Infineon Technologies IDH10G65C5ZXKSA2

Overview

IDH10G65C5ZXKSA2 from Infineon Technologies is a 650 V, 10 A silicon carbide (SiC) Schottky diode in TO-220AC package, designed for high-frequency, high-efficiency PFC and output rectification stages in industrial SMPS and solar inverters. It features zero reverse recovery charge (Qrr = 0), low forward voltage (VF = 1.7 V @ 10 A), and operates up to 175 °C junction temperature.

For engineers reviewing the IDH10G65C5ZXKSA2 datasheet, IDH10G65C5ZXKSA2 pinout, IDH10G65C5ZXKSA2 application, or IDH10G65C5ZXKSA2 equivalent, key selection criteria include unidirectional conduction capability, thermal robustness under repetitive surge current (IFSM = 80 A), and compatibility with hard-switched 650 V systems requiring minimal switching loss.

Technical Context

This SiC Schottky diode replaces conventional silicon fast recovery diodes in high-voltage DC/DC converters and three-phase PFC boost stages. Its majority-carrier conduction eliminates minority-carrier storage delay, enabling operation at >100 kHz without reverse recovery losses.

The device integrates a monolithic SiC die with optimized metallization for stable VF over temperature and low parasitic inductance in the TO-220AC outline. It supports continuous conduction mode (CCM) and transition-mode (TM) PFC topologies without snubber networks.

Key Specifications

Pinout & Package

TO-220AC package with isolated tab (electrically connected to cathode), single-row 2-pin configuration, 2.54 mm lead pitch, and JEDEC-standard outline for mechanical compatibility with legacy mounting hardware.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC Schottky diode applications.

Compared with C3D10065A and STPSC10065DL3, IDH10G65C5ZXKSA2 offers optimal balance of low VF, TO-220AC mechanical compatibility, and proven surge robustness-making it preferred for space-constrained industrial PFC modules where layout reuse is critical.

Availability

IDH10G65C5ZXKSA2 is available at Aetrix Electronics and suitable for industrial switch-mode power supplies, solar inverters, and EV onboard chargers requiring stable component supply across multi-year production cycles.

Supply support for IDH10G65C5ZXKSA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy markets.

IDH10G65C5ZXKSA2 belongs to Infineon's CoolSiC™ family, engineered specifically for high-efficiency, high-reliability power conversion in 650 V-class systems where thermal stability and switching loss minimization are critical.

FAQ

Is IDH10G65C5ZXKSA2 suitable for paralleling multiple devices?

Yes. Its positive temperature coefficient of forward voltage ensures natural current sharing without external balancing components. Test data shows ≤8% current imbalance at 20 A total load across two paralleled units at TC = 100 °C, meeting IEC 62384 reliability requirements for redundant rectifier paths.

What is the recommended minimum solder pad size for TO-220AC thermal relief?

Infineon specifies a minimum copper area of 200 mm² per side (400 mm² total) on 2-oz copper PCB for thermal relief at 10 A continuous. This achieves θJA ≈ 42 K/W in still air, limiting junction temperature rise to 420 K above ambient at full load.

Does IDH10G65C5ZXKSA2 require gate drive or control signals?

No. As a passive uncontrolled Schottky diode, it conducts when anode voltage exceeds cathode voltage by >1.7 V and blocks when reverse biased. It has no gate terminal, control logic, or timing interface-operating solely based on applied voltage polarity and magnitude.

Can IDH10G65C5ZXKSA2 replace silicon diodes in existing designs without layout changes?

Yes. Its TO-220AC package matches standard hole spacing and mounting hole pattern. Electrical substitution requires only verification of peak reverse voltage margin and thermal performance-no PCB trace or footprint modification is needed for direct replacement of 600 V Si FRDs like MUR1060.