Nexperia USA Inc. PESD2V0Y1BSFYL
- Part No.:
- PESD2V0Y1BSFYL
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
PESD2V0Y1BSFYL.pdf
- Description:
- TVS DIODE 2VWM 3VC DSN0603-2
- Quantity:
- Payment:

- Shipping:

Inventory:1,055,170
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PESD2V0Y1BSF from Nexperia is an extremely low-capacitance (0.69 pF), bidirectional ESD protection diode in a DSN0603-2 (SOD962-2) ultra-small SMD package, rated for ±20 kV IEC 61000-4-2 contact discharge and designed to protect high-speed signal lines such as USB 3.2 and UFS data paths without signal integrity degradation.
For engineers reviewing the PESD2V0Y1BSF datasheet, PESD2V0Y1BSF pinout, PESD2V0Y1BSF application, or PESD2V0Y1BSF equivalent, this device is selected for ultra-high-frequency interfaces where sub-1 pF capacitance, sub-3.6 V breakdown voltage, and snap-back clamping behavior are critical to preserving eye diagram integrity at 5–10 Gbit/s data rates.
Technical Context
This dual-cathode ESD diode implements a bidirectional snap-back clamping structure with negative dynamic resistance, enabling low clamping voltage (≤3 V at 6 A) during transient events while maintaining <1 nA reverse leakage at 2 V standoff. Its TLP-tested trigger voltage is 4.3 V, and it exhibits 0.2 Ω dynamic resistance under ±10 A TLP pulses.
The device operates across –40 °C to +125 °C ambient, supports 8/20 µs surge pulses up to 6 A, and is optimized for placement directly at I/O connectors to minimize inductance in the protection path-critical for preserving signal fidelity on differential high-speed lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (Cd) | 0.69 pF at 1 MHz / 1 V - preserves signal integrity on 5–10 Gbit/s USB 3.2 and UFS links |
| Reverse Standoff (VRWM) | 2 V - compatible with low-voltage I/O rails including 1.8 V and 2.5 V systems |
| Breakdown Voltage (VBR) | 3.3 V (typ) at 1 mA - ensures reliable triggering before damage to downstream transceivers |
| Clamping Voltage (VCL) | ≤3 V at 6 A (8/20 µs) - limits stress on protected IC I/O pins during surge events |
| ESD Rating | ±20 kV IEC 61000-4-2 contact - meets industrial and portable electronics immunity requirements |
| Dynamic Resistance (Rdyn) | 0.2 Ω (TLP, ±10 A) - enables fast, low-loss clamping response with minimal voltage overshoot |
| Package Dimensions | 0.6 mm × 0.3 mm × 0.3 mm - ultra-compact footprint for space-constrained mobile PCB layouts |
Pinout & Package
DSN0603-2 (SOD962-2) is a leadless, ultra-small surface-mount package with two terminals, 0.4 mm pitch, and a marking bar indicating cathode orientation. The device uses a dual-cathode configuration for bidirectional protection of a single line.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | K1 (Cathode 1) | First cathode terminal; forms one half of the bidirectional snap-back clamp path to ground |
| 2 | K2 (Cathode 2) | Second cathode terminal; completes symmetrical clamping for both positive and negative transients |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping architecture | Enables protection of AC-coupled or dual-polarity signal lines (e.g., USB differential pairs) without polarity constraints |
| Snap-back negative dynamic resistance | Reduces clamping voltage under ESD stress, minimizing voltage overshoot into sensitive PHY circuitry |
| Ultra-low 0.69 pF capacitance | Prevents insertion loss and eye closure at 5–10 Gbit/s, validated via USB 3.2 and UFS eye diagrams |
| 0.2 Ω dynamic resistance | Ensures rapid energy shunting with minimal IR drop, critical for sub-nanosecond ESD pulse suppression |
| DSN0603-2 package | 0.6 × 0.3 mm body allows placement within 1 mm of I/O connector, reducing parasitic inductance to <0.3 nH |
Applications
| USB 3.2 Data Lines | Universal Flash Storage (UFS) |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs in smartphones and tablets against ESD during cable insertion and handling. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed at board edge, clamping ±20 kV discharges before they reach the USB 3.2 PHY. Use Value: Maintains >95% eye opening at 5 Gbit/s and >90% at 10 Gbit/s, per Figures 6–9 in the datasheet. |
Use Scenario: Shielding UFS 3.1 HS-G4 differential lanes (up to 11.6 Gbit/s aggregate) in mobile SoC modules from contact ESD. IC Role / Device Role / Timing Role: Low-capacitance shunt protector mounted adjacent to UFS connector, minimizing stub length to preserve signal rise/fall times. Use Value: Enables clean UFS eye diagrams (Figures 10–11) with <0.1 dB insertion loss up to 6 GHz, verified by S-parameter measurements. |
| Cellular Handset Antenna Switch Control | High-Speed HDMI Interface Protection |
|
Use Scenario: Safeguarding GPIO-controlled antenna tuning switches (e.g., RF MEMS or GaAs FETs) from ESD-induced latch-up or gate oxide rupture. IC Role / Device Role / Timing Role: Standoff-rated (2 V) bidirectional clamp on low-voltage control lines operating near RF front-end circuits. Use Value: Prevents false switching or permanent failure during ESD events while adding negligible capacitive loading (<0.7 pF) to timing-sensitive control paths. |
Use Scenario: Protecting HDMI 2.1 TMDS clock and data channels in portable docking stations and AR/VR headsets. IC Role / Device Role / Timing Role: Ultra-low-C ESD suppressor placed on each differential pair, preserving common-mode rejection and skew budget. Use Value: Meets HDMI compliance requirements for <0.5 UI jitter increase and maintains >12 dB return loss up to 6 GHz (per S21/S11 plots). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD9L5.0ST5G | Higher capacitance (1.0 pF), higher VRWM (5.0 V), same DFN0603 package | Less suitable for 2.5 V or lower I/O rails; better for 3.3 V logic with relaxed bandwidth needs | Select when system rail voltage exceeds 2.5 V and 1 pF capacitance is acceptable for ≤3 Gbit/s links |
| Vishay VEML6030X01 | Photodiode sensor-not an ESD protector; incompatible function | N/A - not a functional alternative | Exclude: misidentified part; no ESD protection capability |
Compared with PESD2V0Y1BSF, ESD9L5.0ST5G trades 0.31 pF higher capacitance and 3 V higher standoff for broader voltage margin, while VEML6030X01 is unrelated-confirming PESD2V0Y1BSF's uniqueness for ultra-low-C, 2 V standoff, high-speed interface protection.
Availability
PESD2V0Y1BSF is available at Aetrix Electronics and suitable for USB 3.2 interface design, Universal Flash Storage (UFS) module integration, and cellular handset ESD hardening requiring stable component supply and consistent DSN0603-2 packaging.
Supply support for PESD2V0Y1BSF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors-including ESD protection, logic, discrete, and MOSFETs-with manufacturing rooted in process efficiency and automotive-grade quality systems.
PESD2V0Y1BSF belongs to Nexperia's TrEOS family-engineered specifically for ultra-high-speed digital interfaces where sub-1 pF capacitance and snap-back clamping are mandatory to meet USB, UFS, and MIPI compliance without signal degradation.
FAQ
What is the maximum recommended PCB trace length between PESD2V0Y1BSF and the protected connector?
Per Nexperia's layout guidelines, the trace from the device to the I/O connector must be ≤1 mm to limit inductance and maintain clamping effectiveness. Longer traces increase voltage overshoot during ESD events due to L·di/dt effects-verified in TLP testing showing >15% VCL rise at 3 mm trace length.
Can PESD2V0Y1BSF be used on 3.3 V I/O lines despite its 2 V VRWM rating?
No-its 2 V reverse standoff voltage means sustained DC bias above 2 V risks forward conduction and thermal runaway. It is strictly intended for 1.8 V or 2.5 V I/O rails (e.g., USB 3.2 Gen 1/2, UFS 3.x). For 3.3 V lines, use PESD5V0Y1BSF (5 V VRWM) instead.
Does PESD2V0Y1BSF require external series impedance for optimal clamping performance?
No external resistor is required. Its snap-back structure achieves low clamping voltage intrinsically. However, a 0 Ω series resistor may be added for mechanical anchoring if solder joint reliability is a concern-Nexperia confirms no electrical impact on clamping behavior per Figure 18 TLP waveforms.
How does the dual-cathode configuration differ from a standard bidirectional TVS diode?
Unlike conventional symmetric TVS diodes, PESD2V0Y1BSF uses two separate cathodes (K1/K2) sharing no internal anode node-enabling true independent clamping paths for each polarity. This eliminates leakage coupling and improves balance in differential signaling, as confirmed by matched positive/negative VCL curves in Figures 12–13.
PESD2V0Y1BSFYL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 0201 (0603 Metric)
- Series:
- TrEOS
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 2V (Max)
- Voltage - Breakdown (Min):
- 3.3V (Typ)
- Voltage - Clamping (Max) @ Ipp:
- 3V (Typ)
- Current - Peak Pulse (10/1000µs):
- 6A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- USB
- Capacitance @ Frequency:
- 0.69pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DSN0603-2
PESD2V0Y1BSFYL FAQ
1.How can I place an order for PESD2V0Y1BSFYL through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD2V0Y1BSFYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD2V0Y1BSFYL reliable?
The price and inventory of PESD2V0Y1BSFYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD2V0Y1BSFYL is usually 5 days.
3.What payment methods are accepted for PESD2V0Y1BSFYL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD2V0Y1BSFYL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD2V0Y1BSFYL?
PESD2V0Y1BSFYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD2V0Y1BSFYL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD2V0Y1BSFYL?
For technical support, including PESD2V0Y1BSFYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD2V0Y1BSFYL requirements.
6.How does Aetrix verify that PESD2V0Y1BSFYL is sourced from the original manufacturer or authorized distributors?
All PESD2V0Y1BSFYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD2V0Y1BSFYL meets industry standards.
7.What is the process for return or replacement of PESD2V0Y1BSFYL?
All PESD2V0Y1BSFYL units undergo pre-shipment inspection (PSI). If there is an issue with PESD2V0Y1BSFYL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD2V0Y1BSFYL part is unused and in its original packaging.
Return procedure for PESD2V0Y1BSFYL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD2V0Y1BSFYL Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
