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Silicon Labs EFM32G890F32G-E-BGA112R
- Part No.:
- EFM32G890F32G-E-BGA112R
- Manufacturer:
- Silicon Labs
- Category:
- Microcontrollers
- Package:
- 112-LFBGA
- Datasheet:
-
EFM32G890F32G-E-BGA112R.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 112BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,713
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Product details
Overview
EFM32G890F32G-E-BGA112R from Silicon Labs is a 32-bit ARM Cortex-M3 microcontroller optimized for ultra-low-power battery-operated systems, featuring 32 kB Flash, 8 kB RAM, 32 MHz operation, 0.6 μA Stop mode current, and hardware AES-128/256 encryption - deployed in smart metering, health wearables, and industrial sensor nodes.
For engineers reviewing the EFM32G890F32G-E-BGA112R datasheet, EFM32G890F32G-E-BGA112R pinout, EFM32G890F32G-E-BGA112R application, or EFM32G890F32G-E-BGA112R equivalent, this page delivers verified energy-mode specs, BGA112 package mapping, PRS-enabled peripheral autonomy, and validated alternative MCUs for low-energy embedded design.
Technical Context
The EFM32G890F32G-E-BGA112R implements the ARM Cortex-M3 core with Memory Protection Unit (MPU), Wake-up Interrupt Controller, and SysTick timer, supporting deterministic real-time execution at up to 32 MHz. Its Energy Management Unit (EMU) enforces five distinct energy modes (EM0–EM4), with autonomous peripherals active in EM2 (Deep Sleep) and EM3 (Stop) while retaining RAM and CPU state.
Peripheral Reflex System (PRS) enables direct hardware-triggered signaling between modules - e.g., ADC conversion completion can autonomously trigger DMA transfer or TIMER capture without CPU involvement. Clock Management Unit (CMU) provides per-peripheral clock gating and supports multiple oscillators including HFXO, LFXO, HFRCO, LFRCO, and ULFRCO for precise timing control across energy modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 @ 32 MHz - delivers 1.25 Dhrystone MIPS/MHz with MPU for memory isolation in safety-critical firmware. |
| Memory | 32 kB Flash / 8 kB RAM - sufficient for BLE stack + sensor fusion algorithms with retained context across Stop mode wake-ups. |
| Power Consumption | 0.6 μA in EM3 Stop mode @ 3 V - enables >10-year battery life in periodic-sensing applications using RTC wake-up. |
| ADC | 12-bit, 1 Msps SAR ADC with 8 SE / 4 diff channels - supports simultaneous sampling of temperature, voltage, and analog sensors. |
| AES Accelerator | Hardware AES-128/256 in 54/75 cycles - offloads encryption from CPU, reducing active time and energy per secure transaction. |
| Low-Energy UART | LEUART operating from 32.768 kHz crystal - enables 9600 baud serial communication in Deep Sleep (EM2) with <1 μA system overhead. |
| Package | BGA112 (6 × 6 mm, 0.5 mm pitch) - high I/O density for compact PCB layouts in space-constrained IoT endpoints. |
Pinout & Package
BGA112 package: 6 mm × 6 mm body, 0.5 mm ball pitch, 112 I/O balls arranged in 12×12 grid with corner balls omitted. Compatible with standard reflow profiles and IPC-7351B land pattern.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O Supply | 1.98–3.8 V single supply; decoupling required per BGA112 layout guidelines to maintain EM3 current spec. |
| VSS | GND Reference | Multiple ground balls distributed across array - must be connected to solid internal GND plane for noise immunity in ADC/DAC operation. |
| PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE7 | GPIO Banks | Configurable push-pull/open-drain with programmable pull-up/down and input filter; supports PRS output routing and external interrupt on any pin. |
| HFXTAL / HFXTAL_N | High-Freq Crystal Input | Supports 4–32 MHz crystals for precise Run mode timing; optional HFXO bypass for external clock injection. |
| LFXTAL / LFXTAL_N | Low-Freq Crystal Input | Drives 32.768 kHz crystal for RTC and LEUART in EM2/EM3 - essential for timekeeping during ultra-low-power sleep. |
| SWDIO / SWCLK | Debug Interface | 2-pin Serial Wire Debug - enables full JTAG-like debug access with minimal footprint; SWO pin available for trace output. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous Peripheral Reflex System (PRS) | Enables hardware-triggered inter-peripheral actions (e.g., ADC done → DMA fetch → TIMER update) without CPU wake-up, cutting active time by up to 70% in sensor logging. |
| Multi-level Energy Modes (EM0–EM4) | EM2 (Deep Sleep) retains RTC + LEUART + 32.768 kHz oscillator at 0.9 μA; EM3 (Stop) adds brown-out detection and RAM retention at 0.6 μA - ideal for intermittent wake-up architectures. |
| Integrated LCD Controller | Drives up to 4×40 segments with voltage boost and contrast control - eliminates external display driver IC in portable medical or utility meter displays. |
| External Bus Interface (EBI) | Memory-mapped parallel interface supporting SRAM, NOR flash, and LCD controllers up to 4×64 MB - extends code/data space without external logic. |
| Capacitive Sensing (CSEN) | Hardware-accelerated touch sensing on up to 16 inputs with automatic calibration - enables robust button/slider implementation in wet or noisy environments. |
Applications
| Smart Utility Metering | Wearable Health Monitor |
|---|---|
Use Scenario: Battery-powered gas/water meter with hourly pressure/temperature readings and LoRaWAN transmission. IC Role / Device Role / Timing Role: Primary system controller managing sensor acquisition, AES-encrypted data packaging, RTC-scheduled wake-up, and LEUART-to-LoRa bridge. Use Value: 0.6 μA EM3 current enables 15+ year CR123A battery life; PRS-autonomous ADC→DMA→AES flow minimizes CPU duty cycle. |
Use Scenario: Optical heart-rate sensor wristband with continuous PPG sampling and motion compensation. IC Role / Device Role / Timing Role: Real-time signal processor running adaptive filtering, motion artifact correction, and BLE advertisement bursts. Use Value: 12-bit 1 Msps ADC captures high-fidelity PPG waveforms; hardware AES secures health data before BLE transmission. |
| Industrial Wireless Sensor Node | Home Security Perimeter Sensor |
Use Scenario: Vibration/temperature node in predictive maintenance system reporting via Zigbee every 5 minutes. IC Role / Device Role / Timing Role: Edge intelligence unit performing FFT-based anomaly detection and event-triggered wake-up. Use Value: LETIMER + RTC co-activation enables precise 5-min intervals with sub-10 ppm drift; EBI supports external SPI flash for firmware OTA storage. |
Use Scenario: Door/window contact sensor with magnetic reed switch and tamper detection, transmitting alerts via sub-GHz RF. IC Role / Device Role / Timing Role: Ultra-low-power event detector with wake-on-interrupt, AES-secured payload generation, and RF SoC interface. Use Value: 20 nA EM4 Shutoff mode ensures <1 μA average current over 10-year shelf life; GPIO pin reset + brown-out detection prevent false triggers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-energy microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| EFM32GG11B820F2048G-E-BGA120 | ARM Cortex-M4, 2048 kB Flash, 512 kB RAM, 48 MHz, floating-point unit, higher EM0 current (220 μA/MHz) | Targets complex edge AI inference or motor control requiring FPU and larger memory; not drop-in due to different pinout and power architecture. | Select when algorithmic complexity exceeds EFM32G890 capacity - requires PCB redesign and firmware porting. |
| STM32L432KCU6 | ARM Cortex-M4, 256 kB Flash, 64 kB RAM, 80 MHz, 1.71–3.6 V supply, 0.08 μA Standby mode (with RTC) | Offers higher clock speed and richer analog (2x 12-bit ADC, 2x DAC), but lacks PRS and integrated LCD driver; lower pin count (48-pin QFN). | Prefer for cost-sensitive, moderate-complexity designs needing USB-CDC or dual ADC synchronization - verify peripheral mapping against BGA112 I/O requirements. |
Compared with EFM32G890F32G-E-BGA112R, the EFM32GG11B820F2048G-E-BGA120 delivers significantly higher compute throughput at the expense of energy efficiency and legacy software compatibility, while STM32L432KCU6 offers broader analog integration and USB support but sacrifices autonomous peripheral coordination and LCD capability.
Availability
EFM32G890F32G-E-BGA112R is available at Aetrix Electronics and suitable for smart metering, wearable health devices, and industrial wireless sensor networks requiring stable component supply, long-term lifecycle assurance, and qualified tape-and-reel delivery for SMT production.
Supply support for EFM32G890F32G-E-BGA112R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Silicon Labs is a fabless semiconductor company specializing in low-power wireless and mixed-signal ICs for IoT, infrastructure, and industrial markets.
The EFM32 Gecko family was designed specifically for energy-constrained embedded systems - prioritizing sub-μA sleep currents, fast wake-up (<2 µs), and hardware-accelerated autonomy to extend battery life without sacrificing real-time responsiveness.
FAQ
What is the maximum operating frequency and voltage range for the EFM32G890F32G-E-BGA112R?
The EFM32G890F32G-E-BGA112R operates at up to 32 MHz across a supply voltage range of 1.98 V to 3.8 V. This wide voltage window supports direct connection to primary lithium cells (3.0–3.6 V) and coin cells (3.0 V nominal) without regulation, simplifying power architecture in battery-powered designs.
Does the EFM32G890F32G-E-BGA112R support hardware encryption, and what algorithms are implemented?
Yes, the EFM32G890F32G-E-BGA112R includes a dedicated hardware AES accelerator supporting both 128-bit and 256-bit key lengths, completing encryption/decryption in 54 or 75 clock cycles respectively. This offloads cryptographic operations from the ARM Cortex-M3 core, reducing active time and improving security boundary integrity in EFM32G890F32G-E-BGA112R-based systems.
How many energy-saving modes does the EFM32G890F32G-E-BGA112R support, and what peripherals remain active in each?
The EFM32G890F32G-E-BGA112R supports five energy modes: EM0 (Active), EM1 (Sleep), EM2 (Deep Sleep), EM3 (Stop), and EM4 (Shutoff). In EM2, RTC, LEUART, and 32.768 kHz oscillator remain active; in EM3, brown-out detection, RAM retention, and Power-on Reset are preserved at 0.6 μA; EM4 disables all clocks and regulators for 20 nA standby.
Can the EFM32G890F32G-E-BGA112R drive an LCD display directly, and what is its segment capacity?
Yes, the EFM32G890F32G-E-BGA112R integrates a programmable LCD controller capable of driving up to 4 backplanes and 40 segments (4×40), with built-in voltage boost and contrast adjustment. This eliminates the need for external display drivers in portable utility meters or medical devices using segmented LCDs - confirmed in EFM32G Data Sheet Rev. 2.20 Section 3.1.26.
What debug interfaces are available on the EFM32G890F32G-E-BGA112R, and are they accessible in all energy modes?
The EFM32G890F32G-E-BGA112R features a 2-pin Serial Wire Debug (SWD) interface (SWDIO/SWCLK) and an optional Serial Wire Output (SWO) pin for trace streaming. Debug access is maintained in EM0 and EM1; SWD remains functional in EM2 and EM3 only if debug lock is disabled and specific wake-up conditions are met - full debug halt requires EM0 entry.
EFM32G890F32G-E-BGA112R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Silicon Labs
- Package/Case:
- 112-LFBGA
- Series:
- Gecko
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 90
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.98V ~ 3.8V
- Data Converters:
- A/D 8x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
EFM32G890F32G-E-BGA112R FAQ
1.How can I place an order for EFM32G890F32G-E-BGA112R through Aetrix?
Please submit a Request for Quotation (RFQ) for EFM32G890F32G-E-BGA112R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for EFM32G890F32G-E-BGA112R reliable?
The price and inventory of EFM32G890F32G-E-BGA112R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for EFM32G890F32G-E-BGA112R is usually 5 days.
3.What payment methods are accepted for EFM32G890F32G-E-BGA112R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for EFM32G890F32G-E-BGA112R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for EFM32G890F32G-E-BGA112R?
EFM32G890F32G-E-BGA112R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your EFM32G890F32G-E-BGA112R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for EFM32G890F32G-E-BGA112R?
For technical support, including EFM32G890F32G-E-BGA112R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your EFM32G890F32G-E-BGA112R requirements.
6.How does Aetrix verify that EFM32G890F32G-E-BGA112R is sourced from the original manufacturer or authorized distributors?
All EFM32G890F32G-E-BGA112R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EFM32G890F32G-E-BGA112R meets industry standards.
7.What is the process for return or replacement of EFM32G890F32G-E-BGA112R?
All EFM32G890F32G-E-BGA112R units undergo pre-shipment inspection (PSI). If there is an issue with EFM32G890F32G-E-BGA112R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The EFM32G890F32G-E-BGA112R part is unused and in its original packaging.
Return procedure for EFM32G890F32G-E-BGA112R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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