Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3025-BZXI

Name: CYUSB3025-BZXI
Brand: Infineon Technologies
SKU: CYUSB3025-BZXI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CYUSB3025-BZXI

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3025-BZXI.pdf

Description:: IC USB CTLR

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:649

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CYUSB3025-BZXI from Infineon is a USB 3.0 SuperSpeed mass-storage peripheral controller with dual SD/MMC/SDIO host ports (S0 and S1), ARM926EJ-S core, integrated USB 3.0 transceiver, and support for UHS-I SDR50/DDR50, eMMC 4.4, and SDIO 3.0. It operates at ≤60 µA in core power-down mode with VBATT on and delivers certified USB 3.0/2.0 peripheral functionality for embedded storage bridges.

For engineers reviewing the CYUSB3025-BZXI datasheet, CYUSB3025-BZXI pinout, CYUSB3025-BZXI application, or CYUSB3025-BZXI equivalent, key selection criteria include dual-port SD/eMMC timing compliance, I2C master capability at 1 MHz, 10×10 mm BGA package constraints, and boot-source flexibility across USB/I2C/SPI/eMMC.

Technical Context

The device implements a dedicated ARM926EJ-S processor with 512 kB SRAM, enabling firmware-driven control of concurrent USB 3.0 peripheral traffic and two independent storage ports-each configurable as SD, MMC, or SDIO per SD3.0/MMC 4.4/SDIO 3.0 specs. USB interface supports 32 physical endpoints (16 IN/16 OUT) and UAS/MSC device classes.

Power architecture features separate domains for core (VDD) and I/O (VIO5, VIO33), allowing mixed-voltage operation: VIO5 supports 1.2 V (100 kHz I2C max) or 1.8/2.5/3.3 V (up to 1 MHz I2C), while USB PHY and storage controllers maintain strict AC timing per JEDEC and SD Association requirements.

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.0 v1.0 certified peripheral; backward-compatible with USB 2.0 Hi-Speed/Full-Speed
Storage Interfaces	Dual independent ports: S0 and S1 supporting SD3.0 (UHS-I SDR50/DDR50), eMMC 4.4, SDIO 3.0
Core Processor	ARM926EJ-S running at up to 200 MHz with 512 kB embedded SRAM
Power Consumption	<60 µA core power-down current with VBATT active; 20 µA with VBATT off
I2C Master	Supports 100 kHz (VIO5 = 1.2 V), 400 kHz/1 MHz (VIO5 = 1.8/2.5/3.3 V); includes clock stretching
Clock Input Options	19.2 MHz crystal (XTALIN/XTALOUT) or 19.2/26/38.4/52 MHz external CLK via CLKIN
Package	10 × 10 mm, 0.8 mm pitch ball grid array (BGA) - 121-ball layout per datasheet Figure 15

Pinout & Package

Package: 10 × 10 mm, 0.8 mm pitch BGA (121-ball layout). Pin functions validated per Infineon datasheet Rev. *O, pages 17–21.

Pin/Terminal	Circuit Role	Design Meaning
SSTX+/SSTX−	USB 3.0 SuperSpeed differential transmit pair	Drives USB 3.0 5-Gbps signaling; requires controlled-impedance PCB routing (85 Ω differential)
SSRX+/SSRX−	USB 3.0 SuperSpeed differential receive pair	Receives USB 3.0 5-Gbps signaling; integrated termination enables direct connection to USB connector
S0_SD[0:7], S0_CMD, S0_CLK, S0_WP	SD/MMC/SDIO port 0 data/control signals	Configurable 8-bit SD bus or 4-bit MMC/SDIO; supports CMD/DAT line pull-up/down per spec
I2C_SCL / I2C_SDA	I2C master interface	Open-drain outputs requiring external VIO5 pull-ups; support multi-master arbitration and clock stretching
XTALIN / XTALOUT	19.2 MHz crystal oscillator interface	Connects to ±100 ppm 19.2 MHz fundamental-mode crystal; internal oscillator circuit eliminates need for external driver

Key Features

Feature	Design Value
Dual independent storage ports	Enables simultaneous SD + eMMC, SD + SDIO, or dual SD card operation without arbitration overhead
UAS-class USB mass storage	Reduces command latency and increases throughput vs. legacy MSC by leveraging SCSI command set over USB 3.0
Selective power domain gating	Allows VIO5 (I2C), VIO33 (USB/SD I/O), and VDD (core) to be powered independently for fine-grained power optimization
Firmware-configurable boot sources	Supports failover boot from USB → I2C EEPROM or SPI Flash (S25FS064S/S25FS128S/W25Q32FW compatible)
Integrated ARM926EJ-S subsystem	Provides deterministic real-time control of USB ↔ storage data flow without external host CPU dependency

Applications

USB SD Card Reader

Laptop SD Slot Bridge

Use Scenario: High-speed portable reader connecting SDXC cards to PCs via USB 3.0.

IC Role / Device Role / Timing Role: Acts as USB 3.0 peripheral controller translating SD3.0 UHS-I commands to USB Attached SCSI packets.

Use Value: Enables 104 MB/s sustained read via SDR50 mode and full USB 3.0 bandwidth utilization without host driver modification.

Use Scenario: Embedded bridge in ultrabook motherboard providing native SD slot support.

IC Role / Device Role / Timing Role: Provides compliant SD3.0 host controller logic with 1.8 V signaling and CMD/DAT timing per Physical Layer Spec v3.01.

Use Value: Eliminates need for discrete SD host controller IC and reduces BOM count by integrating ARM firmware engine and USB PHY.

eMMC-Based USB Dongle

SDIO Wi-Fi Bridge

Use Scenario: Compact USB dongle using onboard eMMC 4.4 as bootable storage and data cache.

IC Role / Device Role / Timing Role: Configures S0-Port as eMMC 4.4 master with HS200 timing mode and 8-bit data bus.

Use Value: Delivers >200 MB/s sequential read performance and supports RPMB partition for secure firmware updates.

Use Scenario: USB-to-SDIO adapter enabling legacy USB hosts to drive Wi-Fi/BT combo modules.

IC Role / Device Role / Timing Role: Implements SDIO 3.0 host controller with interrupt-driven function 1/2 register access and CMD52/CMD53 compliance.

Use Value: Supports 200 Mbps SDIO transfer rates and maintains low-latency interrupt response (<5 µs) for real-time Wi-Fi packet handling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB-to-mass-storage bridge applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3024-BZXI	Same die, but lacks S1-Port functionality; single SD/eMMC port only	Not suitable for dual-slot or SD+eMMC coexistence use cases	Select when cost-sensitive designs require only one storage interface and smaller firmware footprint
CYUSB3035-BZXI	Includes PCIe Gen2 endpoint interface alongside USB 3.0; larger 14×14 mm BGA	Targets host-side expansion cards rather than peripheral storage bridges	Choose only if system architecture requires PCIe upstream connectivity or hybrid USB/PCIe topology

Compared with CYUSB3024-BZXI, CYUSB3025-BZXI adds full S1-Port capability enabling true dual-storage concurrency; versus CYUSB3035-BZXI, it avoids PCIe complexity and package size penalty while delivering identical USB/SDIO/eMMC feature depth for peripheral bridge roles.

Availability

CYUSB3025-BZXI is available at Aetrix Electronics and suitable for USB SD card readers, laptop SD slot bridges, eMMC-based USB dongles, and SDIO Wi-Fi bridges requiring stable component supply, long-term lifecycle assurance, and production-ready firmware tooling.

Supply support for CYUSB3025-BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, security ICs, and high-speed interface solutions.

CYUSB3025-BZXI belongs to the EZ-USB™ SD3 family, designed specifically to replace discrete USB-to-SD/eMMC bridge chipsets in consumer and embedded storage peripherals with integrated ARM9-based firmware control and USB 3.0 compliance.

FAQ

What boot sources does CYUSB3025-BZXI support, and how are they selected?

CYUSB3025-BZXI supports boot from USB, I2C EEPROM, SPI Flash (S25FS064S/S25FS128S/W25Q32FW compatible), or eMMC on S0-Port. Selection is controlled by PMODE[2:0] pin states at reset, with configurable failover behavior-for example, PMODE=FFF attempts I2C boot first, then falls back to USB if unsuccessful.

Does CYUSB3025-BZXI support SD3.0 UHS-II or only UHS-I?

CYUSB3025-BZXI supports SD3.0 UHS-I modes only: SDR50 and DDR50. It does not implement UHS-II's dual-lane LVDS interface or associated signaling layers. The datasheet explicitly lists "UHS1 SDR50 / DDR50 Master" under features and makes no reference to UHS-II electrical or protocol support.

Can the I2C interface operate at 1 MHz while VIO5 is supplied at 1.2 V?

No. When VIO5 = 1.2 V, the I2C master is limited to 100 kHz maximum frequency. 1 MHz operation requires VIO5 ≥ 1.8 V, as confirmed in Section 1.3 of the datasheet: "When VIO5 is 1.2 V, the maximum operating frequency supported is 100 kHz."

Is external termination required for the USB 3.0 differential pairs?

Yes. SSTX+/SSTX− and SSRX+/SSRX− require external 85 Ω differential PCB trace impedance and on-die termination is not enabled by default. The datasheet specifies that external series resistors (typically 22–33 Ω) may be used near the transmitter, and receiver-side AC coupling capacitors (0.1 µF) are mandatory per USB 3.0 specification.

CYUSB3025-BZXI Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB™ SD3

Package/Case:: 121-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Applications:: SD3™ USB and Mass Storage Peripheral Controller

Core Processor:: ARM9®

Program Memory Type:: -

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: I2C, I2S, MMC/SD, SPI, UART, USB

Number of I/O:: 59

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3025-BZXI FAQ

1.How can I place an order for CYUSB3025-BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3025-BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3025-BZXI reliable?

The price and inventory of CYUSB3025-BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3025-BZXI is usually 5 days.

3.What payment methods are accepted for CYUSB3025-BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3025-BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3025-BZXI?

CYUSB3025-BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3025-BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3025-BZXI?

For technical support, including CYUSB3025-BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3025-BZXI requirements.

6.How does Aetrix verify that CYUSB3025-BZXI is sourced from the original manufacturer or authorized distributors?

All CYUSB3025-BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3025-BZXI meets industry standards.

7.What is the process for return or replacement of CYUSB3025-BZXI?

All CYUSB3025-BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3025-BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3025-BZXI part is unused and in its original packaging.

Return procedure for CYUSB3025-BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…