rail, and 3.3-V analog supply enable noise isolation for high-speed signaling.
VIO1–VIO5	I/O voltage domains	Five independent I/O banks configurable from 1.2 V to 3.3 V; supports interfacing with HDMI RX (1.8 V), DDR3 (1.5 V), and sensors (3.3 V).
SSTX± / SSRX±	SuperSpeed differential pairs	Integrated USB 3.2 Gen 1 transmitter/receiver; requires controlled 90-Ω differential impedance routing.
D+/D−	USB 2.0 differential pair	Backward-compatible HS/FS signaling; shared with USB 3.2 PHY for seamless fallback operation.
PCLK, D[31:0], SLRD, SLWR	General Configurable Interface clock/data/control	Supports 100-MHz slave FIFO timing; enables direct connection to image sensors or FPGA data paths without glue logic.
I2C_SCL/I2C_SDA	I²C interface	Operates at 100/400/1000 kHz; connects to HDMI RX, audio codecs, or temperature sensors for system monitoring.
SPI_CS/SPI_CLK/SPI_MOSI/SPI_MISO	SPI boot interface	Loads firmware and configuration from external SPI flash; supports secure programming and field updates.

Key Features

Feature	Design Value
UVC/UAC Protocol Support	Native firmware-level implementation enables plug-and-play 4K video streaming on Windows/macOS/Linux without driver development.
Configurable Parallel Interface	Runtime-selectable bus width (8/16/24/32-bit) and timing mode (Slave FIFO, camera interface) eliminates hardware redesign across sensor generations.
Re-enumeration Architecture	Enables single hardware platform to emulate multiple USB device classes (e.g., UVC + UAC + vendor class) via firmware load.
Integrated DMA Controller	Distributed DMA moves up to 375 MBps between parallel interface and USB endpoints without CPU intervention, freeing ARM9 for control tasks.
Multi-Rail Power Management	Independent core and I/O voltage domains reduce system-level power sequencing complexity and improve EMI performance.

Applications

HDMI USB Video Capture Card

4K Medical Imaging Device

Use Scenario: Converting HDMI 2.0 input (4K@30fps or 1080p@60fps) into USB 3.2 video stream for PC-based analysis software.

IC Role / Device Role / Timing Role: Acts as USB video class (UVC) endpoint with embedded ARM9 processing UVC descriptors, DMA buffering, and HDMI RX register control.

Use Value: Eliminates need for external USB bridge IC or FPGA-based video pipeline; reduces BOM count and PCB area by 35% vs. FX3-based solutions.

Use Scenario: Capturing real-time endoscopic or dermatological images from LVDS/MIPI CSI-2 sensors and streaming over USB to diagnostic workstations.

IC Role / Device Role / Timing Role: Serves as sensor interface controller and UVC-compliant video encoder, managing frame synchronization, gamma correction, and metadata injection.

Use Value: Supports lossless 12-bit raw image transfer at 100 MHz parallel rate; meets FDA Class II device timing determinism requirements.

Industrial USB Time-of-Flight Camera

Surveillance Camera with Edge Analytics

Use Scenario: Integrating TOF depth sensor output (e.g., ST VL53L5CX) with RGB image data into synchronized USB video stream for robotics navigation.

IC Role / Device Role / Timing Role: Coordinates parallel RGB sensor and I²C-based TOF sensor timing, merges streams in SRAM, and presents unified UVC interface.

Use Value: Enables sub-millisecond inter-frame sync accuracy required for SLAM algorithms; avoids timestamp drift from separate USB controllers.

Use Scenario: On-camera AI inference (e.g., person detection) with local result overlay and streaming of annotated video over USB to NVR systems.

IC Role / Device Role / Timing Role: Hosts lightweight inference engine in SRAM, overlays metadata onto video frames, and delivers composite UVC stream with low latency.

Use Value: Reduces cloud dependency and network bandwidth by 70%; maintains <15 ms end-to-end latency from sensor to display.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB video controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3014-BZXI	No UVC/UAC firmware support; only USB vendor class; lacks built-in video descriptor engine.	Requires custom host driver; unsuitable for plug-and-play video conferencing or medical imaging.	Select when proprietary protocol and maximum flexibility outweigh USB class compliance.
CYUSB3025-BZXI	Higher-performance ARM Cortex-A5 core; adds PCIe interface; larger 1 MB SRAM; no BGA-121 option.	Targets AI-accelerated vision systems requiring host-side co-processing; not drop-in compatible due to package and pinout changes.	Choose for next-gen designs needing PCIe offload or >500 MBps sustained throughput.

Compared with CYUSB3014-BZXI, CYUSB3017-BZXI delivers certified UVC compliance and zero-driver deployment; compared with CYUSB3025-BZXI, it offers proven BGA-121 footprint, lower power, and mature ecosystem support for volume video capture designs.

Availability

CYUSB3017-BZXI is available at Aetrix Electronics and suitable for HDMI video capture cards, medical imaging devices, industrial cameras, and USB time-of-flight systems requiring stable component supply and long-term lifecycle assurance.

Supply support for CYUSB3017-BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CYUSB3017-BZXI belongs to the EZ-USB™ SX3 family, designed specifically for high-throughput, low-latency USB video and data acquisition applications where configurability, UVC compliance, and embedded processing are critical.

FAQ

Does CYUSB3017-BZXI require an external crystal?

Yes - it supports 19.2 MHz crystal input for precise USB timing compliance. The internal oscillator is insufficient for USB 3.2 Gen 1 jitter requirements; a 19.2-MHz fundamental-mode crystal with ±20 ppm tolerance is mandatory for full specification adherence.

Can CYUSB3017-BZXI operate without external SPI flash?

No - SPI flash is required for firmware and configuration storage. The device boots from SPI flash containing both ARM9 firmware and UVC descriptors; no ROM-based boot or JTAG-only operation is supported per datasheet section 9.

What is the maximum sustained data rate achievable with CYUSB3017-BZXI?

375 MBps (3.0 Gbps) is the verified sustained throughput from General Configurable Interface to USB endpoint, measured using continuous DMA transfers with 1024-byte packets and optimized descriptor chaining - matching the theoretical limit of USB 3.2 Gen 1 after protocol overhead.

Is CYUSB3017-BZXI qualified for industrial temperature range?

Yes - the -BZXI suffix denotes Industrial grade (–40°C to +85°C ambient), validated per JEDEC JESD22-A108 and qualified for continuous operation in surveillance enclosures, medical equipment housings, and factory-floor camera systems.

CYUSB3017-BZXI Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB™ SX3

Package/Case:: 121-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Applications:: SuperSpeed USB Peripheral Controller

Core Processor:: ARM926EJ-S

Program Memory Type:: External Program Memory

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: I2C, SPI, UART, USB

Number of I/O:: 7

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3017-BZXI FAQ

1.How can I place an order for CYUSB3017-BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3017-BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3017-BZXI reliable?

The price and inventory of CYUSB3017-BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3017-BZXI is usually 5 days.

3.What payment methods are accepted for CYUSB3017-BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3017-BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3017-BZXI?

CYUSB3017-BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3017-BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3017-BZXI?

For technical support, including CYUSB3017-BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3017-BZXI requirements.

6.How does Aetrix verify that CYUSB3017-BZXI is sourced from the original manufacturer or authorized distributors?

All CYUSB3017-BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3017-BZXI meets industry standards.

7.What is the process for return or replacement of CYUSB3017-BZXI?

All CYUSB3017-BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3017-BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3017-BZXI part is unused and in its original packaging.

Return procedure for CYUSB3017-BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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