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Vishay Siliconix DG3003DB-T1-E1
- Part No.:
- DG3003DB-T1-E1
- Manufacturer:
- Vishay Siliconix
- Package:
- 6-WFBGA
- Datasheet:
-
DG3003DB-T1-E1.pdf
- Description:
- IC SW SPDTX1 700MOHM 6MICRO FOOT
- Quantity:
- Payment:
- Shipping:
Inventory:4,752
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Product details
Overview
DG3003DB-T1-E1 from Vishay Siliconix is a low-voltage, sub-Ω SPDT analog switch in MICRO FOOT® chip-scale package (1 mm × 1.5 mm, 6-bump), operating from 1.8 V to 5.5 V with 0.4 Ω typical on-resistance, 47 ns turn-on time, and ±250 mA continuous current handling-designed for signal routing in portable battery-powered systems such as cellular handsets and PDAs.
For engineers reviewing the DG3003DB-T1-E1 datasheet, DG3003DB-T1-E1 pinout, DG3003DB-T1-E1 application, or DG3003DB-T1-E1 equivalent, key selection criteria include its SPDT configuration, ultra-low RON, fast switching, TTL/CMOS-compatible control, and Pb-free Sn/Ag/Cu bump termination optimized for space-constrained PCB layouts.
Technical Context
The DG3003DB-T1-E1 implements a monolithic CMOS SPDT switch architecture built on Vishay's low-voltage JI2 process with epitaxial latchup protection. It supports bidirectional analog conduction when ON and blocks signals up to the supply rail when OFF.
Its digital control interface accepts standard TTL/CMOS logic levels (VINH ≥ 2 V, VINL ≤ 0.4 V) across –40 °C to +85 °C, while dynamic performance includes 40 ns tOFF, 1 ns break-before-make interval, and 64 pC charge injection-enabling precision signal switching without distortion in audio and data paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Switch Type | SPDT (single-pole double-throw) with NO, NC, and common COM terminals |
| On-Resistance | 0.4 Ω typical at V+ = 2.7 V, VCOM = 1.5 V - enables minimal signal attenuation in low-voltage analog paths |
| Supply Range | 1.8 V to 5.5 V - compatible with Li-ion battery, 3.3 V, and 5 V logic domains |
| Switching Speed | tON = 47 ns, tOFF = 40 ns - supports high-speed multiplexing in portable comms interfaces |
| Charge Injection | 64 pC - limits voltage glitch on sampled nodes in ADC front-ends and audio codecs |
| Off-Isolation | –70 dB at 100 kHz - ensures signal integrity between channels in multi-path systems |
| Package | MICRO FOOT® 6-bump (3 × 2 array, 0.5 mm pitch, Sn/Ag/Cu bumps) - 1.0 mm × 1.5 mm footprint for ultra-dense layout |
Pinout & Package
MICRO FOOT® 6-bump wafer-level chip-scale package (WLCSP) with non-solder-mask-defined (NSMD) copper pads, laser-marked die back, and Pb-free Sn/Ag/Cu terminations. Dimensions: D = 1.49–1.515 mm, E = 0.99–1.015 mm, bump height = 238 µm nominal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Ground (GND) | Reference return path for analog and digital circuitry; must be low-impedance connection |
| A2 | Positive Supply (V+) | Power rail input; decoupling capacitor required within 2 mm of this bump |
| A3 | Control Input (IN) | TTL/CMOS-compatible logic input controlling NO/NC state per truth table |
| B1 | Normally Open (NO) | Analog terminal connected to COM when IN = HIGH; rated for ±250 mA continuous |
| B2 | Common (COM) | Center pole of SPDT switch; bidirectional signal path with matched RON flatness (0.2 Ω max) |
| B3 | Normally Closed (NC) | Analog terminal connected to COM when IN = LOW; same RON and leakage specs as NO |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small footprint | 1.0 mm × 1.5 mm MICRO FOOT® package reduces PCB area by >80% vs. comparable TSSOP switches |
| Low on-resistance flatness | 0.2 Ω max RON variation over full analog range - preserves linearity in precision sensor and audio signal paths |
| Latchup immunity | Epitaxial layer prevents CMOS latchup under transient overvoltage conditions per JEDEC JESD78 |
| Low charge injection | 64 pC typical - minimizes sampling error in switched-capacitor circuits and ADC sample-and-hold stages |
| Pb-free compliance | Sn/Ag/Cu bump termination meets RoHS Directive 2011/65/EU and JEDEC JS709A halogen-free requirements |
Applications
| Cellular Handset Audio Routing | Portable Test Equipment Signal Multiplexing |
|---|---|
Use Scenario: Switching microphone and earpiece signals between baseband processor and codec in dual-mode GSM/WCDMA handsets. IC Role / Device Role / Timing Role: SPDT analog switch providing low-distortion, low-latency signal path selection with <47 ns propagation delay. Use Value: 0.4 Ω RON and –70 dB off-isolation prevent crosstalk and insertion loss, preserving SNR in voice-band audio paths. | Use Scenario: Selecting between multiple sensor inputs (thermocouple, RTD, strain gauge) in handheld multimeters and calibrators. IC Role / Device Role / Timing Role: Precision analog multiplexer enabling sequential measurement without manual reconnection. Use Value: Low 64 pC charge injection and 0.2 Ω RON flatness ensure accurate DC offset and gain stability across channel scans. |
| Battery-Powered PDA Data Interfaces | PCM Card Peripheral Selection |
Use Scenario: Routing USB, SDIO, or I²C signals between host processor and peripheral modules in power-sensitive PDAs. IC Role / Device Role / Timing Role: Low-power SPDT switch enabling dynamic interface reconfiguration during sleep/wake cycles. Use Value: 0.1 µA supply current and 1.8 V minimum operation extend battery life while maintaining signal integrity. | Use Scenario: Isolating legacy PCMCIA card slots from system bus during hot-insertion or fault conditions in industrial controllers. IC Role / Device Role / Timing Role: Fail-safe analog disconnect switch protecting host controller from card-induced transients. Use Value: ±400 mA pulsed current rating and –0.3 V to (V+ + 0.3 V) absolute max ratings provide robust overvoltage clamping via internal diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX4677EWC+T | Higher RON (0.8 Ω typ), larger 2.1 mm × 1.6 mm WLP package, 1.6 V min supply | Targeted at industrial temperature range (–40 °C to +125 °C); less suitable for ultra-thin handset designs | Select when extended temperature operation or higher supply headroom is required over footprint savings |
| ADG823BRMZ-REEL7 | 0.5 Ω RON, 1.65 V–5.5 V supply, 1.6 mm × 1.6 mm 8-pin MSOP package, no Pb-free bump option | Requires PCB real estate for leads and thermal pad; better suited for prototyping than volume portable production | Prefer when leaded assembly infrastructure exists and board space constraints are moderate |
Compared with MAX4677EWC+T and ADG823BRMZ-REEL7, the DG3003DB-T1-E1 delivers the smallest footprint and lowest RON in a Pb-free WLCSP, making it optimal for next-generation compact battery-powered devices where board area and analog fidelity are critical.
Availability
DG3003DB-T1-E1 is available at Aetrix Electronics and suitable for cellular phones, portable test equipment, battery-operated systems, and PCM cards requiring stable component supply despite end-of-life status through selective inventory management and lifecycle coordination.
Supply support for DG3003DB-T1-E1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global semiconductor manufacturer specializing in discrete components and analog ICs, with leadership in MOSFETs, diodes, optoelectronics, and precision analog switches.
The DG3003DB-T1-E1 belongs to Vishay's MICRO FOOT® analog switch product line, engineered specifically for ultra-compact, low-power portable electronics where minimal board space, low RON, and robust analog performance are mandatory.
FAQ
What is the maximum analog signal voltage range supported by the DG3003DB-T1-E1?
The DG3003DB-T1-E1 supports analog signals from 0 V to V+, where V+ ranges from 1.8 V to 5.5 V. Absolute maximum ratings allow signals on NO, NC, or COM to reach (V+ + 0.3 V), with clamping diodes limiting forward current to rated levels. This ensures safe operation across Li-ion battery voltages and standard logic rails without external protection.
Does the DG3003DB-T1-E1 require external pull-up or pull-down resistors on its IN pin?
No, the DG3003DB-T1-E1 does not require external biasing on the IN pin. Its TTL/CMOS-compatible input accepts VINL ≤ 0.4 V (logic LOW) and VINH ≥ 2 V (logic HIGH) directly from microcontroller GPIOs or logic gates. Input leakage remains below ±1 µA across temperature, eliminating need for external resistors in most digital interface configurations.
How is thermal performance managed in the DG3003DB-T1-E1's MICRO FOOT® package?
The DG3003DB-T1-E1 uses a wafer-level chip-scale package with direct silicon-to-PCB solder bumps, enabling efficient heat transfer. Power dissipation is rated at 250 mW at 25 °C, derating linearly by 3.1 mW/°C above 70 °C. Thermal resistance (θJA) is minimized via NSMD copper pads and recommended land pattern-no thermal pad or underfill is required for typical portable use cases.
Can the DG3003DB-T1-E1 be used in bidirectional analog signal paths?
Yes, the DG3003DB-T1-E1 conducts equally well in both directions when ON, with matched RON and flatness specifications applying identically to NO→COM and COM→NO paths. Its symmetrical CMOS structure ensures consistent performance regardless of signal flow direction-ideal for I²C bus isolation, audio loopback, or differential signal routing.
What is the meaning of the "-E1" suffix in DG3003DB-T1-E1?
"-E1" denotes Vishay's Pb-free designation using Sn/Ag/Cu solder bumps instead of eutectic Sn/Pb. It confirms compliance with RoHS Directive 2011/65/EU and JEDEC JS709A halogen-free standards. The "-E1" variant has slightly taller bumps (238 µm vs. 165 µm for Sn/Pb) and distinct mechanical dimensions-designers must use the correct land pattern per the "LEAD (Pb)-FREE" package drawing.
DG3003DB-T1-E1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Circuit:
- SPDT
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Number of Circuits:
- 1
- On-State Resistance (Max):
- 700mOhm
- Channel-to-Channel Matching (ΔRon):
- 10mOhm
- Voltage - Supply, Single (V+):
- 1.8V ~ 5.5V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 71ns, 59ns
- -3db Bandwidth:
- -
- Charge Injection:
- 64pC
- Channel Capacitance (CS(off), CD(off)):
- 100pF
- Current - Leakage (IS(off)) (Max):
- 1nA
- Crosstalk:
- -70dB @ 100kHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-Micro Foot™ (1.5x1)
DG3003DB-T1-E1 FAQ
1.How can I place an order for DG3003DB-T1-E1 through Aetrix?
Please submit a Request for Quotation (RFQ) for DG3003DB-T1-E1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DG3003DB-T1-E1 reliable?
The price and inventory of DG3003DB-T1-E1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DG3003DB-T1-E1 is usually 5 days.
3.What payment methods are accepted for DG3003DB-T1-E1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DG3003DB-T1-E1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DG3003DB-T1-E1?
DG3003DB-T1-E1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DG3003DB-T1-E1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DG3003DB-T1-E1?
For technical support, including DG3003DB-T1-E1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DG3003DB-T1-E1 requirements.
6.How does Aetrix verify that DG3003DB-T1-E1 is sourced from the original manufacturer or authorized distributors?
All DG3003DB-T1-E1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DG3003DB-T1-E1 meets industry standards.
7.What is the process for return or replacement of DG3003DB-T1-E1?
All DG3003DB-T1-E1 units undergo pre-shipment inspection (PSI). If there is an issue with DG3003DB-T1-E1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DG3003DB-T1-E1 part is unused and in its original packaging.
Return procedure for DG3003DB-T1-E1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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