Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies IDH09SG60CXKSA1

Part No.:
IDH09SG60CXKSA1
Manufacturer:
Infineon Technologies
Category:
Single Diodes
Package:
TO-220-2
Datasheet:
AetrixIDH09SG60CXKSA1.pdf
Description:
DIODE SIL CARB 600V 9A TO220-2-2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,540

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IDH09SG60CXKSA1 from Infineon Technologies is a 3rd-generation thinQ!™ silicon carbide (SiC) Schottky diode rated for 600 V repetitive peak reverse voltage and 9 A continuous forward current at TC < 130 °C, with zero reverse recovery charge and <10 ns switching time. It delivers temperature-independent switching behavior, 15 nC total capacitive charge, and 49 A non-repetitive surge current at 25 °C - deployed in CCM PFC stages of high-efficiency SMPS.

For engineers reviewing the IDH09SG60CXKSA1 datasheet, IDH09SG60CXKSA1 pinout, IDH09SG60CXKSA1 application, or IDH09SG60CXKSA1 equivalent, key selection criteria include its 1.3 K/W junction-to-case thermal resistance, 2.2 V forward voltage at 9 A and 150 °C, 3 µA reverse leakage at 600 V/150 °C, and absence of minority-carrier recovery - critical for high-frequency, high-temperature power conversion.

Technical Context

This SiC Schottky diode replaces conventional silicon fast recovery diodes in hard-switched topologies by eliminating reverse recovery losses and enabling operation up to 175 °C junction temperature. Its unipolar conduction mechanism yields no stored charge, resulting in near-zero Qrr, minimal EMI generation, and stable dv/dt ruggedness of 50 V/ns under 0–480 V transition.

The device uses a planar SiC junction structure optimized for low QC/IF figure of merit and exhibits linear capacitance reduction from 280 pF at 1 V to 35 pF at 300 V and 600 V (1 MHz), supporting resonant and soft-switching designs without snubbers.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM600 V - supports 400 V DC-link systems with 50% safety margin for transient overvoltage in industrial UPS and solar inverters
IF (cont.)9 A at TC < 130 °C - enables compact heatsinking in space-constrained PFC modules
VF2.2 V @ 9 A, 150 °C - reduces conduction loss vs. Si diodes while maintaining thermal stability
QC15 nC - defines capacitive turn-off energy; enables predictable switching loss calculation in ZVS/ZCS circuits
RthJC1.3 K/W - allows direct mounting to heatsink with minimal thermal interface resistance for high-power density layouts
tc<10 ns - sets upper bound on switching transition time; eliminates need for gate drive optimization for diode commutation
IR3 µA @ 600 V, 150 °C - ensures low standby leakage in high-impedance bias networks and auxiliary supplies

Pinout & Package

Package: PG-TO220-2 - insulated case, single-side heat transfer, M3/M3.5 screw-mount compatible, lead-free and RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (C)CathodeMain current exit terminal; electrically connected to metal tab for direct thermal path to heatsink
Pin 2 (A)AnodeMain current entry terminal; isolated from case; requires PCB trace routing with controlled impedance for high-di/dt paths

Key Features

FeatureDesign Value
No reverse recovery (Qrr = 0)Eliminates switching loss and associated EMI in hard-switched PFC and inverter freewheeling paths
Temperature-independent switchingEnables consistent timing and loss profiles across -55 °C to 175 °C ambient without derating or compensation
High surge capability (49 A, 10 ms)Withstands inrush currents in motor drives and solar string startup without degradation
Low QC/IF figure of meritOptimizes trade-off between capacitive loss and conduction loss for >100 kHz operation
dv/dt ruggedness (50 V/ns)Prevents false triggering in high-speed half-bridge leg commutation with steep voltage transients

Applications

Industrial UPS Output StageSolar String Inverter Boost Converter

Use Scenario: Bidirectional energy flow during grid-tie and battery backup modes with 400–800 V DC-link.

IC Role / Device Role / Timing Role: Freewheeling diode in synchronous boost stage; handles 9 A continuous and 42 A surge at 150 °C junction.

Use Value: Zero Qrr prevents shoot-through risk and reduces MOSFET switching stress during polarity reversal.

Use Scenario: High-efficiency DC-DC conversion for PV strings operating at 600 V nominal with wide irradiance variation.

IC Role / Device Role / Timing Role: Output rectifier in interleaved boost converter; switches at 100 kHz with <10 ns transitions.

Use Value: Stable 2.2 V VF at 150 °C maintains efficiency above 98.5% across full temperature range.

Server PSU CCM PFCEV Onboard Charger Front-End

Use Scenario: Continuous Conduction Mode active PFC in 3.5 kW telecom/server power supplies with forced-air cooling.

IC Role / Device Role / Timing Role: Fast recovery replacement in Vienna rectifier leg; conducts 9 A RMS with 200 A/µs di/dt.

Use Value: 15 nC QC enables precise loss modeling and eliminates snubber design iterations.

Use Scenario: AC/DC front-end rectification in 11 kW bidirectional OBC with liquid-cooled heatsink.

IC Role / Device Role / Timing Role: Input bridge diode in dual-phase interleaved PFC; operates at 175 °C junction under sustained load.

Use Value: 1.3 K/W RthJC supports direct thermal coupling to cold plate, reducing system thermal resistance by 40% vs. TO-247 Si diodes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC Schottky diode applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
C3D09060ASame 600 V/9 A rating but TO-220AC package; RthJC = 1.5 K/W; QC = 16.5 nCRequires larger heatsink footprint due to higher thermal resistance; slightly higher capacitive lossSelect when legacy TO-220AC footprint compatibility is required over thermal performance
STPSC9H06D600 V/9 A; D2PAK package; RthJC = 1.7 K/W; VF = 2.35 V @ 150 °CHigher conduction loss and lower surge rating (38 A); limited to ≤150 °C continuous operationSelect only for cost-sensitive, lower-temperature applications where thermal headroom exists

Compared with C3D09060A and STPSC9H06D, IDH09SG60CXKSA1 offers the lowest thermal resistance (1.3 K/W) and tightest VF spec (2.2 V @ 150 °C), making it optimal for thermally constrained, high-reliability industrial and EV charging systems requiring long-term stability at 175 °C.

Availability

IDH09SG60CXKSA1 is available at Aetrix Electronics and suitable for industrial UPS output stages, solar string inverter boost converters, and server PSU CCM PFC circuits requiring stable component supply, long-lifecycle support, and guaranteed RoHS-compliant manufacturing.

Supply support for IDH09SG60CXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for automotive, industrial, and renewable energy markets.

IDH09SG60CXKSA1 belongs to the thinQ!™ 3rd-generation SiC Schottky diode product line, engineered specifically for high-frequency, high-temperature power conversion in next-generation PFC, solar, and UPS systems where zero-recovery loss and thermal robustness are mandatory.

FAQ

Is IDH09SG60CXKSA1 pin-compatible with standard silicon TO-220 fast recovery diodes?

No. While it shares the PG-TO220-2 outline, its cathode (Pin 1) is electrically connected to the metal tab - unlike most silicon diodes where the anode or case is isolated. This requires PCB layout revision to ensure proper heatsink isolation and avoid short-circuiting the cathode to ground.

What is the maximum allowable soldering temperature for IDH09SG60CXKSA1?

The device is qualified for wave soldering only at leads, with a maximum temperature of 260 °C applied 1.6 mm (0.063 in.) from the case for 10 seconds. Reflow soldering is not recommended due to thermal stress on the SiC die and internal wire bonds.

Does IDH09SG60CXKSA1 require a gate resistor or snubber network?

No. As a unipolar Schottky diode with no minority carrier storage, it has no reverse recovery tail and negligible stored charge. Snubbers are unnecessary unless managing external circuit parasitics; gate resistors are irrelevant since it has no gate terminal.

How does the 15 nC capacitive charge (QC) impact system-level EMI?

QC determines the displacement current magnitude during voltage transitions. At 100 kHz and 400 V/ns dv/dt, the resulting iC = QC × dv/dt ≈ 6 mA - low enough to avoid significant common-mode noise, provided layout minimizes loop area and uses symmetric routing to suppress differential-mode radiation.

IDH09SG60CXKSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolSiC™+
Package/Case:
TO-220-2
Packaging:
Tube
Product Status:
Discontinued at Digi-Key
Technology:
SiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max):
600 V
Current - Average Rectified (Io):
9A
Voltage - Forward (Vf) (Max) @ If:
2.1 V @ 9 A
Speed:
No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr):
0 ns
Current - Reverse Leakage @ Vr:
80 µA @ 600 V
Capacitance @ Vr, F:
280pF @ 1V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO220-2-2
Operating Temperature - Junction:
-55°C ~ 175°C

IDH09SG60CXKSA1 FAQ

1.How can I place an order for IDH09SG60CXKSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IDH09SG60CXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IDH09SG60CXKSA1 reliable?

The price and inventory of IDH09SG60CXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDH09SG60CXKSA1 is usually 5 days.

3.What payment methods are accepted for IDH09SG60CXKSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDH09SG60CXKSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IDH09SG60CXKSA1?

IDH09SG60CXKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IDH09SG60CXKSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IDH09SG60CXKSA1?

For technical support, including IDH09SG60CXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDH09SG60CXKSA1 requirements.

6.How does Aetrix verify that IDH09SG60CXKSA1 is sourced from the original manufacturer or authorized distributors?

All IDH09SG60CXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDH09SG60CXKSA1 meets industry standards.

7.What is the process for return or replacement of IDH09SG60CXKSA1?

All IDH09SG60CXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IDH09SG60CXKSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IDH09SG60CXKSA1 part is unused and in its original packaging.

Return procedure for IDH09SG60CXKSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IDH09SG60CXKSA1 Tags

  • IDH09SG60CXKSA1
  • IDH09SG60CXKSA1 PDF
  • IDH09SG60CXKSA1 Datasheet
  • IDH09SG60CXKSA1 Specifications
  • IDH09SG60CXKSA1 Images
  • Infineon Technologies
  • Infineon Technologies IDH09SG60CXKSA1
  • Buy IDH09SG60CXKSA1
  • IDH09SG60CXKSA1 Price
  • IDH09SG60CXKSA1 Distributor
  • IDH09SG60CXKSA1 Supplier
  • IDH09SG60CXKSA1 Wholesale
Related Products
1N4448X-TP
1N4448X-TP

Micro Commercial Co

1N4148WX-TP
1N4148WX-TP

Micro Commercial Co

1N4148TR
1N4148TR

onsemi

MMSD4148T1G
MMSD4148T1G

onsemi

MMBD914LT3G
MMBD914LT3G

onsemi

BAS16HT1G
BAS16HT1G

onsemi

1N914BWT
1N914BWT

onsemi

BAS21LT1G
BAS21LT1G

onsemi

LL4148
LL4148

onsemi

BAS16LT1G
BAS16LT1G

onsemi

MMSD914T1G
MMSD914T1G

onsemi

BAV21W-7-F
BAV21W-7-F

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER