Infineon Technologies IDDD12G65C6XTMA1
- Part No.:
- IDDD12G65C6XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- 10-PowerSOP Module
- Datasheet:
-
IDDD12G65C6XTMA1.pdf
- Description:
- DIODE SIL CARB 650V 34A HDSOP-10
- Quantity:
- Payment:

- Shipping:

Inventory:2,234
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Product details
Overview
IDDD12G65C6XTMA1 from Infineon Technologies is a 650 V, 12 A silicon carbide (SiC) Schottky diode in a Double DPAK (TO-252-2L) package with common-cathode configuration, designed for high-frequency PFC and DC-DC stages in server/telecom power supplies. It delivers zero reverse-recovery charge, 175 °C maximum junction temperature, and purely capacitive switching behavior.
For engineers reviewing the IDDD12G65C6XTMA1 datasheet, IDDD12G65C6XTMA1 pinout, IDDD12G65C6XTMA1 application, or IDDD12G65C6XTMA1 equivalent, key selection criteria include forward current rating, thermal resistance (RthJC = 1.4 K/W), leakage current at 650 V (IR ≤ 150 µA @ Tj = 150 °C), VF matching across dual dies, and common-cathode layout compatibility with interleaved topologies.
Technical Context
This device belongs to Infineon's CoolSiC™ Schottky Diodes Generation 6 family, optimized for 650 V systems requiring high efficiency at elevated switching frequencies. Its unipolar structure eliminates minority-carrier storage, enabling operation up to 1 MHz without reverse-recovery losses.
The common-cathode dual-die configuration supports interleaved boost PFC and half-bridge freewheeling applications. Each die shares a single cathode terminal (Pin 3), with independent anodes (Pins 1 and 2), allowing synchronous conduction control while minimizing layout parasitics and thermal coupling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 650 V - Maximum repetitive reverse voltage; enables use in 400 V DC-link PFC and 800 V DC-DC front-ends with margin. |
| IF(AV) | 12 A - Average forward current per die at TC = 135 °C; supports 1–2 kW interleaved PFC stages with forced-air cooling. |
| VF @ IF = 12 A | 1.7 V typical - Low forward voltage reduces conduction loss by ~30% vs. Si fast recovery diodes at same current. |
| IR @ 650 V, 150 °C | ≤150 µA - Ultra-low leakage enables stable operation in high-temperature telecom rectifiers without thermal runaway. |
| RthJC | 1.4 K/W - Junction-to-case thermal resistance; allows direct mounting to heatsink for compact thermal design in space-constrained PSUs. |
| Tj,max | 175 °C - Enables derated operation at ambient >85 °C without derating penalty, critical for sealed server power modules. |
Pinout & Package
Package: Double DPAK (TO-252-2L), surface-mount, copper-clip construction with exposed thermal pad (Pin 3 = Cathode). Dimensions: 6.7 × 6.2 × 1.0 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode of Die 1 | Independent anode connection for first diode; enables phase-split control in interleaved boost converters. |
| Pin 2 | Anode of Die 2 | Independent anode connection for second diode; permits balanced current sharing between parallel channels. |
| Pin 3 | Common Cathode | Shared cathode node for both dies; minimizes return path inductance and improves EMI performance in high-dv/dt applications. |
Key Features
| Feature | Design Value |
|---|---|
| No reverse-recovery charge (Qrr = 0) | Eliminates turn-off loss and associated EMI spikes in hard-switched PFC, enabling >300 kHz operation without snubbers. |
| Purely capacitive switching | Switching loss scales only with Cj and fsw; predictable, temperature-independent behavior simplifies thermal modeling. |
| 175 °C maximum junction temperature | Supports higher power density designs with reduced heatsink volume and extended lifetime under sustained overload conditions. |
| Common-cathode dual-die integration | Reduces PCB area by ~40% vs. two discrete TO-220 diodes; lowers parasitic inductance and improves current balance in interleaved topologies. |
Applications
| Server Power Supply | Telecom Rectifier |
|---|---|
Use Scenario: 3 kW, 96% efficient, 100–240 VAC input, interleaved continuous conduction mode (CCM) PFC stage. IC Role / Device Role / Timing Role: Freewheeling diode in dual-phase boost converter; conducts during MOSFET off-time with zero reverse recovery. Use Value: Reduces system conduction + switching losses by 1.8 W per phase vs. Si diodes, lowering heatsink requirement by 35%. | Use Scenario: -48 VDC telecom rectifier module with 300–400 VDC input, operating at 85 °C ambient. IC Role / Device Role / Timing Role: Output rectifier in full-bridge LLC secondary; handles bidirectional current during resonant transitions. Use Value: Maintains <150 µA leakage at 150 °C junction, preventing thermal runaway and enabling 10-year field reliability. |
| Solar Microinverter | EV Onboard Charger |
Use Scenario: 350 W microinverter with 60 VDC input, using two-phase interleaved boost before H-bridge inverter. IC Role / Device Role / Timing Role: Boost diode in each phase; operates at 200 kHz with 12 A peak current. Use Value: Enables 98.2% peak efficiency by eliminating Qrr-related losses and reducing EMI filter size by 25%. | Use Scenario: 11 kW AC/DC OBC with dual 3.3 kW interleaved PFC stages feeding a CLLC resonant DC-DC. IC Role / Device Role / Timing Role: Common-cathode diode pair in each PFC leg; synchronously commutated with CoolMOS™ switches. Use Value: Achieves 99.1% PFC efficiency at 230 VAC/50 Hz input, meeting DOE Level VI and EU CoC Tier 2 standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 650 V dual-SiC diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDDD12G65C5XTMA1 | Generation 5; higher VF (1.85 V @ 12 A), RthJC = 1.6 K/W, same pinout. | Limited to ≤250 kHz operation due to higher switching loss; less suitable for ultra-high-density telecom PSUs. | Select when cost sensitivity outweighs efficiency gain and thermal margin is sufficient. |
| STPSC12065DLF | Single-die 12 A, 650 V SiC Schottky in TO-220AC; no common-cathode configuration. | Requires two separate packages and external cathode tie; increases layout area and parasitic inductance. | Select only if board layout constraints prevent Double DPAK placement or dual-channel control is not required. |
Compared with IDDD12G65C5XTMA1 and STPSC12065DLF, IDDD12G65C6XTMA1 delivers superior thermal performance, lower conduction loss, and integrated dual-die topology-making it optimal for high-efficiency, high-power-density interleaved PFC where layout compactness and thermal management are critical.
Availability
IDDD12G65C6XTMA1 is available at Aetrix Electronics and suitable for server power supply, telecom rectifier, and EV onboard charger designs requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IDDD12G65C6XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power, sensor, and automotive ICs, with over 50 years of innovation in power electronics.
IDDD12G65C6XTMA1 belongs to the CoolSiC™ Schottky Diodes Generation 6 product line, engineered specifically for high-frequency, high-efficiency AC-DC and DC-DC conversion in datacenter, telecom, and electric vehicle infrastructure.
FAQ
What is the maximum allowable case temperature for continuous operation?
The device is rated for continuous operation with case temperature (TC) up to 135 °C, verified per JEDEC JESD51-14. At this temperature, each die sustains 12 A average forward current with VF ≤ 1.75 V and RthJC maintained at 1.4 K/W. Exceeding 135 °C requires derating per the thermal curve in the official datasheet.
Can IDDD12G65C6XTMA1 be used in non-interleaved topologies?
Yes - it can operate as a single 12 A diode by connecting Pins 1 and 2 externally and using Pin 3 as cathode. However, doing so forfeits the thermal and layout advantages of the dual-die structure and may increase localized heating versus using one die independently.
Is the common-cathode configuration polarity-sensitive during PCB layout?
Yes - Pin 3 is the sole cathode terminal and must be routed to the lowest-impedance ground/reference plane. Anode traces (Pins 1 and 2) must be symmetrical in length and width to ensure balanced dynamic current sharing; asymmetry >5% causes >8% current imbalance at 200 kHz switching.
Does this part require gate drive or external bias circuitry?
No - as a Schottky diode, IDDD12G65C6XTMA1 is a passive, two-terminal device with no gate or control terminal. It conducts when anode voltage exceeds cathode voltage by ≥0.8 V and blocks when reverse-biased, requiring no auxiliary circuitry beyond standard snubbing for voltage overshoot suppression.
IDDD12G65C6XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolSiC™+
- Package/Case:
- 10-PowerSOP Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Technology:
- SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):
- 650 V
- Current - Average Rectified (Io):
- 34A
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):
- 0 ns
- Current - Reverse Leakage @ Vr:
- 40 µA @ 420 V
- Capacitance @ Vr, F:
- 594pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-HDSOP-10-1
- Operating Temperature - Junction:
- -55°C ~ 175°C
IDDD12G65C6XTMA1 FAQ
1.How can I place an order for IDDD12G65C6XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IDDD12G65C6XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDDD12G65C6XTMA1 reliable?
The price and inventory of IDDD12G65C6XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDDD12G65C6XTMA1 is usually 5 days.
3.What payment methods are accepted for IDDD12G65C6XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDDD12G65C6XTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDDD12G65C6XTMA1?
IDDD12G65C6XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDDD12G65C6XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDDD12G65C6XTMA1?
For technical support, including IDDD12G65C6XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDDD12G65C6XTMA1 requirements.
6.How does Aetrix verify that IDDD12G65C6XTMA1 is sourced from the original manufacturer or authorized distributors?
All IDDD12G65C6XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDDD12G65C6XTMA1 meets industry standards.
7.What is the process for return or replacement of IDDD12G65C6XTMA1?
All IDDD12G65C6XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IDDD12G65C6XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDDD12G65C6XTMA1 part is unused and in its original packaging.
Return procedure for IDDD12G65C6XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IDDD12G65C6XTMA1 Tags

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Diodes Incorporated
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