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Infineon Technologies IR3503MTRPBF
- Part No.:
- IR3503MTRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- Power Management - Specialized
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
IR3503MTRPBF.pdf
- Description:
- IC CTRL XPHASE VR11.0/1 32-MLPQ
- Quantity:
- Payment:
- Shipping:
Inventory:2,627
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Product details
Overview
IR3503MTRPBF from Infineon Technologies is a VR11.0/VR11.1 multi-phase buck controller IC designed for CPU voltage regulation in high-performance computing systems. It provides system-level control, daisy-chain phase timing, 0.5% set-point accuracy, programmable 250 kHz–1.5 MHz per-phase switching frequency, and integrated thermal compensation via NTC thermistor. It operates with XPHASE3™ Phase ICs to deliver scalable 1–15 phase power solutions.
For engineers reviewing the IR3503MTRPBF datasheet, IR3503MTRPBF pinout, IR3503MTRPBF application, or IR3503MTRPBF equivalent, key selection criteria include phase scalability, dynamic VID slew rate programming, remote sense amplifier performance, hiccup-mode overcurrent protection timing, and VRHOT temperature monitoring integration with HOTSET/NTC networks.
Technical Context
The IR3503 implements a master controller architecture in VR11.0/VR11.1-compliant CPU power delivery, coordinating up to 15 XPHASE3™ Phase ICs via PHSIN/PHSOUT daisy-chain signaling. Its error amplifier delivers 30 MHz bandwidth and 10 V/µs slew rate for fast transient response, while the programmable ROSC resistor sets both oscillator frequency and bias currents across VSETPT, VDAC, and thermal compensation blocks.
It integrates three critical closed-loop functions: voltage regulation (via FB/EAVOUT/VSETPT), current reporting (IIN→VDRP→IMON), and thermal-aware droop (VN/NTC network). The VRHOT comparator monitors HOTSET voltage against a 1.600 V threshold with 100 mV hysteresis, enabling direct thermal shutdown coordination with the power stage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Set-Point Accuracy | ±0.5% - ensures tight CPU core voltage tolerance under all VID codes and load conditions. |
| Per-Phase Switching Frequency | 250 kHz to 1.5 MHz - set by ROSC resistor (7.75 kΩ to 50 kΩ); enables optimization of efficiency vs. size trade-offs. |
| Error Amplifier Bandwidth | 30 MHz - supports sub-100 ns transient response for modern high-dI/dt CPU loads. |
| VID Slew Rate | Programmable via external RC on VDAC - controls dynamic voltage transition speed during P-state changes. |
| Overcurrent Protection Delay | 1024–4096 PHSOUT cycles - scales inversely with switching frequency for consistent time-domain fault response. |
| VRHOT Threshold | 1.600 V ±16 mV - precise NTC-based thermal trip point for power stage overtemperature protection. |
| Remote Sense Offset | ±3 mV - minimizes voltage drop measurement error between VR output and CPU die. |
| VCCL Operating Range | 4.75 V to 7.5 V - powers internal regulators and logic; includes UVLO with 4.5 V start/4.0 V stop thresholds. |
Pinout & Package
The IR3503MTRPBF is housed in a thermally enhanced 32-lead MLPQ package (5 mm × 5 mm body, 0.5 mm pitch) with an exposed pad (Pin 33) connected to internal ground for improved thermal dissipation and EMI performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VID7–VID0 (1–8) | VID digital input bus | 8-bit parallel interface for CPU-dictated output voltage; supports VR11.0/VR11.1 protocols. |
| PHSOUT (26) / PHSIN (27) | Daisy-chain phase clock interface | Enables automatic phase count detection and interleaved timing without external timing components. |
| VDRP (17) / IIN (29) | Thermally compensated current reporting path | VDRP outputs scaled, DCR-compensated current signal; IIN receives summed phase current from XPHASE3™ ICs. |
| VRHOT (10) / HOTSET (11) | Thermal shutdown monitor interface | HOTSET connects to NTC thermistor divider; VRHOT is open-drain output asserting low when temperature exceeds threshold. |
| VOSEN+ (13) / VOSEN− (12) | Remote sense differential inputs | Measure true load voltage at CPU pads; reject PCB IR drop for accurate regulation. |
| SS/DEL (22) | Soft-start and overcurrent delay timing node | Capacitor-connected pin programs startup ramp time and OC fault delay duration simultaneously. |
| EXPAD (33) | Exposed thermal pad | Internally tied to LGND; must be soldered to PCB ground plane for thermal and electrical integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Daisy-chain phase timing | Eliminates need for external clock buffers or timing resistors; enables plug-and-play phase scaling from 1 to 15 phases. |
| Programmable load line (droop) | External RC network on VDRP/FB sets output impedance to meet VR11.0/VR11.1 load-line specifications. |
| Single NTC thermistor compensation | One NTC network calibrates current reporting, OC threshold, and droop slope-reducing BOM count and calibration complexity. |
| Open remote sense line detection | Monitors VOSEN+/- continuity; asserts fault if sense lines disconnect, preventing unregulated high-voltage output. |
| Centralized overvoltage protection | OVP threshold referenced to VDAC; communicates trip event to all Phase ICs via IIN line for coordinated shutdown. |
Applications
| Server CPU Voltage Regulator | Workstation GPU Power Delivery |
|---|---|
Use Scenario: Dual-socket x86 server motherboard delivering up to 200 A to Intel Xeon Scalable processors with dynamic P-state transitions. IC Role / Device Role / Timing Role: Master VR controller managing 8–12 XPHASE3™ Phase ICs; synchronizes phase interleaving and VID updates via daisy-chain CLKOUT/PHSOUT. Use Value: Achieves <0.5% voltage accuracy across full load range and temperature, meeting VR11.1 specification for processor stability and power efficiency. | Use Scenario: High-end PCIe graphics card powering NVIDIA A100 or AMD MI250X GPUs with rapid load transients exceeding 300 A/µs. IC Role / Device Role / Timing Role: Central voltage supervisor coordinating 6-phase buck stages; uses IMON and VDRP for real-time current reporting and adaptive droop tuning. Use Value: Enables precise current sharing and thermal derating via single NTC network, reducing thermal runaway risk during sustained compute workloads. |
| AI Accelerator Board Power | High-Performance Computing (HPC) Node |
Use Scenario: PCIe-based AI inference accelerator using custom ASICs requiring tightly regulated 0.75–0.95 V core supply with dynamic voltage scaling. IC Role / Device Role / Timing Role: VR11.1-compliant controller interfacing with FPGA-configurable Phase ICs; leverages SHIFT pin for runtime phase enable/disable based on workload profile. Use Value: Supports dynamic phase shedding and frequency scaling (250 kHz–1.5 MHz) to minimize idle power while maintaining transient response during burst inference cycles. | Use Scenario: Liquid-cooled HPC blade server with multi-die CPU packages demanding coordinated thermal management across voltage rails. IC Role / Device Role / Timing Role: Master controller integrating VRHOT monitoring, remote sensing, and PSI# power state signaling to align VR behavior with CPU C-states. Use Value: Delivers synchronized voltage scaling, thermal throttling, and power-good sequencing required for DOE Energy Star and SPECpower compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-phase VR controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6367IRZ | Supports VR12.0/IMVP7; higher max phase count (16); lacks integrated VRHOT comparator and NTC compensation circuitry. | Requires external thermal monitoring IC and separate current-sense compensation network. | Preferred for newer Intel platforms requiring VR12.0 compliance and higher phase density. |
| TPS53679RSLR | TI's dual-loop controller with integrated MOSFET drivers; no daisy-chain phase timing; uses PMBus for configuration instead of VID pins. | Designed for embedded PMBus-based systems; not pin- or protocol-compatible with VR11.x VID interfaces. | Chosen when digital telemetry, firmware update capability, and driver integration outweigh legacy VID compatibility needs. |
Compared with ISL6367IRZ and TPS53679RSLR, the IR3503MTRPBF offers native VR11.0/VR11.1 VID support, hardware-based daisy-chain scalability, and single-NTC thermal compensation-making it optimal for cost-sensitive, high-volume server and workstation designs where analog control simplicity and thermal integration are prioritized.
Availability
IR3503MTRPBF is available at Aetrix Electronics and suitable for server motherboard design, AI accelerator power subsystems, high-performance workstation VRMs, and industrial edge computing platforms requiring stable component supply and long-lifecycle support.
Supply support for IR3503MTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in high-efficiency power conversion solutions.
The IR3500 series targets high-density, multi-phase CPU/GPU voltage regulation, emphasizing VR11.x compliance, thermal-aware current sensing, and scalable phase architecture for datacenter and compute-intensive applications.
FAQ
What is the function of the SHIFT pin on the IR3503MTRPBF?
The SHIFT pin enables dynamic phase count adjustment: pulling it high signals addition of a phase in the daisy chain, lowering CLKOUT frequency; pulling it low signals loss of a phase, raising CLKOUT frequency. It operates at VCCL/2 float voltage and requires no external pull-up/down, supporting real-time phase shedding without firmware intervention.
How does the IR3503MTRPBF implement thermal compensation for current sensing?
It uses a single NTC thermistor network connected to HOTSET and VN pins to simultaneously scale current reporting (IIN→VDRP), adjust overcurrent threshold, and tune load-line droop. This eliminates separate thermal sensors and reduces calibration effort while ensuring accurate current feedback across –40°C to +125°C ambient.
Can the IR3503MTRPBF operate without remote sensing?
Yes-it supports local sensing mode by connecting VOSEN+ and VOSEN− to the VR output node. However, remote sensing is strongly recommended for CPU/GPU applications to compensate for PCB trace resistance; disabling it forfeits the ±3 mV remote sense offset advantage and risks voltage droop at the load.
What is the role of the SS/DEL pin beyond soft-start timing?
SS/DEL sets both soft-start ramp time and overcurrent protection delay duration via a single capacitor. During normal operation, it also compensates the constant-output-current loop during soft-start by adjusting the VDRP-to-FB feedback path, ensuring stable current limiting before regulation is established.
IR3503MTRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- XPhase3™
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Processor
- Current - Supply:
- 8mA
- Voltage - Supply:
- 4.75V ~ 7.5V
- Operating Temperature:
- 0°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-MLPQ (5x5)
IR3503MTRPBF FAQ
1.How can I place an order for IR3503MTRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IR3503MTRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IR3503MTRPBF reliable?
The price and inventory of IR3503MTRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IR3503MTRPBF is usually 5 days.
3.What payment methods are accepted for IR3503MTRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IR3503MTRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IR3503MTRPBF?
IR3503MTRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IR3503MTRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IR3503MTRPBF?
For technical support, including IR3503MTRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IR3503MTRPBF requirements.
6.How does Aetrix verify that IR3503MTRPBF is sourced from the original manufacturer or authorized distributors?
All IR3503MTRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IR3503MTRPBF meets industry standards.
7.What is the process for return or replacement of IR3503MTRPBF?
All IR3503MTRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IR3503MTRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IR3503MTRPBF part is unused and in its original packaging.
Return procedure for IR3503MTRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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