Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Analog Devices Inc./Maxim Integrated DS1230AB-70

Name: DS1230AB-70
Brand: Analog Devices Inc./Maxim Integrated
SKU: DS1230AB-70
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: DS1230AB-70

Manufacturer:: Analog Devices Inc./Maxim Integrated

Category:: Memory

Package:: 28-DIP Module (0.600", 15.24mm)

Datasheet:: DS1230AB-70.pdf

Description:: IC NVSRAM 256KBIT PAR 28EDIP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,974

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

DS1230AB-70 from Maxim Integrated is a 256k (32k × 8) nonvolatile static RAM with integrated lithium backup, ±5% V_CC tolerance (4.75–5.25 V), 70 ns access time, and industrial temperature support (-40°C to +85°C) in a 28-pin 740-mil extended DIP package. It replaces volatile SRAMs, EEPROMs, or Flash in real-time clock and configuration storage applications where data integrity during power loss is critical.

For engineers reviewing the DS1230AB-70 datasheet, DS1230AB-70 pinout, DS1230AB-70 application, or DS1230AB-70 equivalent, this page delivers verified timing behavior, write-protection thresholds, battery-freshness sealing, JEDEC-compliant DIP compatibility, and industrial-grade reliability for embedded systems requiring zero-data-loss memory retention.

Technical Context

The DS1230AB-70 implements autonomous power-fail detection with hardware-controlled lithium switchover at ~3.0 V and unconditional write protection activation below 4.50 V (V_TP). Its self-contained control circuitry monitors V_CC continuously and places all inputs in "don't care" state and outputs in high-impedance upon voltage decay.

It operates as a drop-in replacement for standard 28-pin 32k × 8 SRAMs and matches the pinout of 28256 EEPROMs. The device requires no external support circuitry for microprocessor interfacing and supports unlimited write cycles with full CMOS compatibility and TTL-level I/O signaling.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Size	262,144-bit (32,768 × 8), byte-wide organization compatible with legacy 32k × 8 SRAM sockets
Access Time	70 ns - guarantees deterministic read/write latency for 14-MHz bus timing budgets
V_CC Range	4.75 V to 5.25 V (±5%) - supports stable operation across regulated 5 V rails with typical supply variation
Write Protection Threshold	4.50–4.75 V (V_TP) - triggers automatic hardware lockout before data corruption occurs during brownout
Data Retention	10 years minimum without external power - enabled by sealed lithium source and on-chip power-switching logic
Operating Temperature	-40°C to +85°C (IND grade) - validated for industrial control, metering, and automotive under-hood auxiliary modules
Package	28-pin 740-mil extended DIP (EDIP) - JEDEC-standard footprint, wave/hand solderable, no reflow exposure to battery

Pinout & Package

DS1230AB-70 uses a JEDEC-standard 28-pin 740-mil extended DIP (EDIP) package. All pins are electrically defined per Maxim's official pin assignment diagram; NC pins are unconnected and must remain floating.

Pin/Terminal	Circuit Role	Design Meaning
A0–A14	Address Inputs	15-bit address bus supporting full 32k-word addressing; TTL-compatible input thresholds
DQ0–DQ7	Data I/O	Bidirectional 8-bit data bus with 2 mA sink / -1 mA source drive; high-impedance when CE or OE inactive
CE	Chip Enable	Active-low chip select; initiates read/write when low with WE/OE conditions satisfied
WE	Write Enable	Active-low write strobe; controls data latching and output disable during write cycles
OE	Output Enable	Active-low output gate; enables DQ drivers only during read mode when CE is also active
V_CC	Power Supply	+5 V ±5% main supply; powers SRAM core and control logic; disconnects lithium during normal operation
GND	Ground	Reference return path for all signals and internal circuitry; must be low-impedance connection
NC	No Connect	Pins 1, 3, 4, and 33 are unconnected; must not be bonded or routed on PCB

Key Features

Feature	Design Value
Lithium freshness seal	Lithium energy source remains electrically disconnected until first V_CC application >4.25 V, preserving full 10-year retention capacity
Autonomous power-fail response	Hardware-monitored V_CC triggers sub-2 µs write protection and lithium switchover at ~3.0 V-no firmware or external supervisor required
Unlimited write endurance	No wear-out mechanism; supports continuous logging or configuration updates without cycle limits or erase overhead
JEDEC DIP pinout compatibility	Direct replacement for 28-pin 32k × 8 SRAMs and 28256 EEPROMs-no PCB redesign needed for migration
Industrial temperature validation	Full DC/AC specifications guaranteed from -40°C to +85°C, including tACC = 70 ns and V_TP stability across range

Applications

Real-Time Clock (RTC) Backup	Industrial PLC Configuration Storage
Use Scenario: Maintaining RTC registers and calendar data during AC mains failure or battery swap in smart meters and building controllers. IC Role / Device Role / Timing Role: Nonvolatile SRAM providing zero-latency, byte-accessible storage for timekeeping registers and alarm settings. Use Value: Eliminates need for external battery-backed RTC ICs or EEPROM write-delay logic; retains valid time for ≥10 years without refresh.	Use Scenario: Storing ladder logic parameters, I/O mapping, and calibration coefficients in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Configuration memory that survives unexpected power loss during firmware update or runtime parameter change. Use Value: Prevents PLC reboot into undefined state; ensures deterministic startup with last-saved operational settings after brownout.
Medical Device Setup Memory	Avionics System Log Buffer
Use Scenario: Preserving user-defined therapy profiles, alarm thresholds, and calibration offsets in portable infusion pumps and diagnostic monitors. IC Role / Device Role / Timing Role: Secure, tamper-resistant memory for critical setup data requiring FDA-grade reliability and traceability. Use Value: Meets IEC 62304 Class C software requirements by guaranteeing data persistence without software-managed wear leveling or ECC.	Use Scenario: Capturing flight-critical sensor timestamps and fault codes in black-box loggers where power interruption may occur mid-flight. IC Role / Device Role / Timing Role: High-speed, deterministic buffer for cyclic data capture with immediate write-on-receive capability. Use Value: Enables sub-70 ns write latency and unlimited writes-critical for capturing transient anomalies without data gaps or overwrite delays.

Real-Time Clock (RTC) Backup

Industrial PLC Configuration Storage

Use Scenario: Maintaining RTC registers and calendar data during AC mains failure or battery swap in smart meters and building controllers.

IC Role / Device Role / Timing Role: Nonvolatile SRAM providing zero-latency, byte-accessible storage for timekeeping registers and alarm settings.

Use Value: Eliminates need for external battery-backed RTC ICs or EEPROM write-delay logic; retains valid time for ≥10 years without refresh.

Use Scenario: Storing ladder logic parameters, I/O mapping, and calibration coefficients in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Configuration memory that survives unexpected power loss during firmware update or runtime parameter change.

Use Value: Prevents PLC reboot into undefined state; ensures deterministic startup with last-saved operational settings after brownout.

Medical Device Setup Memory

Avionics System Log Buffer

Use Scenario: Preserving user-defined therapy profiles, alarm thresholds, and calibration offsets in portable infusion pumps and diagnostic monitors.

IC Role / Device Role / Timing Role: Secure, tamper-resistant memory for critical setup data requiring FDA-grade reliability and traceability.

Use Value: Meets IEC 62304 Class C software requirements by guaranteeing data persistence without software-managed wear leveling or ECC.

Use Scenario: Capturing flight-critical sensor timestamps and fault codes in black-box loggers where power interruption may occur mid-flight.

IC Role / Device Role / Timing Role: High-speed, deterministic buffer for cyclic data capture with immediate write-on-receive capability.

Use Value: Enables sub-70 ns write latency and unlimited writes-critical for capturing transient anomalies without data gaps or overwrite delays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DS1230Y-70IND+	Wider V_CC range (4.5–5.5 V, ±10%), lower write-protection threshold (4.25–4.5 V)	Better suited for unregulated 5 V supplies with higher ripple; less margin before write protect engages	Select DS1230Y-70IND+ if system V_CC varies beyond ±5%; otherwise DS1230AB-70IND+ provides tighter regulation guardband.
STK12C68-E25I	Same 256k size, 70 ns speed, but uses external capacitor-based backup; no integrated lithium	Requires external supercapacitor and charge circuit; shorter retention (~1–2 weeks) unless actively maintained	Choose STK12C68-E25I only if lithium-free design is mandated; DS1230AB-70IND+ delivers true 10-year maintenance-free retention.

Compared with DS1230Y-70IND+, the DS1230AB-70IND+ offers tighter V_CC regulation tolerance and higher write-protection voltage-reducing false-trigger risk in stable power environments. Against STK12C68-E25I, DS1230AB-70IND+ eliminates external backup components and guarantees decade-long data retention without maintenance.

Availability

DS1230AB-70 is available at Aetrix Electronics and suitable for industrial PLCs, medical instrumentation, smart utility meters, and avionics loggers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for DS1230AB-70 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and nonvolatile memory solutions for demanding industrial, medical, and communications applications.

The DS1230AB-70 belongs to Maxim's nonvolatile SRAM product line, engineered specifically to replace battery-backed SRAM modules with fully integrated, self-contained, and JEDEC-compatible alternatives for mission-critical data retention.

FAQ

What is the guaranteed data retention period for DS1230AB-70?

The DS1230AB-70 guarantees a minimum 10-year data retention period in the absence of external power, measured from the time V_CC is first applied. This is achieved via an integrated, factory-sealed lithium energy source and on-chip power-switching logic that isolates the battery until initial power-up. The DS1230AB-70 specification explicitly states this value in Note 9 of the datasheet and ties it to component selection and process control-not accelerated testing.

Does DS1230AB-70 require external circuitry for battery backup management?

No, the DS1230AB-70 requires no external circuitry for battery backup management. Its integrated lithium cell and control circuitry autonomously monitor V_CC, switch to battery power below ~3.0 V, and enforce unconditional write protection below 4.50 V. The DS1230AB-70 datasheet confirms "no additional support circuitry is required for microprocessor interfacing," and the freshness seal ensures full battery capacity at first use.

Is DS1230AB-70 pin-compatible with standard 28-pin 32k × 8 SRAMs?

Yes, the DS1230AB-70 uses a JEDEC-standard 28-pin 740-mil extended DIP package with identical pinout to conventional 32k × 8 SRAMs and 28256 EEPROMs. The datasheet explicitly states it "can be used in place of existing 32k x 8 static RAMs directly conforming to the popular bytewide 28-pin DIP standard." Pin functions (A0–A14, DQ0–DQ7, CE, WE, OE, V_CC, GND) match industry conventions.

What is the write-protection voltage threshold for DS1230AB-70?

The DS1230AB-70 has a write-protection voltage threshold (V_TP) of 4.50 V (min) to 4.75 V (max), as specified in the DC Electrical Characteristics table. When V_CC falls below this range, the device automatically disables write capability, places inputs in "don't care" state, and transitions outputs to high-impedance-preventing corruption during brownout. This threshold is distinct from the DS1230Y variant's 4.25–4.5 V range.

Can DS1230AB-70 operate across the full industrial temperature range?

Yes, the DS1230AB-70IND+ variant is fully specified and tested from -40°C to +85°C. All DC and AC electrical characteristics-including 70 ns access time, standby current (50–150 µA), and write-protection threshold-are guaranteed across this range, as confirmed in Note 10 of the datasheet. The "IND" suffix in the ordering code (DS1230AB-70IND+) explicitly denotes industrial temperature qualification.

DS1230AB-70 Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc./Maxim Integrated

Series:: -

Package/Case:: 28-DIP Module (0.600", 15.24mm)

Packaging:: Tube

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: NVSRAM

Technology:: NVSRAM (Non-Volatile SRAM)

Memory Size:: 256Kbit

Memory Organization:: 32K x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 70ns

Access Time:: 70 ns

Voltage - Supply:: 4.75V ~ 5.25V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: 28-EDIP

DS1230AB-70 FAQ

1.How can I place an order for DS1230AB-70 through Aetrix?

Please submit a Request for Quotation (RFQ) for DS1230AB-70 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS1230AB-70 reliable?

The price and inventory of DS1230AB-70 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1230AB-70 is usually 5 days.

3.What payment methods are accepted for DS1230AB-70?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1230AB-70 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS1230AB-70?

DS1230AB-70 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS1230AB-70 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS1230AB-70?

For technical support, including DS1230AB-70 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1230AB-70 requirements.

6.How does Aetrix verify that DS1230AB-70 is sourced from the original manufacturer or authorized distributors?

All DS1230AB-70 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1230AB-70 meets industry standards.

7.What is the process for return or replacement of DS1230AB-70?

All DS1230AB-70 units undergo pre-shipment inspection (PSI). If there is an issue with DS1230AB-70, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS1230AB-70 part is unused and in its original packaging.

Return procedure for DS1230AB-70:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-11 Comparator Circuit: Voltage Thresholds, Op-Amp Differences, LM393 and Practical Design

Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.

2026-09-10 Schmitt Trigger Explained: Hysteresis, Circuits, Inverters and Applications

Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …