Infineon Technologies ESD110B102ELSE6327XTSA1
- Part No.:
- ESD110B102ELSE6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESD110B102ELSE6327XTSA1.pdf
- Description:
- TVS DIODE 18.5VWM 17VC TSSLP-2-4
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ESD110B102ELSE6327XTSA1 from Infineon Technologies is a one-line bi-directional protection device designed for ESD, EFT, surge, and transient suppression in exposed electronic interfaces. The device belongs to the ESD110-B1-02ELS protection family and is selected where working voltage, capacitance, clamping behavior, package footprint, and protected-line count must match the target circuit.
As an configuration of the ESD110-B1-02ELS family, ESD110B102ELSE6327XTSA1 combines ±18.5 V working-voltage class, 0.3 pF typical, ±12 kV IEC61000-4-2, and a 0201 (0603 Metric) package. For engineers reviewing the ESD110B102ELSE6327XTSA1 datasheet, ESD110B102ELSE6327XTSA1 pinout, ESD110B102ELSE6327XTSA1 application, or ESD110B102ELSE6327XTSA1 equivalent, this device is commonly relevant to NFC and near-field interface protection, connector-side protection, compact embedded boards, and system-level immunity design.
Technical Context
In a board-level protection design, ESD110B102ELSE6327XTSA1 should be placed close to the connector, exposed signal entry point, RF feed, control line, or supply node that may receive an ESD or surge event. Short routing is important because trace inductance can raise the residual voltage seen by the protected IC during fast IEC discharge pulses.
The bi-directional structure, ±18.5 V working-voltage class, and 0.3 pF typical determine where the device can be used without excessive signal loading or unwanted clipping during normal operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Device Type | One-line bi-directional protection device for line-level ESD and transient suppression. |
| Protection Function | One-line bi-directional clamping behavior matched to the ESD110-B1-02ELS family. |
| Working Voltage | ±18.5 V, defining the normal voltage range that should not trigger the protection structure. |
| Line Capacitance | 0.3 pF typical, important for RF, high-speed, audio, touchscreen, sensor, control, or power-line loading. |
| ESD Rating | ±12 kV IEC61000-4-2, supporting system-level ESD robustness when the PCB layout provides a short discharge path. |
| EFT Rating | 50 A 5/50 ns, relevant to cable-connected and industrial environments where fast electrical transients may occur. |
| Surge / Peak Pulse Rating | 3 A 8/20 µs, defining the short-duration pulse capability for non-repetitive transient events. |
| Clamping Behavior | 14 V typical at 16 A TLP, which determines the residual voltage presented to the protected IC during a transient. |
| Reverse Leakage | low reverse leakage suitable for protected signal lines, supporting low-current or high-impedance protected signal paths. |
| Package | 0201 (0603 Metric) package, selected for placement close to connectors or protected IC pins. |
| Packing | Tape & Reel (TR) for SMT assembly and procurement handling. |
| Lifecycle / Design Status | verify latest Infineon lifecycle status before new production use. |
Pinout & Package
The ESD110B102ELSE6327XTSA1 pinout should be reviewed as a protection-device connection rather than a functional logic pinout. The relevant connections are the protected line terminal, reference or ground terminal where present, and any additional line terminals used by multi-line array versions.
For PCB design, ESD110B102ELSE6327XTSA1 should be placed ahead of the sensitive IC and close to the transient entry point. Land pattern, package orientation, solder mask, stencil opening, and inspection process should follow the manufacturer package drawing for the 0201 (0603 Metric) package.
| Pin / Function | PCB Design and Circuit Role |
|---|---|
| Protected Line Pin(s) | Connect to the exposed signal, data, RF, supply, or interface line protected by ESD110B102ELSE6327XTSA1. |
| Ground / Reference Pin | Connect directly to the local ground or reference return where the package configuration provides a dedicated return pin. |
| Bi-Directional Connection | For bi-directional options, the diode structure clamps positive and negative ESD stress around the protected line. |
| Uni-Directional Connection | For uni-directional options, orientation and return path must match the datasheet schematic and system polarity. |
| Package Footprint | 0201 (0603 Metric) footprint should be verified against the Infineon package drawing before PCB release. |
| Connector-Side Placement | Place the device close to the connector or transient entry point with short traces and low loop inductance. |
Key Features
- One-line bi-directional protection for ESD and transient protection use.
- Working-voltage class: ±18.5 V.
- Line-capacitance class: 0.3 pF typical.
- ESD robustness: ±12 kV IEC61000-4-2.
- EFT capability: 50 A 5/50 ns.
- Surge or peak-pulse capability: 3 A 8/20 µs.
- Clamping behavior: 14 V typical at 16 A TLP.
- 0201 (0603 Metric) package supports close placement at exposed interfaces.
- Tape & Reel (TR) supports SMT manufacturing flow.
- RoHS, lead-free, halogen-free, MSL, and lifecycle status should be verified from the exact documentation.
Applications
| Mobile and Consumer Electronics | Connector and Cable Interfaces |
|---|---|
Use Scenario: Smartphones, tablets, wearables, accessories, camera modules, audio ports, and user-accessible controls. IC Role: ESD110B102ELSE6327XTSA1 provides local ESD suppression on exposed signal lines. Use Value: Improves board-level robustness with a compact SMD footprint. | Use Scenario: External connectors, flex-cable connectors, service ports, test pads, and board-to-board links. IC Role: The device diverts transient current away from sensitive IC pins. Use Value: Short placement near the entry point improves actual clamping effectiveness. |
| Embedded and Industrial Modules | Low-Capacitance Signal Paths |
Use Scenario: Compact control boards, sensor modules, communication interfaces, and equipment requiring IEC ESD immunity. IC Role: ESD110B102ELSE6327XTSA1 provides a defined shunt path for ESD and fast transient current. Use Value: Helps reduce field-failure risk caused by handling discharge or cable discharge. | Use Scenario: Data, audio, keypad, touchscreen, and sensor lines where protection capacitance must be controlled. IC Role: The diode protects the signal path while preserving the intended electrical behavior. Use Value: Supports robust design without a large PCB area penalty. |
Equivalent & Alternatives
When evaluating ESD110B102ELSE6327XTSA1 equivalent devices, engineers should compare working voltage, direction type, capacitance, ESD rating, EFT and surge capability, clamping voltage, dynamic resistance, package footprint, packing, and lifecycle status.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD110-B1-02ELS | Related Infineon protection-device family or package option with different voltage, capacitance, package, or lifecycle details. | Used when the target circuit needs similar ESD protection but can accept the electrical and footprint differences. | Verify VRWM, capacitance, clamping voltage, surge rating, polarity, package land pattern, and approved-source status before substitution. |
| ESD110-B1-02ELSS | Related Infineon protection-device family or package option with different voltage, capacitance, package, or lifecycle details. | Used when the target circuit needs similar ESD protection but can accept the electrical and footprint differences. | Verify VRWM, capacitance, clamping voltage, surge rating, polarity, package land pattern, and approved-source status before substitution. |
| ESD110-B1-02EL | Related Infineon protection-device family or package option with different voltage, capacitance, package, or lifecycle details. | Used when the target circuit needs similar ESD protection but can accept the electrical and footprint differences. | Verify VRWM, capacitance, clamping voltage, surge rating, polarity, package land pattern, and approved-source status before substitution. |
| ESD110-B1-02ELRH | Related Infineon protection-device family or package option with different voltage, capacitance, package, or lifecycle details. | Used when the target circuit needs similar ESD protection but can accept the electrical and footprint differences. | Verify VRWM, capacitance, clamping voltage, surge rating, polarity, package land pattern, and approved-source status before substitution. |
Compared with a generic TVS diode, ESD110B102ELSE6327XTSA1 should be selected by protected-line voltage, capacitance budget, residual clamping voltage, package land pattern, and system-level validation result rather than by package size alone.
Quality
ESD110B102ELSE6327XTSA1 should be sourced as original Infineon Technologies components through traceable and controlled supply channels. Quality verification may include reel-label inspection, package inspection, top-mark review, date-code review, solderability evaluation, and incoming sampling based on production risk.
Because small ESD and TVS devices are often placed at external interfaces, correct storage, ESD-safe handling, MSL control, land-pattern accuracy, and traceability are important for stable assembly yield and reliable field protection.
Availability
ESD110B102ELSE6327XTSA1 available at Aetrix Electronics and suitable for NFC and near-field interface protection, connector-side transient suppression, compact embedded boards, and line-level ESD protection designs requiring traceable component supply.
Supply support may include scheduled delivery planning, tape-and-reel sourcing, BOM continuity assistance, replacement review, and long-term availability support for OEM manufacturers, EMS providers, repair facilities, and embedded hardware developers.
For production deployment, confirming package code, working voltage, capacitance, clamping voltage, ESD rating, lifecycle status, and approved substitute options helps reduce procurement risk and improve manufacturing stability.
Manufacturer
Infineon Technologies supplies semiconductor products including discrete protection devices, power semiconductors, microcontrollers, sensors, security ICs, and system-level components for industrial, automotive, communication, computing, and consumer electronics applications.
The ESD110-B1-02ELS family is part of the manufacturer protection-device portfolio for line-level ESD and transient suppression. ESD110B102ELSE6327XTSA1 is positioned for applications where voltage, capacitance, clamping behavior, and package footprint must match the target PCB.
FAQ
What is ESD110B102ELSE6327XTSA1 used for?
ESD110B102ELSE6327XTSA1 is used for ESD, EFT, surge, and transient protection of exposed signal, RF, interface, or supply lines where compact PCB placement and controlled clamping behavior are required.
Where can I find the ESD110B102ELSE6327XTSA1 datasheet download?
The ESD110B102ELSE6327XTSA1 datasheet or datasheet is available through manufacturer resources for the ESD110-B1-02ELS device family and includes electrical ratings, package data, and ordering information.
What should be considered in ESD110B102ELSE6327XTSA1 pinout design?
Pinout design should focus on device polarity, package orientation, protected-line routing, reference return inductance, and placement close to the connector or transient entry point.
Is ESD110B102ELSE6327XTSA1 suitable for high-speed or RF lines?
It may be suitable when the capacitance and clamping behavior match the signal bandwidth, insertion-loss, interface-voltage, and system-level protection requirements.
What matters most when selecting a ESD110B102ELSE6327XTSA1 equivalent?
Equivalent selection should compare working voltage, capacitance, ESD rating, clamping voltage, dynamic resistance, package footprint, lifecycle status, and validation results.
ESD110B102ELSE6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 18.5V (Max)
- Voltage - Breakdown (Min):
- 20V
- Voltage - Clamping (Max) @ Ipp:
- 17V (Typ)
- Current - Peak Pulse (10/1000µs):
- 2A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- RF Antenna
- Capacitance @ Frequency:
- 0.3pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSSLP-2-4
ESD110B102ELSE6327XTSA1 FAQ
1.How can I place an order for ESD110B102ELSE6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD110B102ELSE6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD110B102ELSE6327XTSA1 reliable?
The price and inventory of ESD110B102ELSE6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD110B102ELSE6327XTSA1 is usually 5 days.
3.What payment methods are accepted for ESD110B102ELSE6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD110B102ELSE6327XTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD110B102ELSE6327XTSA1?
ESD110B102ELSE6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD110B102ELSE6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD110B102ELSE6327XTSA1?
For technical support, including ESD110B102ELSE6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD110B102ELSE6327XTSA1 requirements.
6.How does Aetrix verify that ESD110B102ELSE6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All ESD110B102ELSE6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD110B102ELSE6327XTSA1 meets industry standards.
7.What is the process for return or replacement of ESD110B102ELSE6327XTSA1?
All ESD110B102ELSE6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with ESD110B102ELSE6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD110B102ELSE6327XTSA1 part is unused and in its original packaging.
Return procedure for ESD110B102ELSE6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD110B102ELSE6327XTSA1 Tags

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ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

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ESD5Z3.3T1G
onsemi

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D5V0H1B2LP-7B
Diodes Incorporated

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D5V0P1B2LP-7B
Diodes Incorporated

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DESD5V0U1BA-7
Diodes Incorporated

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ESD5Z5.0T1G
onsemi

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DESD5V0U1BB-7
Diodes Incorporated

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D12V0L1B2LP-7B
Diodes Incorporated

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PESD2V0Y1BSFYL
Nexperia USA Inc.

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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

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D5V0L1B2WS-7
Diodes Incorporated
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