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Vishay Siliconix DG2737DN-T1-E4
- Part No.:
- DG2737DN-T1-E4
- Manufacturer:
- Vishay Siliconix
- Package:
- 8-UFQFN
- Datasheet:
-
DG2737DN-T1-E4.pdf
- Description:
- IC SWITCH SPDT X 1 8OHM 8MINIQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,640
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Product details
Overview
DG2737DN-T1-E4 from Vishay Siliconix is a dual single-pole single-throw (SPST) analog switch in miniQFN-8 package, designed for bidirectional signal routing in low-voltage portable systems. It delivers 6 Ω typical on-resistance at 3 V supply, 720 MHz -3 dB bandwidth, and operates across 2.3 V to 4.3 V. It is used in high-speed audio routing and RF front-end switching where low distortion and minimal charge injection are critical.
For engineers reviewing the DG2737DN-T1-E4 datasheet, DG2737DN-T1-E4 pinout, DG2737DN-T1-E4 application, or DG2737DN-T1-E4 equivalent, key selection criteria include on-resistance flatness (±4 Ω), crosstalk (-48 dB at 240 MHz), break-before-make timing (6 ns), latch-up immunity (>300 mA), and ESD robustness (5 kV HBM).
Technical Context
The DG2737DN-T1-E4 implements a dual SPST topology with independent channel control via a single logic input (VIN), enabling simultaneous ON/OFF switching of both paths. Its sub-micron CMOS process ensures low RON variation over voltage and temperature, with RON flatness of 4 Ω max across 0–3 V analog swing.
It supports rail-to-rail analog signals up to V+, features 8.3 pF input capacitance and 3.8 pF drain-off capacitance, and achieves 23 ns turn-on/13 ns turn-off times under 50 Ω/35 pF load conditions - optimized for high-fidelity signal integrity in space-constrained battery-powered designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-resistance (RON) | 6 Ω typ. at 3 V - enables low insertion loss & minimal signal attenuation in audio/RF paths |
| -3 dB bandwidth | 720 MHz - supports high-speed video, USB 2.0, and wideband IF signal routing |
| Crosstalk | -48 dB at 240 MHz - prevents inter-channel interference in multi-signal routing applications |
| Charge injection | 10.4 pC - minimizes glitch-induced DC offset in precision sampling and ADC front-ends |
| Supply voltage range | 2.3 V to 4.3 V - compatible with single-cell Li-ion and 3.3 V logic rails without level shifting |
| ESD rating | 5 kV HBM - ensures robust handling during board assembly and end-user operation |
| Latch-up immunity | >300 mA per JESD78 - guarantees fault tolerance under transient overcurrent events |
Pinout & Package
The DG2737DN-T1-E4 is housed in a 1.4 mm × 1.4 mm × 0.55 mm miniQFN-8L package with wettable flank leads for automated optical inspection (AOI). Thermal pad (Pin 5) must be soldered to PCB ground plane for optimal power dissipation and EMI performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | VIN | Logic control input - active-high enables both switches; referenced to GND |
| 2 | GND | Ground reference - connects to system ground plane and thermal pad |
| 3 | S1 | Source terminal of Channel 1 - bidirectional analog path input/output |
| 4 | S2 | Source terminal of Channel 2 - independent bidirectional analog path |
| 5 | Thermal Pad | Exposed die attach pad - must be soldered to PCB ground for thermal and EMI control |
| 6 | V+ | Positive supply - powers internal switch circuitry; decoupling capacitor required |
| 7 | D1 | Drain terminal of Channel 1 - connects to load or downstream signal node |
| 8 | D2 | Drain terminal of Channel 2 - isolated path for second analog signal |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports signals from GND to V+ without clipping - eliminates need for external biasing in single-supply systems |
| Ultra-low RON flatness | 4 Ω max variation over full analog range - preserves amplitude linearity in precision instrumentation |
| Break-before-make timing | 6 ns typical - prevents momentary short-circuit between channels during state transition |
| Miniature footprint | 1.4 mm × 1.4 mm area - saves >60% board space vs. comparable SOIC-8 or TSSOP-8 switches |
| Low dynamic power | 1.0 µA max supply current - extends battery life in always-on portable audio and sensor interfaces |
Applications
| Smartphone Audio Routing | Portable Medical Sensor Interface |
|---|---|
Use Scenario: Dynamically reconfiguring microphone and speaker paths between headset, earpiece, and loudspeaker in compact smartphones. IC Role / Device Role / Timing Role: Dual SPST analog switch managing concurrent audio signal paths with zero-crossing switching to avoid pop/click artifacts. Use Value: 6 Ω RON and 10.4 pC charge injection ensure <0.05% THD+N and <10 µV switching glitch in 24-bit audio chains. | Use Scenario: Multiplexing analog outputs from multiple biopotential sensors (ECG, EMG) into a shared ADC input in handheld diagnostic devices. IC Role / Device Role / Timing Role: Low-leakage (<100 nA off-state) analog switch isolating sensor nodes during sequential sampling to prevent cross-talk and baseline drift. Use Value: -79 dB off-isolation at 1 MHz and ±100 nA leakage over -40°C to +85°C maintain µV-level signal fidelity across temperature. |
| USB 2.0 Data Line Switching | RF Front-End Antenna Tuning |
Use Scenario: Enabling host/device role swapping in OTG-capable portable devices by rerouting D+/D- lines between controller and connector. IC Role / Device Role / Timing Role: High-bandwidth analog switch preserving signal integrity up to 480 Mbps with minimal rise-time degradation. Use Value: 720 MHz -3 dB bandwidth and 25 ps channel skew ensure <5% eye diagram closure at full USB 2.0 data rate. | Use Scenario: Reconfiguring antenna matching networks in LTE/Wi-Fi modules by switching between discrete capacitors/inductors in real time. IC Role / Device Role / Timing Role: Low-RON, high-isolation switch inserted in RF signal path to enable dynamic impedance tuning without insertion loss penalty. Use Value: 6 Ω RON adds <0.25 dB loss at 2.4 GHz; -48 dB crosstalk prevents coupling between adjacent tuning branches. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual SPST analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMUX1574RSVR | Higher RON (8.5 Ω typ.), wider supply (1.08–4.5 V), no integrated ESD diodes | Requires external ESD protection; better suited for ultra-low-voltage (1.2 V logic) systems | Select when operating below 2.3 V or needing lower quiescent current (0.1 µA) |
| ADG723BRMZ-REEL | Higher RON (4.5 Ω typ. at 3 V but degrades faster with voltage), larger MSOP-8 package (3 × 3 mm) | Less suitable for space-constrained portable designs; higher thermal resistance limits peak current handling | Select when legacy MSOP footprint compatibility is required and board area is not constrained |
Compared with TMUX1574RSVR and ADG723BRMZ-REEL, the DG2737DN-T1-E4 offers superior high-frequency performance (720 MHz vs. ≤500 MHz), smaller footprint (1.4 mm² vs. ≥9 mm²), and built-in 5 kV HBM ESD protection - making it optimal for next-generation compact wireless and audio SoC interfaces.
Availability
DG2737DN-T1-E4 is available at Aetrix Electronics and suitable for smartphone audio routing, portable medical sensor multiplexing, USB 2.0 OTG switching, and RF antenna tuning applications requiring stable component supply and long-term manufacturability.
Supply support for DG2737DN-T1-E4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-performance MOSFETs, diodes, optoelectronics, and analog switches.
The DG2737DN-T1-E4 belongs to Vishay's low-voltage analog switch product line, engineered specifically for space- and power-constrained portable electronics where signal fidelity, size, and reliability are non-negotiable.
FAQ
What is the maximum analog signal voltage supported by the DG2737DN-T1-E4?
The DG2737DN-T1-E4 supports analog signals from GND to V+, with absolute maximum ratings allowing VIN, D, or S terminals to reach up to (V+ + 0.3 V) due to internal clamping diodes. At V+ = 3 V, this permits rail-to-rail analog swings up to 3.3 V, provided forward diode current remains within rated limits. This capability eliminates external level-shifting circuitry in single-supply systems.
Does the DG2737DN-T1-E4 require external pull-up or pull-down resistors on the VIN pin?
No, the DG2737DN-T1-E4 does not require external pull-up or pull-down resistors on the VIN pin. Its input structure accepts logic levels directly: VINH ≥ 1.3 V (min) and VINL ≤ 0.5 V (max) across the full -40°C to +85°C range. Input current remains within ±1 µA, enabling direct interface with CMOS logic outputs without loading concerns.
How does the DG2737DN-T1-E4 handle simultaneous switching of both channels?
The DG2737DN-T1-E4 uses a single VIN control input to switch both SPST channels synchronously - ensuring matched timing with 25 ps channel-to-channel skew and 6 ns break-before-make delay. This eliminates risk of momentary shorts or signal contention during transitions, which is critical in audio routing and multiplexer applications where channel coherency matters.
Can the DG2737DN-T1-E4 be used in automotive applications?
The DG2737DN-T1-E4 is specified for -40°C to +85°C operation and RoHS-compliant, but it is not AEC-Q200 qualified. While its electrical specs meet many infotainment and body-control requirements, Vishay does not certify it for automotive safety-critical or engine-bay environments. For automotive use, consult Vishay's AEC-Q200-qualified analog switch portfolio or perform full qualification per your system requirements.
What is the recommended PCB layout practice for the thermal pad of the DG2737DN-T1-E4?
The exposed thermal pad (Pin 5) of the DG2737DN-T1-E4 must be soldered to a solid copper ground plane using a minimum of 6 × 6 array of 0.4 mm diameter thermal vias spaced at 0.8 mm pitch. Per Vishay's recommended pad pattern, the land pattern should be 1.7 mm × 1.7 mm with 0.25 mm solder mask opening. This ensures adequate thermal dissipation (derating starts above 70°C) and reduces ground bounce in high-speed switching.
DG2737DN-T1-E4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Circuit:
- SPDT
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Number of Circuits:
- 1
- On-State Resistance (Max):
- 8Ohm
- Channel-to-Channel Matching (ΔRon):
- 100mOhm
- Voltage - Supply, Single (V+):
- 2.3V ~ 4.3V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 60ns, 50ns
- -3db Bandwidth:
- 720MHz
- Charge Injection:
- 10.4pC
- Channel Capacitance (CS(off), CD(off)):
- 4.4pF, 3.8pF
- Current - Leakage (IS(off)) (Max):
- 10nA
- Crosstalk:
- -109dB @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-miniQFN (1.4x1.4)
DG2737DN-T1-E4 FAQ
1.How can I place an order for DG2737DN-T1-E4 through Aetrix?
Please submit a Request for Quotation (RFQ) for DG2737DN-T1-E4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DG2737DN-T1-E4 reliable?
The price and inventory of DG2737DN-T1-E4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DG2737DN-T1-E4 is usually 5 days.
3.What payment methods are accepted for DG2737DN-T1-E4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DG2737DN-T1-E4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DG2737DN-T1-E4?
DG2737DN-T1-E4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DG2737DN-T1-E4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DG2737DN-T1-E4?
For technical support, including DG2737DN-T1-E4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DG2737DN-T1-E4 requirements.
6.How does Aetrix verify that DG2737DN-T1-E4 is sourced from the original manufacturer or authorized distributors?
All DG2737DN-T1-E4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DG2737DN-T1-E4 meets industry standards.
7.What is the process for return or replacement of DG2737DN-T1-E4?
All DG2737DN-T1-E4 units undergo pre-shipment inspection (PSI). If there is an issue with DG2737DN-T1-E4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DG2737DN-T1-E4 part is unused and in its original packaging.
Return procedure for DG2737DN-T1-E4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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