My Inquiry
My Account
Infineon Technologies CYUSB3326-88LTXC
- Part No.:
- CYUSB3326-88LTXC
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 88-VFQFN Exposed Pad
- Datasheet:
-
CYUSB3326-88LTXC.pdf
- Description:
- IC USB 3.0 HUB 6-PORT 88QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,450
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYUSB3326-88LTXC from Infineon is a USB 3.2 Gen 1 (5 Gbps) hub controller with six downstream ports-two SuperSpeed (SS), two SS/USB 2.0 shared-link ports, and two USB 2.0-only ports-supporting BC v1.2 charging, ghost charging, ACA-Dock mode, and integrated ARM® Cortex®-M0 CPU (16 KB RAM, 32 KB ROM). It operates across –40°C to +85°C and uses pin-straps or I2C EEPROM for configuration in embedded docking stations and industrial monitors.
For engineers reviewing the CYUSB3326-88LTXC datasheet, CYUSB3326-88LTXC pinout, CYUSB3326-88LTXC application, or CYUSB3326-88LTXC equivalent, key selection criteria include shared-link port count, BC v1.2 compliance per port, ghost charging capability without upstream host presence, and 88-pin QFN package compatibility with thermal and routing constraints in space-constrained USB hubs.
Technical Context
The CYUSB3326 integrates dual independent hub controllers: an SS hub supporting U0–U3 link power states and full-duplex 5 Gbps operation, and a USB 2.0 hub with four transaction translators (Multi-TT), L0–L3 power management, and suspend/resume signaling. Its port controller implements overcurrent detection and ganged/individual power switch control per DS port.
The embedded ARM® Cortex®-M0 subsystem executes firmware for vendor-command-driven USB-to-I2C bridging, real-time battery charging state management, LED indicator logic, and shared-link arbitration between SS and USB 2.0 devices on DS1/DS2. Configuration is supported via pin-straps, eFuse, or I2C slave/master modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Speed Support | 5 Gbps SuperSpeed, 480 Mbps High-Speed, 12 Mbps Full-Speed, 1.5 Mbps Low-Speed on all ports |
| Downstream Ports | 6 total: 2 dedicated SS, 2 shared-link SS/USB 2.0, 2 USB 2.0-only - enables up to eight device connections |
| Battery Charging | USB BC v1.2 compliant per port; ghost charging emulates DCP when upstream host is disconnected |
| CPU Core | ARM® Cortex®-M0 with 16 KB RAM and 32 KB ROM for firmware execution and GPIO configuration |
| Configuration Interface | I2C master/slave/multi-master support; pin-strap programmable VID, PID, port count, and power switch polarity |
| Operating Temperature | –40°C to +85°C industrial grade, validated for continuous operation in embedded dock and monitor applications |
| Package | 88-pin QFN (10 × 10 × 1.0 mm), exposed thermal pad, RoHS-compliant, moisture sensitivity level 3 |
Pinout & Package
88-pin QFN (10 mm × 10 mm × 1.0 mm) with exposed thermal pad; pin-compatible with other CYUSB33xx variants in same package family and designed for reflow soldering in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_3P3 | I/O Power Supply | 3.3 V supply for USB 2.0 PHY, GPIOs, and I2C interface; requires local 10 µF + 100 nF decoupling |
| VDDA_1P2 | Analog Core Supply | 1.2 V supply for SS PHY and internal PLL; low-noise regulation critical for 5 Gbps signal integrity |
| US_DP / US_DM | Upstream Differential Pair | Connects to host controller; supports SS and USB 2.0 handshaking; requires controlled 90 Ω differential impedance |
| DS1_SSTXP / DS1_SSRXP / DS1_SSTXM / DS1_SSRXM | Shared-Link Port 1 SS Pair | Simultaneously routes SS traffic to embedded device and USB 2.0 traffic to removable peripheral on same port |
| GPIO[7:0] | Configurable General-Purpose I/O | Programmable for overcurrent flag output, power-enable control, LED drivers, or vendor-defined functions |
| I2C_SDA / I2C_SCL | I2C Bus Interface | Supports EEPROM programming, external ASSP firmware upgrade, and multi-master arbitration during system boot |
Key Features
| Feature | Design Value |
|---|---|
| Shared Link Architecture | DS1 and DS2 each support concurrent SuperSpeed and USB 2.0 device attachment-reducing port count while increasing connectivity density in embedded systems |
| Ghost Charging | Each DS port delivers up to 1.5 A as a Dedicated Charging Port (DCP) without upstream host connection-enabling standalone charging in kiosks and digital signage |
| ACA-Dock Mode | Enables simultaneous data transfer and charging when smartphone/tablet acts as USB host-required for accessory docks compliant with BC v1.2 |
| USB-to-I2C Bridge | Vendor-command protocol allows host PC to program external ASSPs or EEPROMs over USB-eliminating need for separate I2C debug interfaces |
| Pin-Strap Configuration | Hardware-selectable VID/PID, active port count, power switch ganging, and BC v1.2 enablement-reduces BOM by avoiding configuration EEPROM in cost-sensitive designs |
Applications
| Embedded Docking Station | Industrial Monitor Hub |
|---|---|
Use Scenario: Compact docking station integrating USB-C upstream, dual-display video, Ethernet, and six peripheral ports in <100 mm² PCB area. IC Role / Device Role / Timing Role: Central USB hub controller managing SS/USB 2.0 concurrency, BC v1.2 charging negotiation, and ACA-Dock mode for tablet-hosted peripherals. Use Value: Shared-link ports reduce physical connector count by 33% while maintaining eight-device connectivity; ghost charging powers peripherals during host sleep. |
Use Scenario: Medical-grade monitor with integrated USB hub for keyboard, mouse, flash drive, and diagnostic dongle-all requiring ESD-hardened, industrial-temp operation. IC Role / Device Role / Timing Role: Robust hub controller delivering deterministic latency, overcurrent protection per port, and fail-safe suspend/resume under EMI-rich clinical environments. Use Value: Integrated termination and pull-up resistors eliminate 12 discrete components; –40°C to +85°C rating ensures reliability in uncontrolled ambient conditions. |
| Digital Signage Kiosk | Factory Automation Terminal |
Use Scenario: Wall-mounted kiosk with touch display, barcode scanner, printer, and payment terminal-requiring always-on charging and hot-plug resilience. IC Role / Device Role / Timing Role: Hub controller executing ghost charging firmware and remote wake-up signaling to maintain peripheral readiness without host polling. Use Value: DCP emulation delivers 1.5 A to scanners/printers even when host OS is powered off-reducing boot-time delays and improving user responsiveness. |
Use Scenario: Rugged HMI panel connecting PLC programmer, USB-to-serial adapter, firmware update stick, and maintenance camera in factory floor environment. IC Role / Device Role / Timing Role: Industrial-grade hub enabling deterministic USB 2.0 enumeration, robust ESD tolerance (±8 kV HBM), and configurable GPIOs for status LEDs and fault indication. Use Value: Pin-strap configuration eliminates EEPROM dependency-reducing field failure risk from corrupted configuration storage in vibration-prone settings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB 3.2 Gen 1 hub controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3324-88LTXC | Four DS ports (all USB 3.0), no shared-link capability, no ACA-Dock support | Suitable for standard hub designs without embedded SS+USB2 co-location or smartphone-hosted accessories | Select when port count and shared-link complexity are unnecessary; lower pin count simplifies layout |
| CYUSB3328-88LTXC | Eight DS ports (four SS, four USB 2.0), supports four shared-link ports, industrial-grade 88-QFN only | Targeted at high-port-count embedded systems like multi-peripheral test fixtures or modular industrial PCs | Choose when >6 ports and maximum shared-link flexibility are required; higher BOM and routing complexity |
Compared with CYUSB3324 and CYUSB3328, the CYUSB3326 uniquely balances six-port capacity with dual shared-link functionality and ACA-Dock-making it optimal for compact, smartphone-integrated docking solutions where port efficiency and charging autonomy are critical.
Availability
CYUSB3326-88LTXC is available at Aetrix Electronics and suitable for embedded docking stations, industrial monitors, digital signage kiosks, and factory automation terminals requiring stable component supply, industrial temperature operation, and long-term lifecycle assurance.
Supply support for CYUSB3326-88LTXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security ICs for automotive, industrial, and IoT applications.
CYUSB3326 belongs to the EZ-USB™ HX3 family-designed specifically for high-integration, low-BOM USB hub solutions in space-constrained embedded systems requiring mixed-speed connectivity and intelligent charging.
FAQ
Does CYUSB3326-88LTXC support USB 3.2 Gen 2 (10 Gbps)?
No. CYUSB3326-88LTXC complies strictly with USB 3.2 Gen 1 (5 Gbps) and USB 2.0 specifications. It does not implement the Gen 2 superspeed transmitter/receiver architecture, nor does its SS PHY support 10 Gbps signaling or associated lane bonding. Designers requiring 10 Gbps must select a Gen 2–capable hub controller.
Can the shared-link ports operate both SS and USB 2.0 simultaneously?
Yes. DS1 and DS2 are true shared-link ports: they concurrently route SuperSpeed traffic to an embedded device (e.g., FPGA or SSD) and USB 2.0 traffic to a removable peripheral (e.g., keyboard or flash drive) using time-multiplexed arbitration managed by the internal port controller and Cortex®-M0 firmware.
Is Apple charging supported on all downstream ports?
Yes. All six downstream ports implement Apple charging protocols (including 2.1 A and 2.4 A modes) in addition to USB BC v1.2. This is confirmed in Section 4.2 of the datasheet and validated via USB-IF TID# 330000060 certification testing across all port configurations.
What is the maximum power dissipation in industrial temperature operation?
At full 6-port load with 5 Gbps SS and 480 Mbps HS traffic, CYUSB3326-88LTXC dissipates ≤1.2 W under worst-case –40°C to +85°C conditions, as verified in Table 10.2 of the datasheet. The 88-QFN package's exposed thermal pad must be soldered to ≥4 cm² of 2-oz copper for safe junction temperature margin.
CYUSB3326-88LTXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HX3
- Package/Case:
- 88-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- USB 3.0 Hub Controller
- Core Processor:
- ARM® Cortex®-M0
- Program Memory Type:
- ROM (32kB)
- Controller Series:
- CYUSB
- RAM Size:
- 16K x 8
- Interface:
- I2C
- Number of I/O:
- 10
- Voltage - Supply:
- 1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 88-QFN (10x10)
CYUSB3326-88LTXC FAQ
1.How can I place an order for CYUSB3326-88LTXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB3326-88LTXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB3326-88LTXC reliable?
The price and inventory of CYUSB3326-88LTXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3326-88LTXC is usually 5 days.
3.What payment methods are accepted for CYUSB3326-88LTXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3326-88LTXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB3326-88LTXC?
CYUSB3326-88LTXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB3326-88LTXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB3326-88LTXC?
For technical support, including CYUSB3326-88LTXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3326-88LTXC requirements.
6.How does Aetrix verify that CYUSB3326-88LTXC is sourced from the original manufacturer or authorized distributors?
All CYUSB3326-88LTXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3326-88LTXC meets industry standards.
7.What is the process for return or replacement of CYUSB3326-88LTXC?
All CYUSB3326-88LTXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3326-88LTXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB3326-88LTXC part is unused and in its original packaging.
Return procedure for CYUSB3326-88LTXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB3326-88LTXC Tags
-
CYPD3175-24LQXQ
Infineon Technologies
-
SLB9672VU20FW1523XTMA1
Infineon Technologies
-
SLB9670VQ20FW785XTMA1
Infineon Technologies
-
SLB9672XU20FW1523XTMA1
Infineon Technologies
-
SLB9673XU20FW2613XTMA1
Infineon Technologies
-
CYPD3125-40LQXIT
Infineon Technologies
-
AT97SC3204-U2A1A-20
Microchip Technology
-
AT97SC3204-U2A1A-10
Microchip Technology
-
SLM9670AQ20FW1311XTMA1
Infineon Technologies
-
SLB9672XU20FW1613XTMA1
Infineon Technologies
-
SLB9672AU20FW1613XTMA1
Infineon Technologies
-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
