Infineon Technologies CYUSB3017-BZXIT
- Part No.:
- CYUSB3017-BZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 121-TFBGA
- Datasheet:
-
CYUSB3017-BZXIT.pdf
- Description:
- USB SuperSpeed Peripherals
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CYUSB3017-BZXIT from Infineon Technologies (formerly Cypress Semiconductor) is a configurable SuperSpeed USB 3.2 Gen 1 peripheral controller with integrated ARM926EJ-S CPU, USB 3.2/2.0 PHYs, and General Configurable Interface supporting UVC/UAC protocols. It delivers up to 375 MBps data throughput, features 512 KB on-chip SRAM, and operates at 200 MHz core frequency. It targets USB video capture systems requiring real-time HDMI or image sensor bridging.
For engineers reviewing the CYUSB3017-BZXIT datasheet, CYUSB3017-BZXIT pinout, CYUSB3017-BZXIT application, or CYUSB3017-BZXIT equivalent, key selection criteria include UVC protocol support, 100-MHz parallel interface timing, 1.2-V core voltage domain, and BGA-121 package compatibility for high-density camera interface designs.
Technical Context
The CYUSB3017-BZXIT implements a dual-mode USB stack compliant with USB 3.2 Gen 1 (5 Gbps) and USB 2.0, with hardware-assisted re-enumeration enabling dynamic device identity switching. Its ARM926EJ-S CPU executes firmware directly from 512 KB embedded SRAM and manages DMA transfers between the General Configurable Interface and USB endpoints.
It supports three physical USB endpoints and integrates dedicated UVC/UAC descriptor handling logic, I2C (100/400/1000 kHz), SPI boot flash interface, and independent power domains (1.2 V core, 1.8–3.3 V I/O). Clock input options include 19.2, 26, 38.4, and 52 MHz, with crystal support at 19.2 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Compliance | USB 3.2 Gen 1 (5 Gbps) and USB 2.0 backward compatible; enables single-chip bridge from HDMI/image sensors to host PC without external USB transceivers. |
| CPU Core | ARM926EJ-S @ 200 MHz; executes real-time UVC descriptor management, DMA control, and FPGA configuration loading without external processor. |
| On-chip Memory | 512 KB SRAM; stores firmware, UVC descriptors, DMA buffers, and ISP/FPGA bitstream-eliminates need for external RAM in compact video capture designs. |
| Parallel Interface | Configurable 8-/16-/24-/32-bit slave FIFO or image sensor interface up to 100 MHz; directly connects to HDMI receivers (e.g., TFP410), LVDS/MIPI CSI-2 bridges, or CMOS image sensors. |
| Power Domains | Independent 1.2-V core and 1.8–3.3-V I/O rails; allows mixed-voltage system integration with 1.8-V FPGAs and 3.3-V sensors while minimizing leakage in low-power modes. |
| Low-Power Mode | <60 µA core power-down with VBATT active; supports always-on USB presence detection in battery-powered document cameras and portable medical imagers. |
| Package | 121-ball BGA, 10 mm × 10 mm, 0.8-mm pitch; optimized for thermal dissipation and signal integrity in high-speed video routing on 4-layer PCBs. |
Pinout & Package
Package: 121-ball Pb-free BGA, 10 mm × 10 mm, 0.8-mm pitch, 0.8-mm ball diameter, standard JEDEC MO-277 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / CVDDQ | Core power supply | 1.2-V regulated input for ARM926EJ-S core and internal logic; requires local 1-µF ceramic decoupling. |
| VIO1–VIO5 | I/O power domains | Five independent 1.8–3.3-V supplies for configurable interface banks-enables mixed-voltage interfacing with HDMI RX (3.3 V) and FPGA (1.8 V). |
| SSTX± / SSRX± | SuperSpeed differential pairs | 5-Gbps USB 3.2 Gen 1 transmit/receive lanes; require controlled 90-Ω differential impedance and <5-mil stub length. |
| D+ / D− | High-Speed USB 2.0 interface | Backward-compatible full-speed/high-speed signaling; used during enumeration and fallback operation if SuperSpeed link fails. |
| GPIF_DATA[0:31] | General Configurable Interface bus | 32-bit bidirectional data lines configurable as slave FIFO or parallel camera interface; supports 100-MHz synchronous timing with PCLK. |
| PCLK / CTL[0:5] | Interface clock and control | PCLK drives synchronous data capture; CTL pins configure handshake modes (e.g., SLRD/SLWR for FIFO, RD/WR for memory-mapped access). |
| I2C_SDA / I2C_SCL | I2C master interface | Configurable 100/400/1000-kHz I2C bus for reading sensor registers, configuring HDMI receivers, or managing power ICs. |
| SPI_MOSI / MISO / SCK / SS_N | SPI boot interface | Quad-wire SPI for loading firmware and FPGA configuration from external flash; supports XIP execution and merged configuration storage. |
Key Features
| Feature | Design Value |
|---|---|
| UVC/UAC Protocol Engine | Hardware-accelerated USB Video Class and Audio Class descriptor generation and streaming control-reduces CPU load and ensures compliance with Windows/macOS UVC drivers without custom host software. |
| Re-enumeration Architecture | Patented two-step enumeration: first as Cypress vendor device to download firmware, then as final UVC product ID-enables field-upgradable device identities and secure firmware updates. |
| Distributed DMA Controller | Zero-copy data movement between GPIF interface and USB endpoints at up to 375 MBps-supports uncompressed 4K30 or dual 1080p60 video streaming without frame drops. |
| FPGA Configuration Merging | Single SPI flash stores both SX3 firmware and FPGA bitstream; configuration utility merges them into one image-simplifies manufacturing and eliminates separate programming steps. |
| VBATT Power Domain | Dedicated battery-supplied rail for wake-on-USB and low-power monitoring-maintains device readiness during host sleep states in surveillance and medical imaging applications. |
Applications
| HDMI USB Video Capture Card | Industrial Camera Interface Board |
|---|---|
Use Scenario: Converting HDMI 1080p60 or 4K30 signals from broadcast equipment or test instruments into plug-and-play USB video streams. IC Role / Device Role / Timing Role: Acts as USB endpoint controller and real-time video protocol translator; handles UVC descriptor negotiation, YUV422 packing, and DMA-synchronized frame buffering. Use Value: Eliminates need for external USB transceiver and video encoder ICs-reduces BOM cost by ~35% and board area by 40% versus discrete solutions. | Use Scenario: Bridging high-resolution CMOS image sensors (e.g., Sony IMX series) with LVDS/MIPI CSI-2 outputs to USB hosts in factory automation vision systems. IC Role / Device Role / Timing Role: Serves as sensor interface controller and USB streaming engine; configures sensor registers via I2C and routes raw Bayer/RGB data through GPIF to USB. Use Value: Supports 100-MHz pixel clocks and burst transfers-enables 12-bit 4K@30fps capture with sub-frame latency under 2 ms. |
| Medical Endoscope Imaging System | USB Time-of-Flight (ToF) Camera |
Use Scenario: Real-time transmission of high-fidelity endoscopic video from sterile-field cameras to surgical display workstations. IC Role / Device Role / Timing Role: Performs UVC-compliant video streaming with precise isochronous scheduling, HDR metadata injection, and low-jitter timestamping. Use Value: Meets FDA-required latency thresholds (<100 ms) and supports lossless compression offload via FPGA co-processing. | Use Scenario: Integrating ToF depth sensors (e.g., ST VL53L5CX) with synchronized IR illumination and USB output for AR/VR and robotics navigation. IC Role / Device Role / Timing Role: Manages time-sliced sensor readout, depth map formatting, and UVC-compliant metadata embedding for depth+IR video streaming. Use Value: Enables synchronized multi-zone ToF acquisition at 60 fps using programmable GPIF state machine-no external timing controller required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB video controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3016-BZXIT | Same package and core architecture but lacks UVC/UAC firmware engine; supports only vendor-class USB protocol. | Requires custom host driver development; unsuitable for plug-and-play Windows/macOS video apps. | Select when proprietary data transfer (e.g., industrial sensor telemetry) is prioritized over UVC compatibility. |
| CYUSB3015-BZXIT | Identical silicon but configured for vendor-class only; no UVC descriptor tables or video streaming acceleration logic enabled. | Cannot enumerate as standard UVC device; limited to custom firmware and host-side parsing. | Choose for non-video applications needing high-throughput USB data pipes (e.g., USB oscilloscopes, logic analyzers). |
Compared with CYUSB3016-BZXIT and CYUSB3015-BZXIT, the CYUSB3017-BZXIT uniquely integrates hardware UVC/UAC protocol support and pre-validated descriptor templates-reducing time-to-market for certified video products by eliminating host driver development and USB-IF compliance testing overhead.
Availability
CYUSB3017-BZXIT is available at Aetrix Electronics and suitable for HDMI video capture cards, industrial camera interface boards, medical endoscope systems, and USB Time-of-Flight camera modules requiring stable component supply across production lifecycles.
Supply support for CYUSB3017-BZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, delivering power systems, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.
The EZ-USB™ SX3 product line was originally developed by Cypress Semiconductor and continues under Infineon to address high-bandwidth USB bridging needs in video, imaging, and instrumentation-emphasizing configurability, low-latency DMA, and out-of-box UVC compatibility.
FAQ
What USB classes does CYUSB3017-BZXIT natively support without external firmware modification?
CYUSB3017-BZXIT natively supports USB Video Class (UVC) and USB Audio Class (UAC) via built-in hardware protocol engines and factory-programmed descriptor tables. It enumerates as a standard UVC device on Windows and macOS without custom drivers, supporting resolutions up to 4K30 and frame rates up to 60 fps with YUV422 or MJPEG encoding paths.
Does CYUSB3017-BZXIT require an external crystal, and what frequencies are supported?
Yes, CYUSB3017-BZXIT requires a 19.2-MHz fundamental-mode crystal connected to the XTAL_IN/XTAL_OUT pins for primary clocking. It also accepts 26-MHz, 38.4-MHz, and 52-MHz clock inputs via the CLKIN pin. The 19.2-MHz crystal option enables lowest jitter for USB 3.2 Gen 1 link stability and precise video timing synchronization.
Can CYUSB3017-BZXIT interface directly with MIPI CSI-2 image sensors?
No, CYUSB3017-BZXIT does not support native MIPI CSI-2 signaling. It requires an external bridge IC (e.g., ON Semiconductor AP0101, Texas Instruments DS90UB953) to convert MIPI CSI-2 to parallel LVDS or 8-/16-bit CMOS format compatible with its General Configurable Interface. The GPIF supports parallel sensor interfaces up to 100 MHz but lacks MIPI PHY layers.
Is the 512 KB on-chip SRAM accessible for both code execution and DMA buffer storage simultaneously?
Yes, the 512 KB embedded SRAM is unified memory accessible by the ARM926EJ-S CPU for instruction/data and by the distributed DMA controller for packet buffering. Memory mapping is configurable via the SX3 Configuration Utility, allowing allocation splits such as 384 KB for firmware + 128 KB for double-buffered UVC video frames-enabling zero-copy streaming without external RAM.
CYUSB3017-BZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EZ-USB™ SX3
- Package/Case:
- 121-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- SuperSpeed USB Peripheral Controller
- Core Processor:
- ARM926EJ-S
- Program Memory Type:
- External Program Memory
- Controller Series:
- CYUSB
- RAM Size:
- 512K x 8
- Interface:
- I2C, SPI, UART, USB
- Number of I/O:
- 7
- Voltage - Supply:
- 1.15V ~ 1.25V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 121-FBGA (10x10)
CYUSB3017-BZXIT FAQ
1.How can I place an order for CYUSB3017-BZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB3017-BZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB3017-BZXIT reliable?
The price and inventory of CYUSB3017-BZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3017-BZXIT is usually 5 days.
3.What payment methods are accepted for CYUSB3017-BZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3017-BZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB3017-BZXIT?
CYUSB3017-BZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB3017-BZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB3017-BZXIT?
For technical support, including CYUSB3017-BZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3017-BZXIT requirements.
6.How does Aetrix verify that CYUSB3017-BZXIT is sourced from the original manufacturer or authorized distributors?
All CYUSB3017-BZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3017-BZXIT meets industry standards.
7.What is the process for return or replacement of CYUSB3017-BZXIT?
All CYUSB3017-BZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3017-BZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB3017-BZXIT part is unused and in its original packaging.
Return procedure for CYUSB3017-BZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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