Analog Devices Inc./Maxim Integrated DS3050W-100#
- Part No.:
- DS3050W-100#
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Memory
- Package:
- 256-BGA
- Datasheet:
-
DS3050W-100#.pdf
- Description:
- IC NVSRAM 4MBIT PARALLEL 256BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,605
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DS3050W-100# from Maxim Integrated is a 3.3V, 4Mb (512k × 8) nonvolatile SRAM with integrated year-2000-compliant real-time clock (RTC), internal rechargeable manganese lithium (ML) battery, and power-fail detection circuitry. It operates across -40°C to +85°C, delivers 100ns access time, and automatically switches to battery backup when VCC drops below 2.8V-enabling data retention and timekeeping in RAID systems, industrial PLCs, and fire alarm controllers.
For engineers reviewing the DS3050W-100# datasheet, DS3050W-100# pinout, DS3050W-100# application, or DS3050W-100# equivalent, key selection considerations include its single-piece 256-ball BGA module integration, unconditional write-protection during VCC failure, dual-mode interrupt (IRQ/FT) supporting RTC alarm and watchdog timer functions, and UL recognition for safety-critical embedded systems.
Technical Context
The DS3050W-100# integrates SRAM, RTC, and ML battery charging into one monolithic 27mm × 27mm BGA module. Its dual-bus interface uses CE/WE/OE for SRAM access and CS/WE for RTC register access, with separate RST (open-drain reset supervisor) and IRQ/FT (open-drain programmable interrupt) outputs. The RTC features double-buffered BCD registers, automatic leap-year correction, and alarm/wake-up capability during battery-backup mode.
Power management includes VTP-based write-protection at 2.8–3.0V, tREC = 125ms recovery after VCC restoration, and tPD = 1.5µs fail-detect latency. Battery charging activates above VTP, with short-circuit protection and temperature-stabilized regulation compliant with UL recognition requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 4Mb (512k × 8) NV SRAM - retains full contents without external support during VCC loss |
| Access Time | 100ns - enables direct interfacing with 10MHz microprocessors without wait states |
| Supply Voltage | 3.3V ±0.3V - compatible with standard 3.3V logic families and industrial I/O rails |
| Operating Temperature | -40°C to +85°C - qualified for industrial control, networking, and safety-critical environments |
| Data Retention | 2–3 years per charge - sustained by internal ML battery with no user-replacement required |
| RTC Accuracy | ±1 minute/month at +25°C - factory-trimmed oscillator eliminates need for external calibration |
| Package | 256-ball BGA, 27mm × 27mm - reflow-compatible single-piece module eliminating discrete battery handling |
Pinout & Package
DS3050W-100# uses a 256-ball BGA package with 27mm × 27mm footprint and 1.27mm ball pitch. Pin assignments follow JEDEC MO-270AB standard layout; ground balls are distributed across four corners and center rows for low-inductance return paths.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus for SRAM (A0–A18) and 4-bit RTC register select (A0–A3) |
| DQ0–DQ7 | Data I/O | 8-bit bidirectional data bus shared between SRAM and RTC registers |
| CE | SRAM Chip Enable | Active-low enable for SRAM read/write; high during RTC operations to avoid bus contention |
| CS | RTC Chip Select | Active-low enable for RTC register access; must be high during SRAM cycles |
| WE | Write Enable | Controls write direction for both SRAM and RTC; timing differs per mode (see tWP notes) |
| OE | Output Enable | Enables DQ drivers during reads; high during writes to maintain high-impedance state |
| RST | Reset Output | Open-drain output asserting low during VCC undervoltage; used as CPU supervisor |
| IRQ/FT | Interrupt/Frequency Test | Open-drain output configurable as RTC alarm, system wake-up, or watchdog timer signal |
Key Features
| Feature | Design Value |
|---|---|
| Single-Piece BGA Module | Eliminates manual battery insertion and soldering hazards-fully compatible with automated SMT reflow |
| Unconditional Write Protection | Hardware-enforced lockout of SRAM/RTC writes when VCC < 2.8V-no software dependency or timing window |
| Integrated Watchdog Timer | Programmable timeout (1/16s to 124s) with IRQ/FT assertion and flag persistence until cleared by register access |
| RTC Alarm Wake-Up | Configurable alarm triggers IRQ/FT during battery-backup mode-enables low-power system wake-up without host intervention |
| UL Recognition | Meets UL 60950-1 requirements for internal battery charging circuitry-reduces safety certification burden |
Applications
| RAID Systems & Servers | Gaming Consoles |
|---|---|
Use Scenario: Persistent storage of configuration metadata, boot counters, and timestamped event logs during unexpected power loss. IC Role / Device Role / Timing Role: Nonvolatile SRAM + RTC provides atomic write-protection and accurate uptime tracking independent of host power state. Use Value: Prevents filesystem corruption and enables forensic power-cycle analysis via battery-backed timestamps. |
Use Scenario: Maintaining save-game state, session timers, and anti-cheat timestamps across console power cycles and firmware updates. IC Role / Device Role / Timing Role: Dual-function memory/timing device serves as secure, tamper-resistant time source and fast-access NV storage. Use Value: Enables seamless resume-from-suspend and prevents rollback attacks using battery-backed monotonic time counters. |
| POS Terminals | Industrial Fire Alarms |
Use Scenario: Recording transaction timestamps, audit logs, and tax-reporting data that must survive AC mains failure or battery depletion. IC Role / Device Role / Timing Role: Real-time clock with guaranteed data retention ensures legally compliant fiscal logging even during extended outages. Use Value: Meets PCI PTS and EMVCo requirements for time-stamped, non-erasable transaction records. |
Use Scenario: Logging alarm activation times, sensor fault histories, and maintenance intervals in life-safety systems requiring 24/7 reliability. IC Role / Device Role / Timing Role: UL-recognized RTC/SRAM combo provides certified timekeeping and event storage under NFPA 72 compliance. Use Value: Supports mandatory 90-day incident reporting windows with battery-backed integrity verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile memory with integrated RTC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS1250W-100+ | Lacks integrated RTC and battery charger; requires external crystal and discrete backup power path | Suitable only where RTC functionality is handled externally or unnecessary | Choose only if existing design already implements RTC separately and cost sensitivity outweighs integration benefits |
| MAX6900AWE+T | RTC-only IC (no SRAM); 32kbit EEPROM instead of 4Mb NV SRAM; no battery charging circuitry | Requires companion SRAM and external battery management for full DS3050W-100# functionality | Select when system-level power architecture mandates modular RTC and memory, or when lower memory density suffices |
Compared with DS1250W-100+ and MAX6900AWE+T, DS3050W-100# uniquely consolidates SRAM, RTC, and battery management into one reflowable BGA-reducing PCB area by >40%, eliminating external crystal load matching, and guaranteeing synchronized time/data retention without inter-component timing skew.
Availability
DS3050W-100# is available at Aetrix Electronics and suitable for RAID systems, industrial fire alarms, and POS terminals requiring stable component supply with long-term lifecycle assurance and RoHS-compliant manufacturing.
Supply support for DS3050W-100# includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, computing, and communications infrastructure.
The DS3050W-100# belongs to Maxim's nonvolatile memory product line, engineered specifically for systems demanding simultaneous high-speed memory access, certified timekeeping, and autonomous power-fail response without external support components.
FAQ
What is the guaranteed data retention duration for DS3050W-100# under battery backup?
The DS3050W-100# provides 2–3 years of data retention per full battery charge, measured at +25°C after two convection reflow cycles and initial 96-hour VCC application. This value is assured by component selection and process control-not production-tested per unit-and assumes proper VTP threshold operation and absence of deep discharge events.
How does DS3050W-100# handle RTC register reads to prevent inconsistent time values?
The DS3050W-100# uses double-buffered RTC registers: the internal set updates continuously, while the external set remains static until explicitly enabled. To read consistent values, users must first set the Read bit (R) in the FLAGS register to halt external updates, then read all 16 registers before clearing R-ensuring atomic capture of day, date, and time without mid-read rollover.
Can DS3050W-100# operate as a watchdog timer during battery-backup mode?
Yes-the DS3050W-100# watchdog timer remains fully functional during battery-backup mode. When enabled (WDS = 0), it asserts IRQ/FT on timeout and sets the Watchdog Flag (WF). Timeout period is programmable via the WATCHDOG register (e.g., 0Eh = 3 seconds), and the timer resets on any read/write to that register-even while powered solely by the ML battery.
What is the function of the FT bit in DS3050W-100# frequency test mode?
The FT (Frequency Test) bit in DS3050W-100# enables 512Hz square-wave output on IRQ/FT when active, allowing direct measurement of the 32.768kHz RTC oscillator's actual frequency. It requires OSC = 1, AE = 0, and WDS = 1 (or WATCHDOG = 00h), and resets to 0 on power-up-making it a one-time diagnostic tool per power cycle.
Does DS3050W-100# require external pull-up resistors on RST and IRQ/FT pins?
Yes-both RST and IRQ/FT are open-drain outputs per DS3050W-100# datasheet Note 1. External pull-up resistors (typically 4.7kΩ to VCC) are mandatory to establish valid logic-high levels; absence of pull-ups will result in undefined or floating states during inactive periods, risking system instability or false interrupts.
DS3050W-100# Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- NVSRAM
- Technology:
- NVSRAM (Non-Volatile SRAM)
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 100ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-BGA (27x27)
DS3050W-100# FAQ
1.How can I place an order for DS3050W-100# through Aetrix?
Please submit a Request for Quotation (RFQ) for DS3050W-100# on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS3050W-100# reliable?
The price and inventory of DS3050W-100# are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3050W-100# is usually 5 days.
3.What payment methods are accepted for DS3050W-100#?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3050W-100# transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS3050W-100#?
DS3050W-100# orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS3050W-100# order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS3050W-100#?
For technical support, including DS3050W-100# datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3050W-100# requirements.
6.How does Aetrix verify that DS3050W-100# is sourced from the original manufacturer or authorized distributors?
All DS3050W-100# products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3050W-100# meets industry standards.
7.What is the process for return or replacement of DS3050W-100#?
All DS3050W-100# units undergo pre-shipment inspection (PSI). If there is an issue with DS3050W-100#, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS3050W-100# part is unused and in its original packaging.
Return procedure for DS3050W-100#:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS3050W-100# Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

