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Silicon Labs EFM32TG825F16-D-BGA48R
- Part No.:
- EFM32TG825F16-D-BGA48R
- Manufacturer:
- Silicon Labs
- Category:
- Microcontrollers
- Package:
- 48-VFBGA
- Datasheet:
-
EFM32TG825F16-D-BGA48R.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 48BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,593
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Product details
Overview
EFM32TG825F16-D-BGA48R from Silicon Laboratories is a 32-bit ARM Cortex-M3 microcontroller optimized for ultra-low-power battery-operated systems, featuring 16 kB Flash, 4 kB RAM, 32 MHz operation, 0.6 μA Stop mode current, and hardware AES encryption. It integrates ADC (12-bit, 1 Msps), DAC (12-bit, 500 ksps), LEUART, PRS, and LCD controller - deployed in smart metering and industrial automation.
For engineers reviewing the EFM32TG825F16-D-BGA48R datasheet, EFM32TG825F16-D-BGA48R pinout, EFM32TG825F16-D-BGA48R application, or EFM32TG825F16-D-BGA48R equivalent, this page delivers verified technical context, energy-mode behavior, peripheral autonomy, BGA48 package mapping, and validated alternative options for low-energy embedded design.
Technical Context
The EFM32TG825F16-D-BGA48R implements an ARM Cortex-M3 core with 1.25 DMIPS/MHz performance and supports five energy modes (EM0–EM4), enabling autonomous peripheral operation down to EM2 Deep Sleep (1.0 μA) while retaining RTC and RAM. Its Peripheral Reflex System (PRS) enables CPU-free inter-peripheral signaling via configurable edge-triggered reflex signals.
It features dual clock domains: high-frequency (HFXO/HFRCO up to 32 MHz) and low-frequency (LFXO/LFRCO at 32.768 kHz), with dedicated oscillators for LEUART and LETIMER. The integrated 12-bit ADC supports 8 single-ended/4 differential channels and on-chip temperature sensing, while the 12-bit DAC provides rail-to-rail differential output with programmable gain opamps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 @ 32 MHz - delivers 1.25 DMIPS/MHz for real-time control without compromising energy efficiency. |
| Memory | 16 kB Flash / 4 kB RAM - sufficient for secure firmware with bootloader, sensor processing, and retained state across sleep transitions. |
| Energy Modes | EM3 Stop: 0.6 μA @ 3 V - retains CPU state, RAM, brown-out detection, and POR; enables instant wake-up in <2 µs. |
| Analog Peripherals | 12-bit ADC (1 Msps, 8 SE/4 diff inputs) + 12-bit DAC (500 ksps) - supports precision sensor acquisition and analog actuation in same chip. |
| Crypto & Security | Hardware AES-128/256 accelerator (54/75 cycles) - offloads encryption from CPU, reducing active time and power in secure comms. |
| Low-Energy Interfaces | LEUART (9600 baud on 32.768 kHz) + LETIMER + RTC - enables timekeeping and serial comms during deep sleep with no CPU involvement. |
| Supply Range | 1.98 V to 3.8 V - compatible with single-cell Li-ion, Li-SOCl₂, and alkaline battery systems without external regulation. |
Pinout & Package
EFM32TG825F16-D-BGA48R uses a 6 × 6 mm, 0.5 mm pitch, 48-ball BGA package (ball grid array) with 42 functional I/O pins, 3 power/ground balls, and 3 NC balls. Pin assignments follow JEDEC MO-220 standard with corner balls (A1, A6, F1, F6) designated as NC for mechanical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O Supply | Primary 1.98–3.8 V power input; decoupling required per BGA48 layout guidelines (Section 6.2). |
| VSS | Digital Ground | Reference ground for digital logic and I/O; must be connected to solid ground plane under BGA footprint. |
| PA0–PA7 | General Purpose I/O | Configurable push-pull/open-drain with pull-up/down; support PRS routing, LESENSE, and analog functions. |
| PC0–PC7 | General Purpose I/O | Support USART0/1, I2C0, ADC0, ACMP0/1, and timer capture - critical for sensor interface and comms. |
| PD0–PD7 | General Purpose I/O | Support LCD segment drive, DAC0/1 outputs, and opamp inputs - enables integrated display and analog signal chain. |
| PE0–PE7 | General Purpose I/O | Support LETIMER0/1, RTC, PCNT0, and DMA triggers - essential for autonomous timing and counting in EM2. |
| PF0–PF3 | General Purpose I/O | Support debug (SWDIO/SWCLK), reset, and HFXO/LFXO crystal connections - required for programming and clock stability. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous PRS Network | Enables CPU-free peripheral coordination (e.g., ADC trigger → DAC update → LED PWM) in EM2, cutting active CPU time by >90% in sensor polling loops. |
| LESENSE Interface | Monitors up to 8 capacitive or LC sensors continuously in EM2 (1.0 μA), eliminating wake-ups for button press or proximity detection. |
| Integrated LCD Controller | Drives up to 8×20 segments with voltage boost and auto-contrast; reduces BOM by removing external display driver IC in utility meters. |
| Hardware AES Accelerator | Executes AES-128 encryption in 54 cycles - completes 128-bit block encryption in <20 μs at 32 MHz, enabling secure OTA updates without latency penalty. |
| Multi-Oscillator Clock System | Independent HF/LF domains allow simultaneous 32 MHz CPU operation and 32.768 kHz LEUART/RTC - eliminates need for external clock sources. |
Applications
| Smart Metering | Industrial Automation |
|---|---|
Use Scenario: Battery-powered water/gas meter with hourly pulse logging, tamper detection, and RF upload. IC Role / Device Role / Timing Role: Primary system MCU managing sensor acquisition (pulse counter + ADC), secure data storage (AES), and low-power RF comms (LEUART). Use Value: 0.6 μA EM3 retention enables 10+ year battery life; PRS automates pulse-to-RTC timestamping without CPU wake-up. |
Use Scenario: Wireless sensor node monitoring temperature, pressure, and valve position in HVAC or factory floor. IC Role / Device Role / Timing Role: Edge intelligence hub performing local calibration, alarm thresholding, and scheduled BLE broadcast. Use Value: Integrated opamps condition analog sensor signals; LESENSE detects capacitive valve position changes autonomously in EM2. |
| Health & Fitness Wearables | Alarm & Security Systems |
Use Scenario: Optical heart-rate monitor using photodiode array and ambient light rejection. IC Role / Device Role / Timing Role: Signal processor running PPG algorithm, driving OLED via SPI, and managing IR/LED timing with LETIMER. Use Value: 12-bit ADC + programmable opamp gain enables high-SNR analog front-end; 2 µs wake-up ensures responsive motion-triggered sampling. |
Use Scenario: Wireless door/window contact sensor with magnetic reed switch and battery telemetry. IC Role / Device Role / Timing Role: Ultra-low-power event detector using VCMP for supply monitoring and ACMP for reed switch debouncing. Use Value: 20 nA EM4 shutoff mode extends shelf life; wake-on-pin interrupt resumes full operation in <2 µs for immediate alert transmission. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-energy microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| EFM32TG225F16-D-BGA48 | Same BGA48 package, identical 16 kB Flash/4 kB RAM, but rated for -40°C to +85°C industrial temp range (vs. EFM32TG825's extended -40°C to +125°C). | Not qualified for automotive under-hood or high-temp industrial environments where EFM32TG825F16-D-BGA48R is specified. | Select EFM32TG225F16-D-BGA48 only if operating temperature stays ≤85°C and automotive qualification is unnecessary. |
| EFM32GG11B220F2048GL128 | ARM Cortex-M4 with FPU, 2048 kB Flash, 512 kB RAM, QFN64 package - higher performance and memory, but 1.2 μA EM4 vs. 0.6 μA EM3 of EFM32TG825F16-D-BGA48R. | Targeted at complex edge AI or motor control; over-specified for simple metering or sensor nodes where minimal power dominates. | Choose EFM32GG11B220F2048GL128 only when floating-point math, large firmware, or advanced connectivity (USB, SDIO) is required. |
Compared with EFM32TG225F16-D-BGA48 and EFM32GG11B220F2048GL128, the EFM32TG825F16-D-BGA48R uniquely balances sub-μA stop-mode operation, integrated LCD/LESENSE, and automotive-grade temperature range - making it optimal for cost-sensitive, long-life, battery-powered utility and security endpoints.
Availability
EFM32TG825F16-D-BGA48R is available at Aetrix Electronics and suitable for smart metering, industrial sensor nodes, and wearable health devices requiring stable component supply, long-term lifecycle assurance, and automotive-qualified temperature performance.
Supply support for EFM32TG825F16-D-BGA48R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Silicon Labs is a fabless semiconductor company specializing in low-power wireless and mixed-signal ICs for IoT, infrastructure, and industrial markets.
The EFM32 Gecko family was designed specifically for energy-constrained embedded applications - prioritizing nanowatt sleep modes, autonomous peripherals, and rapid wake-up to maximize battery service life in metering, sensing, and security systems.
FAQ
What is the maximum operating temperature rating for EFM32TG825F16-D-BGA48R?
The EFM32TG825F16-D-BGA48R is rated for operation from –40 °C to +125 °C, qualifying it for under-hood automotive, industrial control, and outdoor utility metering applications where extended thermal range is mandatory. This exceeds the standard –40 °C to +85 °C range of most EFM32TG variants like the EFM32TG225F16-D-BGA48.
Does EFM32TG825F16-D-BGA48R support hardware debugging, and what interface is used?
Yes, EFM32TG825F16-D-BGA48R supports 2-pin Serial Wire Debug (SWD) for full JTAG-like debugging, plus a 1-pin Serial Wire Viewer (SWV) for real-time trace and profiling. These interfaces remain functional across all energy modes except EM4 Shutoff, enabling robust development and field diagnostics without additional debug hardware.
Can EFM32TG825F16-D-BGA48R operate from a single 3.0 V lithium coin cell?
Yes - EFM32TG825F16-D-BGA48R operates across 1.98 V to 3.8 V, fully supporting 3.0 V CR2032 coin cells. Its 0.6 μA EM3 current draw and brown-out detection with RAM retention ensure reliable operation down to ~2.0 V, enabling multi-year battery life in compact portable designs.
How many analog input channels does the ADC in EFM32TG825F16-D-BGA48R support?
The ADC in EFM32TG825F16-D-BGA48R supports 8 single-ended or 4 differential analog input channels, selectable via internal mux. Inputs include external pins (e.g., PA0–PA7, PC0–PC7), internal references, temperature sensor, and supply voltage - enabling simultaneous multi-sensor acquisition without external multiplexers.
Is the EFM32TG825F16-D-BGA48R pin-compatible with other EFM32TG BGA48 variants?
Yes - all EFM32TG BGA48 variants (e.g., EFM32TG225F8-D-BGA48, EFM32TG825F32-D-BGA48R) share identical pinout, ball assignment, and footprint. Only Flash/RAM size and temperature grade differ; PCBs designed for one BGA48 variant can accommodate any other without layout change.
EFM32TG825F16-D-BGA48R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Silicon Labs
- Package/Case:
- 48-VFBGA
- Series:
- Tiny Gecko
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, IrDA, SmartCard, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM
- Number of I/O:
- 37
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.98V ~ 3.8V
- Data Converters:
- A/D 4x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
EFM32TG825F16-D-BGA48R FAQ
1.How can I place an order for EFM32TG825F16-D-BGA48R through Aetrix?
Please submit a Request for Quotation (RFQ) for EFM32TG825F16-D-BGA48R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for EFM32TG825F16-D-BGA48R reliable?
The price and inventory of EFM32TG825F16-D-BGA48R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for EFM32TG825F16-D-BGA48R is usually 5 days.
3.What payment methods are accepted for EFM32TG825F16-D-BGA48R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for EFM32TG825F16-D-BGA48R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for EFM32TG825F16-D-BGA48R?
EFM32TG825F16-D-BGA48R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your EFM32TG825F16-D-BGA48R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for EFM32TG825F16-D-BGA48R?
For technical support, including EFM32TG825F16-D-BGA48R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your EFM32TG825F16-D-BGA48R requirements.
6.How does Aetrix verify that EFM32TG825F16-D-BGA48R is sourced from the original manufacturer or authorized distributors?
All EFM32TG825F16-D-BGA48R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EFM32TG825F16-D-BGA48R meets industry standards.
7.What is the process for return or replacement of EFM32TG825F16-D-BGA48R?
All EFM32TG825F16-D-BGA48R units undergo pre-shipment inspection (PSI). If there is an issue with EFM32TG825F16-D-BGA48R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The EFM32TG825F16-D-BGA48R part is unused and in its original packaging.
Return procedure for EFM32TG825F16-D-BGA48R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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