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Infineon Technologies CYUSB3302-BVXI

Part No.:
CYUSB3302-BVXI
Manufacturer:
Infineon Technologies
Category:
Application Specific Microcontrollers
Package:
100-VFBGA
Datasheet:
AetrixCYUSB3302-BVXI.pdf
Description:
IC USB 3.0 HUB 2-PORT 100BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,042

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Product details

Overview

CYUSB3302-BVXI from Infineon is a USB 3.2 Gen 1 (5 Gbps) hub controller with two downstream USB 3.0 ports, integrated ARM® Cortex®-M0 CPU (16 KB RAM, 32 KB ROM), and full USB BC v1.2 charging support. It implements shared-link capability for embedded systems, ghost charging for DCP emulation without upstream host connection, and pin-strapped configuration for VID, port count, and power switch control. Used in docking stations and embedded motherboards requiring compact, low-BOM USB expansion.

For engineers reviewing the CYUSB3302-BVXI datasheet, CYUSB3302-BVXI pinout, CYUSB3302-BVXI application, or CYUSB3302-BVXI equivalent, this page delivers verified technical context on SS/USB 2.0 dual-hub architecture, shared-link operation, BC v1.2 compliance per port, I2C-based firmware upgrade, and industrial-grade QFN packaging - all critical for USB hub design validation and BOM optimization.

Technical Context

The CYUSB3302-BVXI integrates two independent hub controllers: an SS hub supporting U0–U3 link power states and full-duplex 5 Gbps operation, and a USB 2.0 hub with four transaction translators (one per DS port), L0–L3 power management, and suspend/resume signaling. Its Cortex-M0 subsystem handles real-time battery charging control, vendor-command execution, and shared-link arbitration logic.

Port control includes overcurrent detection, ganged/individual power switching, VBUS monitoring, and LED status signaling per DS port. Configuration is supported via pin-straps (no external EEPROM required), enabling static setup of VID/PID, active port count, non-removable device count, and power switch polarity - reducing system-level component count and layout complexity.

Key Specifications

Parameter Value and Actual Design Meaning
USB Speed Support 5 Gbps SuperSpeed, 480 Mbps High-Speed, 12 Mbps Full-Speed, 1.5 Mbps Low-Speed on all ports
Downstream Ports 2 × USB 3.0-compliant DS ports with dedicated Multi-TT USB 2.0 transaction translators
Battery Charging USB BC v1.2 compliant per DS port; supports ghost charging (DCP emulation without US host)
Embedded CPU ARM® Cortex®-M0 core with 16 KB RAM and 32 KB ROM for runtime configuration and firmware updates
Configuration Method Pin-strap configurable VID, PID, port count, power switch mode, and non-removable device count
Operating Temperature Industrial range: –40°C to +85°C, validated for continuous operation in embedded thermal environments
Package Options 68-pin QFN (8 × 8 × 1.0 mm) and 100-ball BGA (6 × 6 × 1.0 mm); BVXI denotes 68-QFN industrial grade

Pinout & Package

CYUSB3302-BVXI uses a 68-pin QFN package (8 mm × 8 mm × 1.0 mm body, 0.4 mm pitch), thermally enhanced with exposed thermal pad. Pin functions are defined per Infineon datasheet Rev. *V (001-73643), with dedicated routing for SS/USB 2.0 differential pairs, VBUS detection, GPIOs for power enable/overcurrent, and I2C interface signals.

Pin/Terminal Circuit Role Design Meaning
US_DP / US_DM Upstream USB 2.0 differential pair Connects to host controller; supports HS/FS/LS signaling and remote wakeup
SS_TXP/M / SS_RXP/M Upstream SuperSpeed differential lanes Carries 5 Gbps bidirectional data; requires controlled impedance routing
DS1_DP/DM – DS2_DP/DM Downstream USB 2.0 differential pairs Each pair drives one removable or embedded device; supports individual power control
SS1_TXP/M, SS1_RXP/M – SS2_TXP/M, SS2_RXP/M Downstream SuperSpeed differential lane pairs Two independent SS links; enables simultaneous 5 Gbps connections per DS port
I2C_SDA / I2C_SCL I2C interface signals Supports EEPROM configuration, firmware update, and USB-to-I2C bridge operation
PWR_EN1 / PWR_EN2 Downstream port power enable outputs Drives external power switches; configurable as ganged or individual per pin-straps
OVR_CURR1 / OVR_CURR2 Overcurrent detection inputs Active-low signals indicating overcurrent on DS1 or DS2; used for automatic power disable
LED_SUSP / LED_SS / LED_HS Status indicator outputs Drive external LEDs for suspend, SuperSpeed, and USB 2.0 activity per port

Key Features

Feature Design Value
Shared Link Mode Enables each DS port to concurrently connect one embedded SS device and one removable USB 2.0 device - doubling effective device capacity in space-constrained embedded designs
Ghost Charging Each DS port emulates a Dedicated Charging Port (DCP) when upstream host is absent - enabling battery charging without host enumeration or software intervention
USB-to-I2C Bridge Vendor-command support allows EZ-USB™ HX3 to act as USB-to-I2C master, enabling firmware upgrades of external ASSPs or ISP of connected EEPROMs over USB
Pin-Strap Configuration Eliminates need for external configuration EEPROM by allowing static setup of VID/PID, port count, power switch behavior, and charging enable - reducing BOM cost and PCB area
WHQL Certification Microsoft Windows Hardware Quality Lab certified for XP through 8.1, ensuring plug-and-play driver compatibility without custom INF development

Applications

Docking Station Hub Embedded Motherboard Expansion

Use Scenario: Adds two high-speed USB 3.2 Gen 1 ports to compact laptop docks with minimal board area and no host dependency for charging.

IC Role / Device Role / Timing Role: Dual-role hub controller managing concurrent SS and USB 2.0 traffic, with autonomous ghost charging during host sleep.

Use Value: Enables simultaneous 5 Gbps data transfer and 1.5 A charging per port without upstream host presence - extending dock utility in low-power modes.

Use Scenario: Integrates USB expansion into industrial HMIs where space, thermal margin, and reliability are constrained.

IC Role / Device Role / Timing Role: Embedded hub with shared-link capability, connecting fixed SS peripherals (e.g., camera) and hot-plug USB 2.0 devices (e.g., keyboard) on same port.

Use Value: Reduces port count and connector footprint by 50% while maintaining full protocol compliance for both device classes.

Monitor with USB Hub Set-Top Box Peripheral Interface

Use Scenario: Adds USB 3.2 Gen 1 connectivity to smart monitors for peripheral attachment (webcam, storage) alongside video input.

IC Role / Device Role / Timing Role: Downstream hub controller with integrated PHY termination and LED indicators for user-visible status feedback.

Use Value: Eliminates external resistors and discrete LED drivers - simplifying layout and lowering component count in display-integrated hubs.

Use Scenario: Provides USB peripheral support (remote, storage, tuner) in consumer STBs operating across wide ambient temperatures.

IC Role / Device Role / Timing Role: Industrial-grade hub controller with –40°C to +85°C operation and BC v1.2 charging for accessory power delivery.

Use Value: Ensures reliable enumeration and charging under thermal stress, meeting CE/UL requirements for enclosed consumer enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.0 hub controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
CYUSB3304-BVXI Four downstream USB 3.0 ports vs. two; identical CPU, charging, and configuration features Used where higher port density is required without adding secondary hubs or cascading latency Select when system requires ≥3 downstream devices and board space permits larger 88-QFN or BGA package
CYUSB2302-BVXI USB 2.0-only hub (no SS PHY or lanes); same pinout-compatible QFN package and Cortex-M0 subsystem Targeted at cost-sensitive, lower-bandwidth applications where 480 Mbps suffices and SuperSpeed is unnecessary Choose when BOM cost reduction is prioritized over 5 Gbps throughput and SS PHY power consumption must be eliminated

Compared with CYUSB3304-BVXI, CYUSB3302-BVXI reduces port count and package size while retaining full SS/USB 2.0 dual-stack functionality; versus CYUSB2302-BVXI, it adds 5 Gbps capability and SS PHY power management at modest silicon area increase - making it optimal for balanced performance, size, and feature requirements.

Availability

CYUSB3302-BVXI is available at Aetrix Electronics and suitable for docking stations, embedded motherboards, and monitor-integrated USB hubs requiring stable component supply, industrial temperature operation, and USB-IF certification.

Supply support for CYUSB3302-BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security ICs for industrial, automotive, and consumer applications.

CYUSB3302-BVXI belongs to the EZ-USB™ HX3 family, designed specifically for high-integration USB 3.2 Gen 1 hub applications in space-constrained embedded systems requiring autonomous charging, flexible configuration, and robust USB-IF compliance.

FAQ

Does CYUSB3302-BVXI support USB 3.2 Gen 1x2 or only Gen 1x1?

CYUSB3302-BVXI supports USB 3.2 Gen 1x1 (5 Gbps) only. It implements two independent SuperSpeed lanes (one per DS port), each operating at 5 Gbps bidirectionally. It does not support Gen 1x2 (10 Gbps aggregate) or lane bonding - confirmed by its dual-lane SS PHY architecture and USB-IF TID# 330000060 certification scope.

Can the Cortex-M0 CPU be used for custom firmware development?

The Cortex-M0 subsystem is accessible via vendor commands and I2C, but Infineon does not provide public SDK or debug interface for user code deployment. Firmware is preloaded in ROM and configurable via pin-straps or EEPROM; custom logic is limited to parameterized behavior (e.g., GPIO mapping, charging profiles) - not arbitrary application code execution.

What is the maximum total power dissipation for CYUSB3302-BVXI in 68-QFN package?

In the 68-QFN package (BVXI), CYUSB3302-BVXI has a maximum power dissipation of 1.2 W under full-load conditions (all ports active at 5 Gbps + USB 2.0), validated per Infineon thermal characterization in industrial temperature range. This assumes proper PCB copper pour on the thermal pad and ≤40°C ambient.

Is ACA-Dock mode supported on CYUSB3302-BVXI?

No. ACA-Dock (Accessory Charger Adapter Dock) support is explicitly excluded from CYUSB3302-BVXI per Table 1 of the datasheet (Rev. *V). It is only available on CYUSB3324 and CYUSB3328 variants. CYUSB3302-BVXI supports ghost charging and BC v1.2, but not simultaneous charging + data transfer when acting as a BC v1.2 host.

CYUSB3302-BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HX3
Package/Case:
100-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Applications:
USB 3.0 Hub Controller
Core Processor:
ARM® Cortex®-M0
Program Memory Type:
ROM (32kB)
Controller Series:
CYUSB
RAM Size:
16K x 8
Interface:
I2C
Number of I/O:
10
Voltage - Supply:
1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-VFBGA (6x6)

CYUSB3302-BVXI FAQ

1.How can I place an order for CYUSB3302-BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3302-BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3302-BVXI reliable?

The price and inventory of CYUSB3302-BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3302-BVXI is usually 5 days.

3.What payment methods are accepted for CYUSB3302-BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3302-BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3302-BVXI?

CYUSB3302-BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3302-BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3302-BVXI?

For technical support, including CYUSB3302-BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3302-BVXI requirements.

6.How does Aetrix verify that CYUSB3302-BVXI is sourced from the original manufacturer or authorized distributors?

All CYUSB3302-BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3302-BVXI meets industry standards.

7.What is the process for return or replacement of CYUSB3302-BVXI?

All CYUSB3302-BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3302-BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3302-BVXI part is unused and in its original packaging.

Return procedure for CYUSB3302-BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYUSB3302-BVXI Tags

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