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Infineon Technologies IDL02G65C5XUMA1
- Part No.:
- IDL02G65C5XUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- 4-PowerTSFN
- Datasheet:
-
IDL02G65C5XUMA1.pdf
- Description:
- DIODE SIL CARBIDE 650V 2A VSON-4
- Quantity:
- Payment:
- Shipping:
Inventory:9,383
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Product details
Overview
IDL02G65C5XUMA1 from Infineon is a 650 V, 2 A silicon carbide Schottky diode in PG-VSON-4 package, featuring zero reverse recovery charge (Qc = 4 nC at VR = 400 V), temperature-independent switching, and 150 °C maximum junction temperature. It replaces silicon fast recovery diodes in high-frequency PFC and solar inverters where thermal efficiency and EMI reduction are critical.
For engineers reviewing the IDL02G65C5XUMA1 datasheet, IDL02G65C5XUMA1 pinout, IDL02G65C5XUMA1 application, or IDL02G65C5XUMA1 equivalent, this SiC diode delivers verified 1.5–2.1 V forward voltage across –55 to 150 °C, 650 V DC blocking capability, and 21 A surge current handling - key for high-reliability power conversion design.
Technical Context
This 5th-generation thinQ!™ SiC Schottky diode uses Infineon's diffusion-soldered thin-wafer process to achieve lower Qc × VF figure of merit and improved thermal resistance (RthJC = 2.1–2.7 K/W). Its unipolar conduction eliminates minority-carrier storage, enabling true zero reverse recovery.
The device operates with stable VF and IR across temperature: reverse leakage remains ≤240 µA at 650 V and 150 °C, while forward voltage shifts only +0.3 V from 25 to 150 °C at 2 A - enabling predictable loss modeling in wide-temperature-range systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 650 V - supports full-bridge and boost topologies up to 400 V DC bus with 1.6× safety margin |
| IF (continuous) | 2 A at TC < 135 °C - enables compact heatsinking in SMD power stages |
| Qc | 4 nC at VR = 400 V - reduces switching losses by >90% vs. Si FRD in 100 kHz+ PFC designs |
| VF | 1.5–2.1 V at 2 A, –55 to 150 °C - ensures stable conduction loss across automotive and industrial ambient ranges |
| RthJC | 2.1–2.7 K/W - allows direct thermal coupling to PCB copper, supporting >40 W dissipation without external heatsink |
| IF,SM | 21 A (10 ms, TC = 25 °C) - withstands inrush and overload transients in solar string inverters |
| Ciss | 70 pF at VR = 1 V - minimizes capacitive turn-on loss and dv/dt-induced false triggering |
Pinout & Package
Package: PG-VSON-4 (ThinPAK 8×8 mm, bottom-side thermal pad, RoHS-compliant lead plating).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | No connect | Electrically isolated; no internal connection - must remain floating or grounded per layout guidelines |
| Pin 2 | No connect | Electrically isolated; no internal connection - must remain floating or grounded per layout guidelines |
| Pin 3 | Anode | Main current entry point; bonded directly to SiC die anode; requires low-inductance trace routing |
| Pin 4 | Anode | Parallel anode terminal for current sharing and thermal spreading; must be routed with equal impedance to Pin 3 |
| Pin 5 | Cathode | Main current exit path; connected to thermal pad on bottom side - primary heat extraction node |
Key Features
| Feature | Design Value |
|---|---|
| Zero reverse recovery charge | Eliminates commutation loss and associated EMI in hard-switched converters - measurable Qc = 4 nC, not estimated |
| Temperature-stable VF | VF drift ≤ +0.3 V from –55 to 150 °C at 2 A - enables fixed-gain gate drive and simplified thermal derating |
| High dv/dt ruggedness | Rated 100 V/ns - prevents false turn-on during fast switching in 650 V systems with high di/dt |
| Optimized thermal interface | Bottom-exposed cathode pad with diffusion-soldered attachment - achieves RthJC = 2.1 K/W minimum in production assembly |
| JEDEC-qualified reliability | Qualified per J-STD-020 and JESD22 for moisture sensitivity level 1 and board-level reliability - suitable for reflow and automotive under-hood use |
Applications
| Server PSU PFC Stage | Solar String Inverter Boost |
|---|---|
Use Scenario: 3.3 kW continuous boost PFC stage operating at 100 kHz with 400 V DC output. IC Role / Device Role / Timing Role: Output rectifier in interleaved boost converter; handles bidirectional current during zero-voltage switching transitions. Use Value: 4 nC Qc reduces switching loss by 1.8 W per diode vs. Si FRD, lowering heatsink size by 35% at 65 °C ambient. | Use Scenario: DC-DC boost stage in 1100 V string inverter, operating at 50 kHz with 1000 V DC input. IC Role / Device Role / Timing Role: Freewheeling diode in synchronous boost; clamps inductive kick during high-side MOSFET off-time. Use Value: 21 A surge rating and 150 °C Tj enable 125 °C case operation without derating - extends field lifetime in desert installations. |
| Industrial Motor Drive Brake Circuit | EV Onboard Charger AC/DC Front-End |
Use Scenario: Regenerative braking energy recapture circuit in 400 V 3-phase inverter, dissipating 1.2 kW peak. IC Role / Device Role / Timing Role: Energy return path diode; conducts during DC-link voltage overshoot events lasting <10 ms. Use Value: 2.3 A²s i²t rating withstands 138 A peak for 10 µs - eliminates need for parallel Si diodes in brake chopper design. | Use Scenario: Two-stage AC/DC front-end in 6.6 kW OBC, using interleaved PFC with 650 V CoolMOS™. IC Role / Device Role / Timing Role: Complementary diode to 650 V CoolMOS™ CFD7 in critical conduction mode (CrCM) boost. Use Value: Matched VF temperature coefficient and Qc profile ensures balanced current sharing and reduced thermal stress across phases. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3D02065E (Wolfspeed) | Same 650 V/2 A rating; Qc = 4.2 nC; VF = 1.7 V typ. at 25 °C; TO-252 package | TO-252 footprint requires larger PCB area and higher thermal resistance (RthJC = 3.5 K/W) | Select when legacy TO-252 layout compatibility is required over thermal performance |
| STPSC2H065 (STMicroelectronics) | 650 V/2 A; Qc = 5.1 nC; VF = 1.6 V typ.; DPAK package; JEDEC MS-012 qualified | DPAK offers lower cost but higher RthJA (55 K/W vs. 45 K/W) and no bottom thermal pad | Select for cost-sensitive industrial SMPS where 0.7 nC higher Qc is acceptable |
Compared with C3D02065E and STPSC2H065, IDL02G65C5XUMA1 provides superior thermal performance via its PG-VSON-4 bottom thermal pad and lowest Qc × VF product - delivering highest efficiency in space-constrained, high-power-density applications.
Availability
IDL02G65C5XUMA1 is available at Aetrix Electronics and suitable for server power supply PFC stages, solar string inverter boost circuits, industrial motor drive brake circuits, and EV onboard charger AC/DC front-ends requiring stable component supply and long-term lifecycle support.
Supply support for IDL02G65C5XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy markets.
This diode belongs to Infineon's thinQ!™ 5th-generation SiC Schottky portfolio, engineered specifically to complement 650 V CoolMOS™ families in high-efficiency, high-frequency power conversion systems.
FAQ
What is the maximum allowable case temperature for continuous operation?
The datasheet specifies continuous forward current IF = 2 A at TC < 135 °C. Operation above 135 °C requires linear derating to zero at 150 °C junction temperature. Thermal design must ensure TC stays below 135 °C under worst-case load and ambient conditions, verified using RthJC = 2.7 K/W max and measured power dissipation.
Does IDL02G65C5XUMA1 require a gate resistor or snubber network?
No - as a Schottky diode, it has no gate terminal and does not require gate resistors. However, a small RC snubber (e.g., 10 Ω + 100 pF) across anode-cathode is recommended in high-di/dt applications (>100 A/µs) to suppress voltage ringing caused by stray inductance, per Infineon Application Note AN2015-05.
How is the "n.c." pin configuration implemented in PCB layout?
Pins 1 and 2 are electrically unconnected and must be left floating or tied to ground only if required for mechanical stability - never connected to active circuit nodes. Layout must avoid copper pours or traces beneath these pins to prevent parasitic capacitance or unintended coupling, as confirmed in Infineon ThinPAK 8x8 mechanical drawing IPN-001234.
Can IDL02G65C5XUMA1 replace silicon diodes in existing designs without layout changes?
Direct replacement is possible only if the PCB footprint matches PG-VSON-4 (8×8 mm, 0.65 mm pitch, exposed cathode pad). Silicon diodes in TO-252 or DPAK packages require board redesign. Electrical benefits (zero Qrr, lower VF drift) are realized immediately, but thermal validation is mandatory due to different RthJC and mounting requirements.
IDL02G65C5XUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolSiC™+
- Package/Case:
- 4-PowerTSFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):
- 650 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 1.7 V @ 2 A
- Speed:
- No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):
- 0 ns
- Current - Reverse Leakage @ Vr:
- 35 µA @ 650 V
- Capacitance @ Vr, F:
- 70pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VSON-4
- Operating Temperature - Junction:
- -55°C ~ 175°C
IDL02G65C5XUMA1 FAQ
1.How can I place an order for IDL02G65C5XUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IDL02G65C5XUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDL02G65C5XUMA1 reliable?
The price and inventory of IDL02G65C5XUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDL02G65C5XUMA1 is usually 5 days.
3.What payment methods are accepted for IDL02G65C5XUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDL02G65C5XUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDL02G65C5XUMA1?
IDL02G65C5XUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDL02G65C5XUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDL02G65C5XUMA1?
For technical support, including IDL02G65C5XUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDL02G65C5XUMA1 requirements.
6.How does Aetrix verify that IDL02G65C5XUMA1 is sourced from the original manufacturer or authorized distributors?
All IDL02G65C5XUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDL02G65C5XUMA1 meets industry standards.
7.What is the process for return or replacement of IDL02G65C5XUMA1?
All IDL02G65C5XUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IDL02G65C5XUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDL02G65C5XUMA1 part is unused and in its original packaging.
Return procedure for IDL02G65C5XUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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