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Infineon Technologies CYUSB3302-68LTXC
- Part No.:
- CYUSB3302-68LTXC
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CYUSB3302-68LTXC.pdf
- Description:
- IC USB 3.0 HUB 2-PORT 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,332
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Product details
Overview
CYUSB3302-68LTXC from Infineon is a USB 3.2 Gen 1 (5 Gbps) hub controller with two downstream ports, integrated ARM® Cortex®-M0 CPU (16 KB RAM, 32 KB ROM), USB Battery Charging v1.2 compliance, and 68-pin QFN (8 × 8 × 1.0 mm) packaging. It supports shared-link mode for embedded dual-device per port, ghost charging without upstream host connection, and pin-strapped configuration for VID, port count, and power switch control - deployed in docking stations and industrial monitors.
For engineers reviewing the CYUSB3302-68LTXC datasheet, CYUSB3302-68LTXC pinout, CYUSB3302-68LTXC application, or CYUSB3302-68LTXC equivalent, key selection criteria include USB 3.2 Gen 1 dual-port topology, BC v1.2 charging capability per DS port, shared-link flexibility for embedded SS + USB 2.0 co-connection, I2C-based firmware upgrade support, and industrial temperature range (–40°C to +85°C) operation.
Technical Context
The device integrates two independent hub controllers: an SS hub supporting U0–U3 link power states and full-duplex 5 Gbps operation, and a USB 2.0 hub with four transaction translators (one per DS port), L0–L3 power management, and suspend/resume signaling. Its Cortex-M0 subsystem handles runtime configuration, battery charging logic, and vendor-command execution.
Port control includes overcurrent detection, ganged/individual power switching, automatic port numbering, and ACA-Dock mode support for simultaneous charging and data transfer. Configuration is enabled via pin-straps (for VID, port enable, power polarity), eFuse, or I2C EEPROM - eliminating external configuration ICs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Speed Support | 5 Gbps SuperSpeed, 480 Mbps High-Speed, 12 Mbps Full-Speed, 1.5 Mbps Low-Speed on all ports |
| Downstream Ports | 2 × USB 3.2 Gen 1 ports with dedicated SS PHY and USB 2.0 TT per port |
| Battery Charging | Complies with USB BC v1.2; enables DCP emulation (ghost charging) on both DS ports without US host |
| CPU Core | ARM® Cortex®-M0 with 16 KB RAM + 32 KB ROM for real-time configuration and charging control |
| Configuration Interface | I2C slave/master/multi-master; supports EEPROM programming and external ASSP firmware update via USB |
| Operating Temp | Industrial grade: –40°C to +85°C ambient, validated for continuous operation in enclosed systems |
| Package | 68-pin QFN, 8 mm × 8 mm × 1.0 mm, exposed thermal pad for PCB heat dissipation |
Pinout & Package
68-pin QFN (8 × 8 × 1.0 mm) with exposed thermal pad (EPAD); RoHS-compliant, lead-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_33 | I/O Power Supply | 3.3 V supply for USB 2.0 PHY, GPIOs, and I2C interface; decoupling required per datasheet layout guidelines |
| VDDA_12 | Analog Core Supply | 1.2 V analog supply for SS PHY and PLL; low-noise regulation critical for 5 Gbps signal integrity |
| US_DP / US_DM | Upstream Differential Pair | Connects to host controller; requires controlled 90 Ω differential impedance routing |
| DS1_SSTXP/M, DS1_SSRXP/M | Downstream SS Lane | SuperSpeed transmit/receive pair for DS port 1; routed as matched-length differential traces |
| DS1_DP / DS1_DM | Downstream USB 2.0 Pair | High-Speed/Full-Speed differential signals; supports shared-link mode with DS1_SSTXP/M simultaneously active |
| I2C_SDA / I2C_SCL | I2C Interface | Configurable as master or slave; used for EEPROM programming, vendor-command bridge, or external ASSP firmware update |
| GPIO[7:0] | General-Purpose I/O | Programmable for overcurrent detection, LED control, power switch enable, or custom status signaling |
Key Features
| Feature | Design Value |
|---|---|
| Shared Link Mode | Enables concurrent connection of one embedded SuperSpeed device and one removable USB 2.0 device on same DS port - reduces port count needed in space-constrained embedded designs |
| Ghost Charging | Each DS port emulates a Dedicated Charging Port (DCP) when upstream host is absent - delivers up to 1.5 A without host negotiation or enumeration |
| USB-to-I2C Bridge | Vendor-command support allows host PC to access I2C peripherals (e.g., sensors, PMICs) through USB - eliminates need for separate I2C host controller |
| Pin-Strap Configuration | Hardware-selectable VID, port enable, power switch polarity, and BC v1.2 enablement - avoids firmware dependency during boot and simplifies BOM |
| ACA-Dock Support | Enables smartphone/tablet acting as USB host to charge connected devices while maintaining data transfer - compliant with BC v1.2 accessory charger adapter dock specification |
Applications
| Docking Station | Industrial Monitor |
|---|---|
Use Scenario: Adds multiple USB peripherals (keyboard, storage, camera) to a laptop via single USB-C or Type-A upstream connection. IC Role / Device Role / Timing Role: USB 3.2 Gen 1 hub controller managing 5 Gbps SS and 480 Mbps HS traffic across two downstream ports with independent power control. Use Value: Enables compact, fanless dock design with BC v1.2 charging for attached smartphones and tablets - no external charger required. | Use Scenario: Integrates USB peripheral connectivity (touch controller, flash drive, barcode scanner) into panel-mounted displays for factory HMIs. IC Role / Device Role / Timing Role: Embedded hub with shared-link capability - connects internal SSD (SS) and external HID (USB 2.0) on same DS port to conserve board space. Use Value: Reduces connector count and PCB layer count while maintaining industrial temp operation and ESD robustness per IEC 61000-4-2 Level 4. |
| Hand-Held Cradle | Set-Top Box |
Use Scenario: Charges and synchronizes handheld medical or logistics scanners via cradle base with single USB cable to host PC. IC Role / Device Role / Timing Role: Dual-role hub supporting ghost charging (no host present) and high-speed data sync (host present) on same DS port. Use Value: Eliminates separate charging circuitry; maintains USB 2.0 data throughput >40 MB/s during bulk transfers without interrupting charge delivery. | Use Scenario: Adds USB media playback (flash drive, HDD) and peripheral support (IR blaster, gamepad) to consumer STB platforms. IC Role / Device Role / Timing Role: USB 3.2 Gen 1 hub with pin-strapped VID/PID and BC v1.2 compliance - enables plug-and-play recognition on Linux-based STB OS. Use Value: Supports hot-plug detection and suspend/resume within <100 ms, meeting CE/UL Class B EMI requirements for living-room deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB 3.2 Gen 1 hub controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3304-68LTXC | Four downstream ports vs. two; identical core architecture, package, and feature set | Suitable for multi-peripheral hubs requiring ≥3 DS ports; higher pin count and routing complexity | Select when system requires more than two downstream connections without cascading hubs |
| UPD720210K8-711-BAC-A | Renesas USB 3.0 hub; no integrated Cortex-M0 CPU, no ghost charging, no shared-link mode | Lacks embedded firmware control and BC v1.2 DCP emulation - requires external charging IC for wall-adapter-like behavior | Choose only if legacy driver compatibility (WHQL Windows 7/10) is mandatory and charging features are handled externally |
Compared with CYUSB3304-68LTXC and UPD720210K8-711-BAC-A, CYUSB3302-68LTXC uniquely balances minimal footprint (2-port, 68-QFN) with embedded intelligence (Cortex-M0), ghost charging, and shared-link - making it optimal for cost- and space-sensitive embedded USB expansion where host presence cannot be assumed.
Availability
CYUSB3302-68LTXC is available at Aetrix Electronics and suitable for docking stations, industrial monitors, hand-held cradles, and set-top boxes requiring stable component supply, industrial temperature operation, and USB 3.2 Gen 1 dual-port functionality with embedded charging control.
Supply support for CYUSB3302-68LTXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT applications.
CYUSB3302 belongs to the EZ-USB™ HX3 family - designed specifically for embedded USB 3.2 Gen 1 hub applications demanding integrated charging, flexible configuration, and reduced external component count in space-constrained systems.
FAQ
Does CYUSB3302-68LTXC support USB 3.2 Gen 2 (10 Gbps)?
No. CYUSB3302-68LTXC is compliant with USB 3.2 Gen 1 (5 Gbps) and fully backward-compatible with USB 2.0 High-Speed (480 Mbps), Full-Speed (12 Mbps), and Low-Speed (1.5 Mbps). It does not implement the 10 Gbps lane rate or associated encoding scheme defined in USB 3.2 Gen 2 specifications.
Can the integrated Cortex-M0 be used for custom firmware development?
Yes. The ARM® Cortex®-M0 subsystem includes 16 KB RAM and 32 KB ROM, and supports firmware updates via I2C EEPROM or USB-host-initiated vendor commands. Infineon provides Blaster Plus software and SDKs enabling custom GPIO control, charging logic modification, and USB descriptor customization - subject to licensing terms.
What is the maximum current each downstream port can deliver in ghost charging mode?
In ghost charging mode, each downstream port delivers up to 1.5 A at 5 V when no upstream host is connected - compliant with USB Battery Charging v1.2 Dedicated Charging Port (DCP) requirements. This is achieved using internal port controller logic and external power switches controlled by GPIO outputs.
Is the 68-pin QFN package thermally enhanced?
Yes. The 68-pin QFN package includes an exposed thermal pad (EPAD) on the bottom surface, designed for direct soldering to a large copper pour on the PCB. Thermal resistance (θJA) is specified at 32.5°C/W under JEDEC JESD51-7 conditions - requiring minimum 4×4 thermal vias under the EPAD for industrial temperature operation.
CYUSB3302-68LTXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HX3
- Package/Case:
- 68-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- USB 3.0 Hub Controller
- Core Processor:
- ARM® Cortex®-M0
- Program Memory Type:
- ROM (32kB)
- Controller Series:
- CYUSB
- RAM Size:
- 16K x 8
- Interface:
- I2C
- Number of I/O:
- 10
- Voltage - Supply:
- 1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 68-QFN (8x8)
CYUSB3302-68LTXC FAQ
1.How can I place an order for CYUSB3302-68LTXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB3302-68LTXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB3302-68LTXC reliable?
The price and inventory of CYUSB3302-68LTXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3302-68LTXC is usually 5 days.
3.What payment methods are accepted for CYUSB3302-68LTXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3302-68LTXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB3302-68LTXC?
CYUSB3302-68LTXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB3302-68LTXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB3302-68LTXC?
For technical support, including CYUSB3302-68LTXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3302-68LTXC requirements.
6.How does Aetrix verify that CYUSB3302-68LTXC is sourced from the original manufacturer or authorized distributors?
All CYUSB3302-68LTXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3302-68LTXC meets industry standards.
7.What is the process for return or replacement of CYUSB3302-68LTXC?
All CYUSB3302-68LTXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3302-68LTXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB3302-68LTXC part is unused and in its original packaging.
Return procedure for CYUSB3302-68LTXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB3302-68LTXC Tags
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CYPD3175-24LQXQ
Infineon Technologies
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SLB9672VU20FW1523XTMA1
Infineon Technologies
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SLB9670VQ20FW785XTMA1
Infineon Technologies
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SLB9672XU20FW1523XTMA1
Infineon Technologies
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SLB9673XU20FW2613XTMA1
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CYPD3125-40LQXIT
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AT97SC3204-U2A1A-20
Microchip Technology
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AT97SC3204-U2A1A-10
Microchip Technology
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SLM9670AQ20FW1311XTMA1
Infineon Technologies
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SLB9672XU20FW1613XTMA1
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SLB9672AU20FW1613XTMA1
Infineon Technologies
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SLB9673AU20FW2613XTMA1
Infineon Technologies
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