Infineon Technologies IDDD04G65C6XTMA1
- Part No.:
- IDDD04G65C6XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- 10-PowerSOP Module
- Datasheet:
-
IDDD04G65C6XTMA1.pdf
- Description:
- DIODE SIL CARB 650V 13A HDSOP-10
- Quantity:
- Payment:

- Shipping:

Inventory:7,511
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IDDD04G65C6XTMA1 from Infineon is a 650 V, 4 A silicon carbide Schottky barrier diode in PG-HDSOP-10-1 package, featuring 1.25 V forward voltage at 4 A and 25 °C, 6.9 nC capacitive charge at 400 V, and 150 V/ns dv/dt ruggedness. It serves as a high-efficiency freewheeling or output rectifier in high-frequency power converters.
For engineers reviewing the IDDD04G65C6XTMA1 datasheet, IDDD04G65C6XTMA1 pinout, IDDD04G65C6XTMA1 application, or IDDD04G65C6XTMA1 equivalent, key selection criteria include reverse voltage rating, forward voltage drop, capacitive charge, thermal resistance (1.6–2.6 K/W), and cathode-anode terminal configuration for PCB layout and thermal management.
Technical Context
This SiC Schottky diode uses Infineon's 6th-generation CoolSiC™ technology with an optimized Schottky metal system, delivering lower Qc × VF figure of merit than prior generations. Its zero recovery charge enables hard-switched operation without reverse recovery losses.
The device operates up to 175 °C junction temperature and exhibits stable reverse leakage (<31 µA at 420 V, 150 °C) and low capacitance (12 pF at 600 V). Its PG-HDSOP-10-1 package integrates exposed cathode pads for enhanced thermal conduction to PCB copper.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 650 V - supports DC-link voltages up to 480 V in PFC and solar inverters |
| VF @ 4 A, 25 °C | 1.25 V - reduces conduction loss by ~20% vs. comparable Si diodes |
| Qc @ 400 V | 6.9 nC - minimizes switching loss during turn-off in high-frequency topologies |
| dv/dt ruggedness | 150 V/ns - withstands fast voltage transients in hard-switched bridge legs |
| RthJC | 1.6–2.6 K/W - enables direct PCB heat sinking without heatsink in ≤100 W designs |
| IF, max (TC = 155 °C) | 4 A - continuous current rating under industrial ambient conditions |
| IR @ 420 V, 150 °C | 31 µA - ensures low standby loss in high-temperature UPS systems |
Pinout & Package
PG-HDSOP-10-1 is a surface-mount, thermally enhanced package with exposed cathode pads on pins 6–10 and isolated anode terminals on pins 3–5; pins 1–2 are no-connect. The package supports reflow soldering only (260 °C peak).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pins 1–2 | No-connect | Electrically isolated; must remain unconnected to avoid parasitic coupling |
| Pins 3–5 | Anode | Single electrically connected anode node; requires low-inductance trace routing |
| Pins 6–10 | Cathode | Parallel-connected cathode terminals with exposed copper pad for thermal transfer to PCB |
Key Features
| Feature | Design Value |
|---|---|
| Low forward voltage | 1.25 V at 4 A/25 °C - directly lowers I²R conduction loss in high-current paths |
| Zero reverse recovery charge | No Qrr - eliminates switching loss and EMI associated with Si diode tail current |
| High dv/dt immunity | 150 V/ns - prevents false turn-on in high-dV/dt half-bridge configurations |
| JEDEC-qualified reliability | Qualified per J-STD-20/JESD22 - validated for industrial temperature cycling and humidity exposure |
| Thermally optimized package | RthJC ≤ 2.6 K/W - allows >50% higher power density vs. TO-220 Si diodes at same footprint |
Applications
| Power Factor Correction (PFC) | Solar Inverter DC-AC Stage |
|---|---|
Use Scenario: Boost PFC stage in 1–3 kW server PSUs operating at 100–300 kHz. IC Role / Device Role / Timing Role: Output rectifier replacing Si fast recovery diodes to eliminate reverse recovery loss. Use Value: Enables >98% efficiency at full load and reduces heatsink volume by 40% due to lower VF and Qc. | Use Scenario: DC-link clamping and freewheeling path in 5–10 kW string inverters. IC Role / Device Role / Timing Role: Bidirectional snubberless freewheeling diode in H-bridge output stage. Use Value: Withstands 150 V/ns transients during IGBT switching and maintains <31 µA leakage at 150 °C ambient. |
| Uninterruptible Power Supply (UPS) | Industrial Motor Drive Inverter |
Use Scenario: Online double-conversion UPS with battery backup and 10–20 kHz PWM. IC Role / Device Role / Timing Role: High-reliability output rectifier in DC-DC isolation stage. Use Value: JEDEC-qualified operation from –55 °C to 175 °C ensures uptime in uncontrolled environments. | Use Scenario: Regenerative braking path in 7.5–15 kW HVAC drives using 16 kHz carrier frequency. IC Role / Device Role / Timing Role: Low-loss freewheeling diode across IGBTs in three-phase inverter leg. Use Value: 6.9 nC Qc reduces switching loss by 35% vs. Si counterpart, enabling smaller gate drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3D04065E (Wolfspeed) | Same 650 V/4 A rating; VF = 1.35 V (typ); Qc = 7.2 nC; TO-220-2L package | Requires mechanical heatsink; higher RthJA limits power density in SMD-only designs | Select when legacy through-hole assembly or higher surge current (IFSM = 35 A) is required |
| STPSC4H065DL (STMicroelectronics) | VF = 1.3 V (typ); Qc = 7.5 nC; DPAK package; RthJC = 3.0 K/W | Lower thermal performance; less dv/dt ruggedness (100 V/ns) | Select when cost sensitivity outweighs efficiency gain and board space is not constrained |
Compared with C3D04065E and STPSC4H065DL, IDDD04G65C6XTMA1 delivers the lowest VF and Qc in its class, combined with superior thermal resistance and dv/dt immunity-making it optimal for compact, high-frequency, high-reliability industrial power supplies.
Availability
IDDD04G65C6XTMA1 is available at Aetrix Electronics and suitable for power factor correction, solar inverters, and uninterruptible power supplies requiring stable component supply, long-term industrial qualification, and consistent parametric performance across temperature.
Supply support for IDDD04G65C6XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy markets.
IDDD04G65C6XTMA1 belongs to the CoolSiC™ 6th-generation SiC Schottky diode product line, engineered specifically for high-efficiency, high-power-density AC-DC and DC-AC conversion in industrial and renewable energy systems.
FAQ
What is the maximum junction temperature and how is it validated?
The maximum junction temperature is 175 °C, validated per JEDEC JESD22-A108 stress testing including temperature cycling (–55 °C to 150 °C) and high-temperature operating life (HTOL) at 175 °C for 1000 hours. Thermal derating curves in the datasheet define safe IF vs. TC operation up to this limit.
Can IDDD04G65C6XTMA1 replace silicon diodes in existing designs without layout changes?
Yes, but only if the PCB footprint matches PG-HDSOP-10-1 and thermal copper area meets ≥6 cm² for cathode cooling. Pinout compatibility exists (anode on pins 3–5, cathode on 6–10), but SiC's faster switching demands tighter gate loop control and reduced stray inductance to avoid overshoot.
Is reflow soldering the only approved assembly method?
Yes-only lead-free reflow soldering is qualified per datasheet Section 2.6. Wave soldering, hand soldering, or infrared reflow exceeding 260 °C peak or >60 seconds above 220 °C will damage the die attach or metallization and void qualification.
How does the 150 V/ns dv/dt rating impact system-level EMI?
This rating means the diode remains immune to false turn-on during rapid voltage transitions typical in 650 V IGBT or SiC MOSFET bridges. It reduces need for snubbers and lowers common-mode EMI generation, simplifying EMI filter design in Class B industrial equipment.
IDDD04G65C6XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolSiC™+
- Package/Case:
- 10-PowerSOP Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Technology:
- SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):
- 650 V
- Current - Average Rectified (Io):
- 13A
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):
- 0 ns
- Current - Reverse Leakage @ Vr:
- 14 µA @ 420 V
- Capacitance @ Vr, F:
- 205pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-HDSOP-10-1
- Operating Temperature - Junction:
- -55°C ~ 175°C
IDDD04G65C6XTMA1 FAQ
1.How can I place an order for IDDD04G65C6XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IDDD04G65C6XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDDD04G65C6XTMA1 reliable?
The price and inventory of IDDD04G65C6XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDDD04G65C6XTMA1 is usually 5 days.
3.What payment methods are accepted for IDDD04G65C6XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDDD04G65C6XTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDDD04G65C6XTMA1?
IDDD04G65C6XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDDD04G65C6XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDDD04G65C6XTMA1?
For technical support, including IDDD04G65C6XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDDD04G65C6XTMA1 requirements.
6.How does Aetrix verify that IDDD04G65C6XTMA1 is sourced from the original manufacturer or authorized distributors?
All IDDD04G65C6XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDDD04G65C6XTMA1 meets industry standards.
7.What is the process for return or replacement of IDDD04G65C6XTMA1?
All IDDD04G65C6XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IDDD04G65C6XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDDD04G65C6XTMA1 part is unused and in its original packaging.
Return procedure for IDDD04G65C6XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IDDD04G65C6XTMA1 Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

