Analog Devices Inc./Maxim Integrated DS1270AB-100
- Part No.:
- DS1270AB-100
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Memory
- Package:
- 36-DIP Module (0.610", 15.49mm)
- Datasheet:
-
DS1270AB-100.pdf
- Description:
- IC NVSRAM 16MBIT PARALLEL 36EDIP
- Quantity:
- Payment:

- Shipping:

Inventory:4,388
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Product details
Overview
DS1270AB-100 from Maxim Integrated is a 16M-bit (2,097,152 × 8) nonvolatile static RAM with integrated lithium battery backup, ±5% VCC tolerance (4.75–5.25 V), 70 ns access time, and industrial-grade operation up to +85°C. It autonomously switches to battery power below ~3.0 V, enabling data retention without external circuitry in embedded systems requiring persistent memory during brownouts or power loss.
For engineers reviewing the DS1270AB-100 datasheet, DS1270AB-100 pinout, DS1270AB-100 application, or DS1270AB-100 equivalent, key selection criteria include write-protection voltage (VTP = 4.50–4.75 V), unlimited write cycles, 5-year data retention in battery mode, and compatibility with standard 8-bit microprocessor buses using CE/OE/WE control.
Technical Context
The DS1270AB-100 implements a self-monitoring power-fail detection circuit that triggers unconditional write protection when VCC drops below VTP, then seamlessly transfers RAM operation to its internal lithium cell at ~3.0 V. Its CMOS architecture ensures low standby current (100–250 µA) and full functionality across the entire ±5% supply range.
All 21 address lines (A0–A20) and 8 bidirectional data lines (DQ0–DQ7) interface directly with microprocessor buses without glue logic. The device enforces strict timing constraints: tACC = 70 ns, tWC = 70 ns, and tODW = 25 ns, with OE/CE/WE active-low control matching standard SRAM protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 16,777,216 bits (2,097,152 × 8) - supports full 8-bit byte-addressable access without banking or interleaving |
| Access Time | 70 ns - enables direct interfacing with 10–14 MHz microprocessors without wait states |
| VCC Range | 4.75 V to 5.25 V (±5%) - guarantees full read/write functionality across tight supply tolerances |
| Write Protection Threshold | VTP = 4.50–4.75 V - initiates automatic data lockout before supply collapse corrupts writes |
| Data Retention | 5 years minimum without external power - sustained by sealed lithium source activated only on first VCC application |
| Operating Temperature | -40°C to +85°C (IND grade) - qualified for industrial control, instrumentation, and telecom infrastructure |
| Standby Current | 100–250 µA at VCC–0.5 V - minimizes system-level quiescent power in always-on monitoring applications |
Pinout & Package
DS1270AB-100 uses a 36-pin 740-mil Extended Dual In-line Package (EDIP) with 0.1-inch lead spacing and wave-solder compatible construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 2-Mbyte linear addressing; TTL-compatible inputs |
| DQ0–DQ7 | Data I/O | Bidirectional 8-bit data bus with high-impedance outputs during deselect or write cycles |
| CE | Chip Enable | Active-low global enable; must be low for read/write; controls output drivers and internal timing |
| WE | Write Enable | Active-low write strobe; falling edge initiates write cycle; disables outputs if OE is active |
| OE | Output Enable | Active-low output gate; enables data drivers only during reads; high during writes prevents bus contention |
| VCC | Power Supply | +5 V ±5% main supply; powers logic and RAM core; monitored continuously for fail detection |
| GND | Ground | Reference return for all signals and power; requires low-impedance PCB connection |
| NC | No Connect | Pins 12 and 24 are unconnected internally; must remain floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Automatic Power-Fail Switching | Hardware-monitored VCC decay triggers lithium backup at ~3.0 V with <1.5 µs response (tPD), eliminating firmware intervention |
| Freshness Seal | Lithium source electrically disconnected until first VCC > VTP, preserving full 5-year retention capacity from shipment |
| Unlimited Write Cycles | No endurance limit on SRAM core - supports continuous logging or real-time configuration updates without wear leveling |
| Full VCC Tolerance Compliance | Guaranteed operation across entire 4.75–5.25 V range, including transient dips within spec, reducing need for external regulators |
| Industrial Temperature Rating | Validated operation from -40°C to +85°C with no derating - suitable for uncontrolled environments like factory floors or outdoor base stations |
Applications
| Industrial Data Logger | Medical Device Configuration Storage |
|---|---|
|
Use Scenario: Continuous sensor sampling in programmable logic controllers where mains power may interrupt unexpectedly. IC Role / Device Role / Timing Role: Nonvolatile SRAM holding real-time process variables and calibration coefficients between power cycles. Use Value: Eliminates need for EEPROM write delays or flash wear management; retains data for ≥5 years without refresh during extended outages. |
Use Scenario: Storing patient-specific therapy parameters and device calibration in portable infusion pumps. IC Role / Device Role / Timing Role: Battery-backed memory preserving critical settings during battery swaps or charging interruptions. Use Value: Ensures zero data loss during power transitions; meets IEC 62304 Class B software safety requirements for persistent state storage. |
| Telecom Base Station Control | Avionics Black Box Recorder |
|
Use Scenario: Maintaining operational status, fault logs, and network configuration in remote radio units exposed to wide temperature swings. IC Role / Device Role / Timing Role: Industrial-grade NV SRAM interfacing directly with ARM-based control processors via parallel bus. Use Value: Withstands -40°C to +85°C ambient without derating; 70 ns access enables deterministic response in time-critical control loops. |
Use Scenario: Capturing flight-critical telemetry and control surface positions in commercial aircraft recorders. IC Role / Device Role / Timing Role: Fail-safe memory buffer capturing pre-crash data streams with guaranteed retention after crash-induced power loss. Use Value: Automatic lithium switchover at ~3.0 V ensures uninterrupted capture even during rapid voltage collapse; UL E99151 recognized. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STK16C88-70I | 16 Mbit NV SRAM with 70 ns access, but uses external battery and lacks integrated VCC monitoring circuitry | Requires external power-fail detection and battery switch logic; higher BOM count and board area | Select when legacy designs already implement discrete backup control or require custom battery chemistry |
| ISL71091SEH | Radiation-hardened 16 Mbit NV SRAM with 100 ns access, MIL-PRF-38535 QML-V qualified, ±10% VCC | Targeted for space-grade applications; significantly higher cost and longer lead times | Select only for high-reliability aerospace programs requiring TID > 100 krad(Si) and SEL immunity |
Compared with STK16C88-70I and ISL71091SEH, DS1270AB-100 delivers integrated power monitoring and lithium switching in a single 36-pin EDIP package, reducing design complexity and validation effort for industrial and medical systems where radiation hardness is not required.
Availability
DS1270AB-100 is available at Aetrix Electronics and suitable for industrial data loggers, medical device configuration storage, and telecom base station control requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for DS1270AB-100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and power management ICs for industrial, medical, and communications applications.
The DS1270AB-100 belongs to Maxim's nonvolatile SRAM product line, designed specifically to replace battery-backed DRAM and EEPROM in systems demanding instant-write capability, unlimited endurance, and autonomous power-loss recovery.
FAQ
What is the write-protection voltage threshold for DS1270AB-100?
The DS1270AB-100 asserts unconditional write protection when VCC falls below VTP = 4.50–4.75 V. This threshold is factory-trimmed and guaranteed across temperature and process variation. Once triggered, all inputs become don't-care and outputs go high-impedance, preventing corruption during brownout conditions. DS1270AB-100 maintains this behavior consistently across its full industrial temperature range.
Does DS1270AB-100 require external components to operate as a nonvolatile SRAM?
No, DS1270AB-100 requires no external capacitors, diodes, or power-switching transistors. Its integrated lithium cell, voltage monitor, and power-switching circuitry are fully self-contained. Only standard decoupling capacitors (per layout guidelines) and a clean +5 V ±5% supply are needed. DS1270AB-100 achieves true plug-and-play nonvolatility without additional support circuitry.
How does DS1270AB-100 differ from the DS1270Y-100 variant?
DS1270AB-100 operates over a tighter VCC range (4.75–5.25 V, ±5%) and has a higher write-protection threshold (4.50–4.75 V) versus DS1270Y-100 (4.5–5.5 V, ±10%; VTP = 4.25–4.5 V). Both share identical pinout, timing, and packaging, but DS1270AB-100 is optimized for systems with regulated 5 V supplies where tighter voltage margins improve noise immunity and reduce false triggers.
Is DS1270AB-100 compatible with standard microprocessor bus timing?
Yes, DS1270AB-100 complies with industry-standard SRAM timing: tACC = 70 ns, tWC = 70 ns, tOE = 35 ns, and tCO = 70 ns. Its CE/OE/WE control protocol matches common 8051, Z80, and ARM9 bus interfaces. DS1270AB-100 requires no wait-state insertion when used with processors running ≤14 MHz, simplifying timing closure in legacy and new designs.
What is the expected data retention lifetime of DS1270AB-100 in battery mode?
DS1270AB-100 guarantees ≥5 years of data retention in the absence of external power, measured from the time VCC is first applied (activating the lithium cell). This specification is assured by component selection, process control, and design-not production-tested per unit-but validated through accelerated life testing and statistical analysis per Maxim's reliability program. DS1270AB-100 meets this requirement across its full industrial temperature range.
DS1270AB-100 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 36-DIP Module (0.610", 15.49mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- NVSRAM
- Technology:
- NVSRAM (Non-Volatile SRAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 100ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 4.75V ~ 5.25V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 36-EDIP
DS1270AB-100 FAQ
1.How can I place an order for DS1270AB-100 through Aetrix?
Please submit a Request for Quotation (RFQ) for DS1270AB-100 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS1270AB-100 reliable?
The price and inventory of DS1270AB-100 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1270AB-100 is usually 5 days.
3.What payment methods are accepted for DS1270AB-100?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1270AB-100 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS1270AB-100?
DS1270AB-100 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS1270AB-100 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS1270AB-100?
For technical support, including DS1270AB-100 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1270AB-100 requirements.
6.How does Aetrix verify that DS1270AB-100 is sourced from the original manufacturer or authorized distributors?
All DS1270AB-100 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1270AB-100 meets industry standards.
7.What is the process for return or replacement of DS1270AB-100?
All DS1270AB-100 units undergo pre-shipment inspection (PSI). If there is an issue with DS1270AB-100, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS1270AB-100 part is unused and in its original packaging.
Return procedure for DS1270AB-100:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS1270AB-100 Tags

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