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Infineon Technologies IDK09G65C5XTMA1

Part No.:
IDK09G65C5XTMA1
Manufacturer:
Infineon Technologies
Category:
Single Diodes
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIDK09G65C5XTMA1.pdf
Description:
DIODE SIL CARB 650V 9A TO263-2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,212

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Product details

Overview

IDK09G65C5XTMA1 from Infineon is a 650 V, 9 A silicon carbide Schottky diode in PG-TO263-2 package, designed for high-frequency, high-temperature switching in power conversion stages. It delivers zero reverse recovery charge, 14 nC capacitive charge at 400 V, and 1.5–1.8 V forward voltage at 9 A and 25°C, enabling PFC and solar inverter designs operating up to 175°C junction temperature.

For engineers reviewing the IDK09G65C5XTMA1 datasheet, IDK09G65C5XTMA1 pinout, IDK09G65C5XTMA1 application, or IDK09G65C5XTMA1 equivalent, key selection criteria include its 650 V repetitive peak reverse voltage, 75 A surge current capability at 25°C, thermal resistance of 1.1 K/W (junction-to-case), and RoHS-compliant Pb-free lead plating.

Technical Context

This 5th-generation thinQ!™ SiC Schottky diode uses Infineon's diffusion-soldered thin-wafer technology to achieve lower Qc × Vf figure of merit and improved thermal performance over prior generations. Its unipolar conduction eliminates minority-carrier storage, resulting in temperature-independent switching and no reverse recovery loss.

The device is optimized for complementary use with 650 V CoolMOS™ MOSFETs in hard-switched topologies. Its dv/dt ruggedness of 100 V/ns and 28 A²s i²t rating support robust operation under fast transient conditions in SMPS and UPS systems.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM650 V - Maximum repetitive reverse voltage; defines safe blocking capability in PFC boost or inverter DC-link applications
IF (TC < 145°C)9 A - Continuous forward current rating at case temperature below 145°C; sets thermal design margin for heatsink sizing
VF @ 9 A, 25°C1.5–1.8 V - Forward voltage drop; directly impacts conduction loss and system efficiency at nominal load
Qc @ 400 V14 nC - Total capacitive charge; determines turn-off switching loss and EMI behavior in high-dv/dt circuits
RthJC1.1–1.8 K/W - Junction-to-case thermal resistance; enables accurate junction temperature estimation from measured case temperature
IR @ 650 V, 150°C1.8–1100 µA - Reverse leakage current range; critical for high-temperature hold-off stability in solar string inverters
dv/dt100 V/ns - Rated voltage transient immunity; ensures reliable operation during fast MOSFET switching edges

Pinout & Package

Package: PG-TO263-2 (D²PAK), surface-mount, single-diode configuration with isolated cathode tab. Thermal pad on underside requires soldering to PCB copper area for optimal heat transfer.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Cathode)Anode-side return path for forward currentPrimary thermal interface; must be connected to ≥6 cm² copper pour for rated 82 W power dissipation
Pin 2 (Anode)Current entry point during forward conductionLow-inductance connection point; routed away from sensitive control traces to minimize coupling
Pin 3 (n.a.)Not assigned / No internal connectionUnused terminal; electrically floating and thermally isolated - must not be soldered or shorted

Key Features

FeatureDesign Value
No reverse recoveryEliminates switching loss and associated EMI in hard-switched converters; enables >100 kHz operation without snubbers
Temperature-independent switchingEnables consistent timing and loss profiles across -55°C to 175°C ambient, simplifying thermal derating
75 A surge current (10 ms)Supports inrush current handling in UPS and industrial SMPS without external crowbar protection
Diffusion-soldered die attachReduces interfacial thermal resistance by >30% vs. standard solder, improving long-term reliability under thermal cycling
RoHS-compliant Pb-free platingMeets global environmental compliance requirements without sacrificing wire-bond adhesion or corrosion resistance

Applications

Power Factor Correction (PFC)Solar Inverter DC-Link

Use Scenario: Boost-stage freewheeling diode in continuous conduction mode (CCM) PFC front-end for server PSUs.

IC Role / Device Role / Timing Role: Unidirectional current path during MOSFET off-time; blocks 650 V DC-link while conducting 9 A RMS.

Use Value: Zero Qrr eliminates tail current loss, reducing total PFC stage losses by ~1.2 W vs. Si FRD at 65 kHz.

Use Scenario: Anti-parallel diode in 650 V IGBT half-bridge for string-level solar inverters.

IC Role / Device Role / Timing Role: Freewheeling path during IGBT commutation; handles bidirectional reactive current in MPPT algorithms.

Use Value: 175°C max junction rating allows operation in unventilated enclosures; 1.8 V VF at 150°C maintains efficiency above 98.3%.

Uninterruptible Power Supply (UPS)Industrial Switch-Mode Power Supply

Use Scenario: Output rectifier in high-efficiency online double-conversion UPS with 10 ms hold-up time.

IC Role / Device Role / Timing Role: Main DC output diode in phase-shifted full-bridge topology; conducts 9 A continuously at 40°C ambient.

Use Value: 28 A²s i²t rating withstands 10-cycle AC line fault surges without degradation; reduces need for parallel devices.

Use Scenario: Secondary-side synchronous rectification replacement in telecom 48 V input, 12 V/30 A output supply.

IC Role / Device Role / Timing Role: High-voltage clamp and flyback energy recirculation path in active clamp forward converter.

Use Value: 100 V/ns dv/dt ruggedness prevents false triggering during 500 V/µs gate drive transients; improves system robustness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC Schottky diode applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
C3D09065A (Wolfspeed)Same 650 V/9 A rating; higher VF (1.7–2.1 V at 9 A, 25°C); 16 nC QcSlightly higher conduction loss; less suitable for ultra-high-efficiency PFC where <1.6 V VF is criticalPrefer when legacy layout compatibility with TO-220AC footprint is required
STPSC9H065D (STMicroelectronics)650 V/9 A; VF = 1.6–1.95 V; Qc = 15 nC; RthJC = 1.5 K/WHigher thermal resistance limits power density in compact SMD designsChoose when dual-diode configuration or integrated Kelvin sense is needed

Compared with C3D09065A and STPSC9H065D, IDK09G65C5XTMA1 offers the lowest combined Qc × Vf figure of merit and tightest VF distribution, making it optimal for space-constrained, high-frequency PFC and solar inverter designs demanding minimal thermal overhead.

Availability

IDK09G65C5XTMA1 is available at Aetrix Electronics and suitable for power factor correction, solar inverter DC-link, and uninterruptible power supply applications requiring stable component supply, long-lifecycle assurance, and traceable sourcing.

Supply support for IDK09G65C5XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

IDK09G65C5XTMA1 belongs to the thinQ!™ 5th-generation SiC Schottky diode product line, engineered specifically to complement 650 V CoolMOS™ MOSFETs in high-efficiency, high-power-density AC-DC and DC-AC conversion systems.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The IDK09G65C5XTMA1 supports continuous operation up to 175°C junction temperature, verified per JEDEC qualification standards. Derating begins at TC = 145°C, where IF drops linearly to zero at 175°C. This rating enables deployment in sealed, fanless enclosures common in solar and industrial UPS systems.

Does this diode require a gate resistor or snubber network?

No. As a unipolar Schottky diode, IDK09G65C5XTMA1 has no gate and exhibits no reverse recovery, eliminating the need for snubbers or damping resistors. However, layout best practices-such as minimizing loop inductance and separating high-di/dt paths from control traces-are still essential to manage EMI from rapid current transitions.

How does the 1.1–1.8 K/W RthJC range impact thermal design?

The RthJC range reflects process variation in die attach quality and package molding. For worst-case thermal design, use 1.8 K/W to calculate junction temperature: Tj = TC + (Pdiss × 1.8). At 9 A and 1.7 V VF, Pdiss ≈ 15.3 W, so TC must stay ≤ 85°C to keep Tj ≤ 175°C-guiding heatsink selection and airflow requirements.

Can IDK09G65C5XTMA1 replace silicon diodes in existing designs without layout changes?

Yes, if the PCB footprint matches PG-TO263-2 and thermal copper area meets Infineon's 6 cm² recommendation. Electrical replacement is drop-in for most 650 V Si FRDs, but layout review is mandatory: reduced switching loss lowers EMI filter burden, while higher dv/dt may expose parasitic coupling not previously problematic with slower silicon devices.

IDK09G65C5XTMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolSiC™+
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Technology:
SiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max):
650 V
Current - Average Rectified (Io):
9A
Voltage - Forward (Vf) (Max) @ If:
1.8 V @ 9 A
Speed:
No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr):
0 ns
Current - Reverse Leakage @ Vr:
1.6 mA @ 650 V
Capacitance @ Vr, F:
270pF @ 1V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-2
Operating Temperature - Junction:
-55°C ~ 175°C

IDK09G65C5XTMA1 FAQ

1.How can I place an order for IDK09G65C5XTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IDK09G65C5XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IDK09G65C5XTMA1 reliable?

The price and inventory of IDK09G65C5XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDK09G65C5XTMA1 is usually 5 days.

3.What payment methods are accepted for IDK09G65C5XTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDK09G65C5XTMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IDK09G65C5XTMA1?

IDK09G65C5XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IDK09G65C5XTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IDK09G65C5XTMA1?

For technical support, including IDK09G65C5XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDK09G65C5XTMA1 requirements.

6.How does Aetrix verify that IDK09G65C5XTMA1 is sourced from the original manufacturer or authorized distributors?

All IDK09G65C5XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDK09G65C5XTMA1 meets industry standards.

7.What is the process for return or replacement of IDK09G65C5XTMA1?

All IDK09G65C5XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IDK09G65C5XTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IDK09G65C5XTMA1 part is unused and in its original packaging.

Return procedure for IDK09G65C5XTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IDK09G65C5XTMA1 Tags

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