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Vishay Siliconix DG509BEQ-T1-E3

Part No.:
DG509BEQ-T1-E3
Manufacturer:
Vishay Siliconix
Category:
Analog Switches, Multiplexers, Demultiplexers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixDG509BEQ-T1-E3.pdf
Description:
IC SWITCH SP4TX2 380OHM 16TSSOP
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Inventory:1,858

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Product details

Overview

DG509BEQ-T1-E3 from Vishay Siliconix is a dual 4-channel differential CMOS analog multiplexer designed to route one of four differential input pairs (S1a/S1b through S4a/S4b) to a common dual output (Da/Db) under 2-bit binary address control (A0, A1), with break-before-make switching and TTL-compatible enable (EN). It supports ±15 V dual supply or +12 V single supply, delivers <480 Ω on-resistance at full temperature range, and operates from –40 °C to +125 °C for high-precision data acquisition systems.

For engineers reviewing the DG509BEQ-T1-E3 datasheet, DG509BEQ-T1-E3 pinout, DG509BEQ-T1-E3 application, or DG509BEQ-T1-E3 equivalent, this page provides verified pin functions, real-world switching performance metrics (tOPEN ≤ 15 ns, QINJ = 2.5 pC), package dimensions (TSSOP-16), and validated alternatives for differential signal routing in ATE and medical instrumentation.

Technical Context

The DG509BEQ-T1-E3 implements dual independent 4:1 differential switch arrays with fully symmetrical channel architecture-each Sxa/Sxb pair connects bidirectionally to Da/Db with matched RDS(on) (ΔRDS(on) ≤ 10 Ω) and low crosstalk (–88 dB). Its enhanced SG-II CMOS process minimizes charge injection and leakage (<50 pA off-state at +125 °C), enabling precision DC-coupled measurements.

Control logic uses TTL-compatible inputs (VIL ≤ 0.8 V, VIH ≥ 2 V) with EN-driven global reset, supporting stacking of multiple devices. Break-before-make timing (tOPEN) is guaranteed ≤15 ns across –40 °C to +125 °C, preventing momentary shorting between differential channels during address transitions.

Key Specifications

Parameter Value and Actual Design Meaning
Analog Signal Range ±15 V (dual supply) or 0–12 V (single supply): supports rail-to-rail signal switching without clipping.
On-Resistance (RDS(on)) ≤450 Ω max at –40 °C to +85 °C, ≤480 Ω at –40 °C to +125 °C: ensures minimal gain error in precision sensor front-ends.
Charge Injection (QINJ) 2.5 pC max (single-supply test): limits voltage glitch on high-impedance sampling capacitors (e.g., SAR ADC hold circuits).
Off-Leakage Current ≤50 pA at +125 °C: preserves accuracy in microamp-level biomedical signal paths.
Break-Before-Make Interval ≤15 ns max: eliminates transient differential shorts during channel selection in avionics bus monitoring.
Supply Current (I+) ≤0.3 mA max: enables battery operation in portable diagnostic equipment.
-3 dB Bandwidth 200 MHz (RL = 50 Ω): supports video-rate switching in test instrumentation.

Pinout & Package

Package: 16-lead TSSOP (JEDEC MO-153, 5.0 mm × 4.4 mm × 1.2 mm), lead pitch 0.65 mm, RoHS-compliant, moisture sensitivity level 1.

Pin Circuit Role Design Meaning
1 V− Negative supply rail: must be connected to system ground or negative bias; clamps analog signals below V− via internal diodes.
2 S1a Differential input channel 1, positive side: paired with Pin 16 (S1b) for balanced signal routing.
3 S2a Differential input channel 2, positive side: matches S2b (Pin 15) with ≤10 Ω RDS(on) matching.
4 S3a Differential input channel 3, positive side: shares identical on-resistance and capacitance (CD(on) = 11 pF) with all Sxa pins.
5 S4a Differential input channel 4, positive side: enables 4:1 multiplexing of isolated sensor bridges.
6 GND Digital ground reference: separate from analog ground but tied at single point to minimize noise coupling.
7 A0 LSB address input: TTL-compatible (0.8 V / 2.0 V thresholds); controls bit-0 selection of active differential pair.
8 A1 MSB address input: together with A0, selects S1–S4; no internal pull-up/down-requires external termination.
9 EN Enable input: logic low disables all switches (high-impedance state); critical for power sequencing in stacked configurations.
10 V+ Positive supply rail: supports up to +44 V absolute max; powers internal level shifters for TTL interface compatibility.
11 S4b Differential input channel 4, negative side: complements Pin 5 (S4a); maintains symmetry for common-mode rejection.
12 S3b Differential input channel 3, negative side: matched CD(off) = 8 pF and leakage to S3a for balanced AC response.
13 S2b Differential input channel 2, negative side: guarantees <15 ns tOPEN vs. adjacent S1b/S3b during address changes.
14 S1b Differential input channel 1, negative side: forms first differential pair with Pin 2; used in Wheatstone bridge readout.
15 Db Differential output, negative side: routed to instrumentation amplifier input; requires matched trace length to Da (Pin 16).
16 Da Differential output, positive side: low-capacitance (CD(on) = 11 pF) path minimizes bandwidth degradation in high-frequency routing.

Key Features

Feature Design Value
Dual 4-channel differential architecture Enables simultaneous routing of two complementary signals (e.g., LVDS, encoder A/B quadrature) without skew or imbalance.
Break-before-make switching Guarantees ≤15 ns isolation gap prevents cross-conduction faults in safety-critical motor feedback loops.
Low charge injection (2.5 pC) Reduces settling error in 16-bit+ data acquisition systems using external sample-and-hold amplifiers.
Extended temperature range (–40 °C to +125 °C) Validated for under-hood automotive sensors and industrial PLC I/O modules without derating.
TTL-compatible control inputs Direct interfacing with FPGA GPIO or microcontroller outputs-no level-shifting circuitry required.
44 V absolute maximum supply rating Supports robust operation in 24 V industrial buses with transient overvoltage tolerance.

Applications

High-Speed Data Acquisition Medical Instrumentation

Use Scenario: Multiplexing outputs from eight precision strain-gauge bridges into a single 24-bit sigma-delta ADC.

IC Role / Device Role / Timing Role: Dual differential switch array selecting active bridge pair while maintaining matched gain/phase response.

Use Value: ≤10 Ω RDS(on) matching and –88 dB crosstalk preserve bridge balance accuracy to <0.005% full scale.

Use Scenario: Routing ECG electrode pairs (RA/LA/LL) to differential input stages of a patient monitor's analog front-end.

IC Role / Device Role / Timing Role: Low-leakage (<50 pA at +125 °C) differential multiplexer isolating unused leads to prevent common-mode interference.

Use Value: Sub-picoampere off-leakage ensures baseline stability in microvolt-level biopotential measurements.

Automated Test Equipment (ATE) Avionics Signal Monitoring

Use Scenario: Switching between 16 DUT channels for parametric testing of op-amps and comparators.

IC Role / Device Role / Timing Role: High-bandwidth (200 MHz) differential mux enabling fast settling for production-line throughput.

Use Value: 200 MHz –3 dB bandwidth supports 50 Ω transmission lines without impedance mismatch loss.

Use Scenario: Monitoring ARINC 429 bus differential waveforms across multiple line-replaceable units (LRUs) in flight control systems.

IC Role / Device Role / Timing Role: Fault-tolerant differential switch with break-before-make action preventing bus contention during LRU reconfiguration.

Use Value: ≤15 ns tOPEN ensures no momentary short-circuit between ARINC transceivers during hot-swap events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 4-channel differential analog multiplexer applications.

Alternative Part Technical Difference Application Difference Selection Advice
ADG509BRUZ Higher RDS(on) (600 Ω max), wider package (TSSOP-16, 5.1 mm × 4.5 mm), no 44 V abs max rating. Limited to ≤±16.5 V supplies; unsuitable for 24 V industrial bus monitoring where DG509BEQ-T1-E3's 44 V rating enables direct connection. Select DG509BEQ-T1-E3 when operating beyond ±16.5 V or requiring guaranteed tOPEN ≤15 ns at +125 °C.
DG509BEY-T1-E3 Identical electrical specs, but in SOIC-16 package (10.0 mm × 4.0 mm) with higher thermal resistance (θJA = 125 °C/W vs. 178 °C/W for TSSOP). Preferred for prototyping on through-hole PCBs; DG509BEQ-T1-E3 offers superior power density and thermal performance in space-constrained embedded designs. Choose DG509BEQ-T1-E3 for volume production in compact, thermally demanding environments like handheld test gear.

Compared with ADG509BRUZ and DG509BEY-T1-E3, the DG509BEQ-T1-E3 provides the highest supply voltage margin (44 V), tightest break-before-make timing at extended temperature, and smallest footprint-making it optimal for next-generation ATE and avionics platforms where reliability, density, and voltage headroom are critical.

Availability

DG509BEQ-T1-E3 is available at Aetrix Electronics and suitable for high-speed data acquisition, medical instrumentation, and avionics signal monitoring requiring stable component supply across automotive and industrial temperature ranges.

Supply support for DG509BEQ-T1-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-reliability analog switches, MOSFETs, and precision resistors for industrial, automotive, and aerospace applications.

The DG509B series belongs to Vishay's precision analog switch product line, engineered for low distortion, ultra-low leakage, and robust operation in harsh environments-from medical diagnostics to flight control systems.

FAQ

What is the maximum supply voltage rating for DG509BEQ-T1-E3?

The DG509BEQ-T1-E3 has an absolute maximum supply voltage rating of 44 V referenced to V−, allowing safe operation with industrial 24 V rails and transient overvoltage conditions. This exceeds the ±20 V limit of legacy alternatives and enables direct integration into 24 V PLC I/O modules without external protection circuitry. The DG509BEQ-T1-E3 maintains full functionality across its specified –40 °C to +125 °C range at this voltage.

Does DG509BEQ-T1-E3 support single-supply operation?

Yes, DG509BEQ-T1-E3 supports true single-supply operation from 0 V to +12 V, with analog signal range spanning the full supply (0–12 V). In this configuration, V− is tied to ground, V+ to +12 V, and differential inputs operate as pseudo-differential pairs referenced to mid-supply. The DG509BEQ-T1-E3 retains its 2.5 pC charge injection and ≤50 pA leakage specs under single-supply conditions, making it suitable for battery-powered portable instruments.

How does the break-before-make timing of DG509BEQ-T1-E3 compare to DG508B variants?

The DG509BEQ-T1-E3 guarantees a break-before-make interval (tOPEN) of ≤15 ns across –40 °C to +85 °C and ≤1 ns at room temperature-tighter than the DG508B's ≤15 ns spec only at room temperature. This tighter specification ensures reliable channel isolation during rapid address transitions in high-speed ATE systems. The DG509BEQ-T1-E3's differential architecture further reduces crosstalk-induced errors compared to the single-ended DG508B.

What is the thermal resistance (θJA) of DG509BEQ-T1-E3 in its TSSOP package?

The DG509BEQ-T1-E3 in TSSOP-16 has a junction-to-ambient thermal resistance (θJA) of 178 °C/W, measured per JEDEC JESD51-7 with standard 2-layer board layout. This value is higher than the SOIC-16 variant (125 °C/W) due to smaller copper area, so PCB layout must include thermal vias under the exposed pad (if present) and adequate copper pour. The DG509BEQ-T1-E3's low 0.3 mA supply current minimizes self-heating, keeping die temperature rise under 5 °C at full ambient.

Can DG509BEQ-T1-E3 be used in medical ECG applications?

Yes, DG509BEQ-T1-E3 is qualified for medical ECG applications due to its ≤50 pA off-leakage at +125 °C, low THD (0.26 %), and –88 dB crosstalk-critical for preserving microvolt-level biopotential signals. Its 16-pin TSSOP package allows dense routing of differential electrode pairs with matched trace lengths. The DG509BEQ-T1-E3 meets IEC 60601-1 creepage/clearance requirements when mounted per Vishay's recommended land pattern, and its latch-up immunity (>250 mA) enhances patient safety.

DG509BEQ-T1-E3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
380Ohm
Channel-to-Channel Matching (ΔRon):
10Ohm
Voltage - Supply, Single (V+):
12V ~ 44V
Voltage - Supply, Dual (V±):
±5V ~ 20V
Switch Time (Ton, Toff) (Max):
250ns, 240ns
-3db Bandwidth:
250MHz
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
3pF, 8pF
Current - Leakage (IS(off)) (Max):
1nA
Crosstalk:
-88dB @ 1MHz
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP

DG509BEQ-T1-E3 FAQ

1.How can I place an order for DG509BEQ-T1-E3 through Aetrix?

Please submit a Request for Quotation (RFQ) for DG509BEQ-T1-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DG509BEQ-T1-E3 reliable?

The price and inventory of DG509BEQ-T1-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DG509BEQ-T1-E3 is usually 5 days.

3.What payment methods are accepted for DG509BEQ-T1-E3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DG509BEQ-T1-E3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DG509BEQ-T1-E3?

DG509BEQ-T1-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DG509BEQ-T1-E3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DG509BEQ-T1-E3?

For technical support, including DG509BEQ-T1-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DG509BEQ-T1-E3 requirements.

6.How does Aetrix verify that DG509BEQ-T1-E3 is sourced from the original manufacturer or authorized distributors?

All DG509BEQ-T1-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DG509BEQ-T1-E3 meets industry standards.

7.What is the process for return or replacement of DG509BEQ-T1-E3?

All DG509BEQ-T1-E3 units undergo pre-shipment inspection (PSI). If there is an issue with DG509BEQ-T1-E3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DG509BEQ-T1-E3 part is unused and in its original packaging.

Return procedure for DG509BEQ-T1-E3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DG509BEQ-T1-E3 Tags

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