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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3033-BZXC

Name: CYUSB3033-BZXC
Brand: Infineon Technologies
SKU: CYUSB3033-BZXC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYUSB3033-BZXC

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3033-BZXC.pdf

Description:: IC USB CTLR

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYUSB3033-BZXC from Infineon is a USB 3.0/2.0 SuperSpeed controller IC featuring an ARM926EJ-S core (200 MHz), 512-KB SRAM, 32 physical endpoints, and a programmable 100-MHz GPIF II interface supporting 8-/16-bit buses and up to 16 control signals. It integrates SD/MMC/eMMC controllers (UHS-I, RAID0/RAID1), dual SDIO 3.0 ports, and supports UAS, MSC, HID, and Turbo-MTP protocols - deployed in industrial cameras and USB Disk-on-Module systems.

For engineers reviewing the CYUSB3033-BZXC datasheet, CYUSB3033-BZXC pinout, CYUSB3033-BZXC application, or CYUSB3033-BZXC equivalent, key selection criteria include USB 3.0 PHY compliance with PIPE 3.0, ultra-low-power core power-down mode (<60 µA with VBATT on), independent 1.2-V core / 1.8–3.3-V I/O power domains, and 10-mm × 10-mm BGA package with 0.8-mm pitch.

Technical Context

The CYUSB3033-BZXC implements a full-featured USB 3.0 peripheral and OTG host controller with HS/FS/LS support and integrated 5-Gbps PHY compliant with PIPE 3.0. Its ARM926EJ-S CPU runs at 200 MHz and manages 512 KB of on-chip SRAM for firmware execution and data buffering.

GPIF II provides hardware-configurable, cycle-accurate I/O timing for interfacing with FPGAs, image sensors, and memory devices - supporting asynchronous/synchronous SRAM, slave FIFO, and custom state machines. Dual SDIO 3.0 ports enable concurrent eMMC 4.41 and SD 3.0 (UHS-I) operation with RAID0/RAID1 capability and 2-TB card support.

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.0 spec 1.0 + USB 2.0; includes HS-OTG 2.0 support for dual-role operation
PHY Speed	5 Gbps SuperSpeed with PIPE 3.0 interface - enables direct FPGA or ASIC integration
CPU Core	ARM926EJ-S @ 200 MHz - delivers real-time firmware processing for protocol translation and DMA management
On-Chip Memory	512 KB SRAM - sufficient for dual-buffered video streaming, UAS command queues, and boot code
GPIF II Bus Width	Programmable 8- or 16-bit data bus with up to 16 configurable control signals - supports pixel clock-aligned sensor interfaces
Storage Interface	Dual SDIO 3.0 ports supporting eMMC 4.41 + SD 3.0 UHS-I - enables redundant storage or high-throughput capture buffers
Power Domains	Independent 1.2-V core / 1.8–3.3-V I/O - allows mixed-voltage system integration without level shifters
Low-Power Mode	<60 µA core power-down with VBATT active - suitable for battery-backed surveillance or portable imaging

Pinout & Package

Package: 10-mm × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA) with 121 balls (11×11 array).

Pin/Terminal	Circuit Role	Design Meaning
VBATT	Battery backup supply input	Enables RTC and low-power retention during main power loss; sinks <20 µA in VBATT-off mode
VDD_CORE	Core logic supply	1.2-V regulated input for ARM926EJ-S and internal SRAM - requires local 1-µF ceramic decoupling
VDD_IO	I/O supply voltage	Configurable 1.8–3.3-V rail for UART, SPI, I2S, and GPIF II - sets interface voltage levels dynamically
REFCLK	Reference clock input	Accepts 19.2/26/38.4/52 MHz crystal or oscillator - determines USB link timing and PLL stability
SDIO0/SDIO1	Secure Digital I/O ports	Dual independent SDIO 3.0 interfaces - each supports 4-bit data, CMD, CLK, and CD/WP for hot-plug detection
GPIF_DATA[0:15]	Programmable data bus	16-bit bidirectional data path for custom peripherals - timing fully defined by GPIF II state machine
GPIO[0:15]	General-purpose I/O	Configurable as inputs, outputs, or alternate functions (I2C, UART, PWM) - supports interrupt-on-change

Key Features

Feature	Design Value
Programmable GPIF II	Graphically configurable 100-MHz interface with cycle-accurate timing - eliminates FPGA glue logic for sensor or memory bridging
Dual SDIO 3.0 Ports	Simultaneous eMMC 4.41 and SD 3.0 UHS-I support with built-in RAID0/RAID1 - enables fault-tolerant local storage in embedded recorders
USB Protocol Stack Offload	Firmware-managed UAS, MSC, HID, and Turbo-MTP classes - reduces host CPU load in USB-attached storage and media transfer
ARM926EJ-S + 512 KB SRAM	Self-contained execution environment - runs complex image preprocessing, encryption, or RAID parity calculation without external RAM
Ultra-Low-Power Core Sleep	<60 µA current draw with VBATT enabled - extends battery life in portable medical or surveillance devices during idle periods

Applications

Industrial Camera Interface

USB Disk-on-Module

Use Scenario: High-resolution CMOS image sensor streaming raw Bayer data over USB 3.0 to host PC for real-time analysis.

IC Role / Device Role / Timing Role: USB controller acting as UVC-compliant peripheral with GPIF II synchronized to sensor pixel clock and line sync.

Use Value: Eliminates external FPGA by directly capturing 16-bit parallel sensor output at up to 100 MHz - achieves >300 MB/s sustained throughput.

Use Scenario: Embedded solid-state storage module presenting as a USB 3.0 mass-storage device with RAID1 redundancy across two eMMC chips.

IC Role / Device Role / Timing Role: Host controller managing dual SDIO 3.0 ports, performing real-time RAID1 mirroring, and handling UAS command queuing.

Use Value: Delivers 400+ MB/s sequential read via UAS while maintaining data integrity through hardware-accelerated parity writes.

Surveillance DVR Front-End

Medical Imaging Data Logger

Use Scenario: Multi-channel HD video recorder capturing four 1080p30 streams simultaneously onto local SD cards and streaming one channel over USB to remote monitor.

IC Role / Device Role / Timing Role: USB peripheral + dual SDIO master - handles time-synchronized recording, USB retransmission, and SD hot-swap detection.

Use Value: Uses independent power domains to keep SDIO active during USB suspend - ensures no frame loss during host-initiated power transitions.

Use Scenario: Portable ultrasound device acquiring RF echo data and storing compressed DICOM frames to removable SDXC card while exposing raw data over USB for offline analysis.

IC Role / Device Role / Timing Role: USB 3.0 peripheral with SD 3.0 UHS-I controller and secure boot - manages encrypted DICOM write, USB bulk transfers, and watchdog-triggered safe shutdown.

Use Value: Leverages 512 KB SRAM for double-buffered acquisition - prevents data drop during SD write latency spikes under 2TB card capacity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.0 controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3014-BZXI	Same FX3S architecture but with 256 KB SRAM and no RAID engine; lacks dual SDIO support	Suitable only for single-card storage or simpler USB peripherals without redundancy requirements	Select when cost-sensitive designs omit RAID and require lower memory footprint
CYUSB3314-BZXI	FX3 successor with USB 3.1 Gen 1 (5 Gbps), enhanced GPIF II (120 MHz), and 1 MB SRAM; supports PCIe bridge mode	Targets higher-bandwidth applications like 4K video capture and NVMe-over-USB, not backward-compatible pinout	Choose for next-gen designs requiring PCIe offload or future-proof bandwidth headroom

Compared with CYUSB3033-BZXC, CYUSB3014-BZXI reduces memory and storage capability for cost savings, while CYUSB3314-BZXI upgrades speed and memory but requires PCB redesign - making CYUSB3033-BZXC optimal for balanced performance, RAID support, and BGA footprint continuity.

Availability

CYUSB3033-BZXC is available at Aetrix Electronics and suitable for industrial camera interfaces, USB Disk-on-Module systems, and surveillance DVR front-ends requiring stable component supply, long-term lifecycle assurance, and qualified traceable sourcing.

Supply support for CYUSB3033-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CYUSB3033-BZXC belongs to the EZ-USB™ FX3S product line, designed specifically for embedded USB 3.0 peripheral and OTG applications requiring high-speed data bridging, local storage control, and real-time firmware processing - targeting imaging, storage, and instrumentation systems.

FAQ

What boot options does CYUSB3033-BZXC support?

CYUSB3033-BZXC supports multiple boot sources including internal ROM bootloader, external SPI flash (with configurable address map), I2C EEPROM, and USB host download. Boot mode is selected via GPIO strap pins at reset; the device can also enter USB reenumeration mode for firmware update without external memory.

Does CYUSB3033-BZXC require an external crystal?

Yes - it requires a 19.2-MHz fundamental-mode crystal connected to REFCLK/REFCLK_N pins for USB 3.0 link timing compliance. The crystal must meet ±50 ppm frequency tolerance and support load capacitance of 12 pF; oscillator input is not supported in this variant.

Can GPIF II interface directly with a MIPI CSI-2 receiver?

No - GPIF II is a parallel synchronous/asynchronous interface and does not natively decode MIPI CSI-2 serial lanes. An external serializer/deserializer or FPGA bridge is required to convert MIPI D-PHY signals to parallel format compatible with GPIF II timing.

Is CYUSB3033-BZXC RoHS and REACH compliant?

Yes - CYUSB3033-BZXC is manufactured in accordance with EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Its Pb-free BGA package meets J-STD-020 moisture sensitivity level 3 (MSL3) and is rated for peak reflow temperature of 260°C.

CYUSB3033-BZXC Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB FX3S™

Package/Case:: 121-TFBGA

Packaging:: Bulk

Product Status:: Obsolete

Programmable:: Not Verified

Applications:: USB Host/Peripheral Controller

Core Processor:: ARM9®

Program Memory Type:: External Program Memory

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: GPIF, I2C, I2S, MMC/SD/SDIO, SPI, UART, USB

Number of I/O:: 60

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: 0°C ~ 70°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3033-BZXC FAQ

1.How can I place an order for CYUSB3033-BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3033-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3033-BZXC reliable?

The price and inventory of CYUSB3033-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3033-BZXC is usually 5 days.

3.What payment methods are accepted for CYUSB3033-BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3033-BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3033-BZXC?

CYUSB3033-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3033-BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3033-BZXC?

For technical support, including CYUSB3033-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3033-BZXC requirements.

6.How does Aetrix verify that CYUSB3033-BZXC is sourced from the original manufacturer or authorized distributors?

All CYUSB3033-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3033-BZXC meets industry standards.

7.What is the process for return or replacement of CYUSB3033-BZXC?

All CYUSB3033-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3033-BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3033-BZXC part is unused and in its original packaging.

Return procedure for CYUSB3033-BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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