Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies IR3506MTRPBF

Part No.:
IR3506MTRPBF
Manufacturer:
Infineon Technologies
Category:
Power Management - Specialized
Package:
16-VFQFN Exposed Pad
Datasheet:
AetrixIR3506MTRPBF.pdf
Description:
IC CTRL XPHASE3 DDR 16-MLPQ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,186

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IR3506MTRPBF from Infineon Technologies is a 16-pin MLPQ phase IC for DDR3 power delivery, implementing gate drive (7V/2A high-side, 4A sink low-side), lossless inductor current sensing, and PSI-enabled light-load efficiency optimization in xPHASE3™ multi-phase buck converters. It interfaces with IR3522 control IC via 3-wire analog (VDAC/EAIN/IOUT) and 3-wire digital (CLKIN/PHSIN/PHSOUT) buses to support scalable DIMM power rails.

For engineers reviewing the IR3506MTRPBF datasheet, IR3506MTRPBF pinout, IR3506MTRPBF application, or IR3506MTRPBF equivalent, key selection criteria include GATEL sink current (4A), PWM ramp slope (46–63 mV/%DC), PSI comparator thresholds (620 mV rising), thermal package (3×3 mm MLPQ), and daisy-chain phase timing accuracy (4–35 ns PHSOUT propagation delay).

Technical Context

The IR3506 operates as a slave phase controller in a master-slave architecture with IR3522, receiving DACIN reference, EAIN error voltage, and CLKIN/PHSIN timing signals. Its PWM comparator uses trailing-edge modulation with input-voltage-compensated ramp slope and reset-dominant latch for fast load-step response.

It integrates bootstrapped synchronous PFET, anti-bias circuitry, and self-calibrating current sense amplifier (gain 32.5 V/V, offset ±1 mV) with single-wire average current sharing via IOUT bus. PSI assertion disables phase delay DFF to reduce output ripple and enables over-current protection during light-load mode.

Key Specifications

ParameterValue and Actual Design Meaning
GATEL Sink Current4.0 A peak - drives low-side MOSFET with sufficient margin for high-current DDR3 phases.
PWM Ramp Slope46–63 mV/%DC - dynamically compensates for input voltage variation to maintain regulation accuracy.
PSI Rising Threshold620 mV typical - triggers light-load efficiency mode when system demand drops below defined threshold.
PHSOUT Propagation Delay4–35 ns - ensures precise daisy-chain phase alignment across up to 8 phases without external timing components.
Current Sense Gain32.5 V/V - enables accurate lossless inductor DCR sensing with <±1 mV input offset.
Package Thermal ResistanceMLPQ 3×3 mm - provides low thermal impedance for continuous 125°C junction operation in dense DIMM layouts.
CLKIN Frequency Range250 kHz – 9 MHz - supports wide switching frequency selection for noise and efficiency trade-offs.

Pinout & Package

IR3506MTRPBF uses a thermally enhanced 16-lead MLPQ package (3 mm × 3 mm body, 0.5 mm pitch) with exposed thermal pad. Pin functions are validated per Infineon datasheet Rev V3.02.

Pin/TerminalCircuit RoleDesign Meaning
1 IOUTAverage current share bus outputOutputs V(DACIN) + 32.5×(CSIN+ − CSIN−); tied across all phases for interleaved current balancing.
2 DACINVoltage reference inputReference for PWM ramp and current sense amplifier; sets output voltage target via IR3522 VID interface.
3 LGNDInternal logic groundSubstrate connection point; isolated from PGND/LGND separation improves noise immunity.
4 PHSINDigital phase clock inputReceives daisy-chained timing signal from upstream device (control IC or prior phase IC).
5 PHSOUTDigital phase clock outputDrives next downstream phase IC; enables precise inter-phase delay control without external RC networks.
8 GATELLow-side gate driver output4A sink capability directly drives N-channel MOSFET gate; includes non-overlap logic with GATEH.
9 VCCLLow-side driver supplySupplies GATEL and internal bootstrap PFET; range 4.75–7.5V ensures stable gate drive under load transients.
10 BOOSTHigh-side bootstrap supplyCharges bootstrap capacitor for GATEH; rated to 40V max, supports >34V SW node swing.
11 GATEHHigh-side gate driver output2A source/sink drives P-channel MOSFET; integrated non-overlap prevents shoot-through with GATEL.
12 SWSwitch node connectionConnects to buck converter switch node; referenced for GATEH non-overlap comparator and BOOST charging.
13 PSIPower state indicator inputActive-low signal from IR3522 indicating light-load condition; triggers efficiency-optimized mode.
14 CSIN+Current sense non-inverting inputConnects to DCR tap or sense resistor; paired with CSIN− for differential inductor current measurement.
15 CSIN−Current sense inverting inputCompletes differential current sense path; enables diode emulation disable when negative current detected.
16 EAINError amplifier output inputReceives compensated error voltage from IR3522; determines PWM duty cycle via comparator against ramp.

Key Features

FeatureDesign Value
Self-calibrating current sense amplifierEliminates production calibration; achieves ±1 mV input offset and 32.5 V/V gain stability over temperature.
Single-wire average current sharingUses IOUT bus to equalize phase currents without dedicated current-share IC or external resistors.
PSI-optimized light-load operationDisables phase delay DFF and maintains OCP during PSI assertion, reducing ripple while preserving protection.
Integrated bootstrapped synchronous PFETReduces external component count by 1 per phase; eliminates discrete bootstrap diode and associated losses.
Soft-stop turn-off sequencingEnsures VDDR and VTT rail tracking during shutdown by coordinating GATEH/GATEL turn-off timing.

Applications

DDR3 Memory Power SupplyServer DIMM Voltage Regulation

Use Scenario: Dual-rank DDR3 modules on enterprise servers requiring tight voltage tolerance (±1%) and fast transient response.

IC Role / Device Role / Timing Role: Phase IC executing PWM control, current sensing, and gate driving per buck phase; synchronized via daisy-chained PHSOUT/PHSIN timing loop.

Use Value: Enables 8-phase scalability with <35 ns inter-phase skew, supporting >60 A total output current with <10 mV load-step deviation.

Use Scenario: High-density 2U rack servers with multiple DDR3 memory channels per CPU socket.

IC Role / Device Role / Timing Role: Slave phase controller interfacing with IR3522 master; handles local current monitoring, gate drive, and PSI-triggered efficiency modes.

Use Value: Reduces board area by 30% vs. discrete driver solutions and achieves >92% peak efficiency at 40 A per rail.

Workstation Memory SubsystemNetwork Equipment DDR3 Interface

Use Scenario: Professional workstations with ECC DDR3 RDIMMs demanding low-noise, high-reliability power delivery.

IC Role / Device Role / Timing Role: Phase IC providing lossless DCR current sensing, soft-stop shutdown, and debug isolation via dedicated comparator.

Use Value: Delivers ±0.5% output regulation across -20°C to 85°C ambient with no external trim components.

Use Scenario: Carrier-grade routers with DDR3-based packet buffering and control-plane memory.

IC Role / Device Role / Timing Role: Multi-phase buck phase controller supporting hot-swap capable VDDQ and VTT rails with OVP/UVP/OC protection.

Use Value: Integrates over-current protection during PSI mode, enabling safe operation at <10% load without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-phase buck phase controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISL6367IRZIntersil 12-pin QFN; lacks integrated bootstrap PFET and PSI interface; requires external bootstrap diode and separate light-load control logic.Targeted at DDR2/DDR3 systems without strict PSI compliance; lower integration increases BOM count and layout complexity.Select when legacy platform compatibility outweighs integration benefits and thermal density is not constrained.
MP2940AGQSEMPS 16-pin QFN; includes PSI but no daisy-chain PHSIN/PHSOUT; uses I²C for phase synchronization - adds MCU dependency and latency.Suitable for cost-sensitive embedded DDR3 designs where phase count ≤4 and deterministic timing is less critical than BOM cost.Prefer for small-form-factor applications where I²C infrastructure already exists and <5 ns timing skew is not required.

Compared with ISL6367IRZ and MP2940AGQSE, IR3506MTRPBF uniquely combines daisy-chain timing, integrated bootstrap PFET, and PSI-optimized ripple reduction - delivering superior phase alignment, reduced component count, and guaranteed light-load performance in high-density DDR3 systems.

Availability

IR3506MTRPBF is available at Aetrix Electronics and suitable for DDR3 memory power supplies, server DIMM voltage regulation, and workstation memory subsystems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for IR3506MTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

The IR3506 belongs to Infineon's xPHASE3™ family of digital multi-phase controllers, designed specifically for high-efficiency, scalable DDR3/DDR4 memory power delivery with minimal external components and deterministic timing.

FAQ

What is the function of the IOUT pin in IR3506MTRPBF?

IOUT outputs a voltage equal to V(DACIN) + 32.5 × (CSIN+ − CSIN−), representing sensed inductor current scaled to the control reference. When tied across all phase ICs, it forms a single-wire average current-sharing bus used by the IR3522 control IC for voltage positioning and over-current protection - eliminating need for external current-share amplifiers or resistors.

How does the PSI interface improve light-load efficiency?

When PSI is asserted low, the IR3506 disables its internal phase-delay DFF to reduce output voltage ripple, maintains over-current protection functionality, and optimizes gate driver timing for minimal switching losses. This preserves regulation accuracy and fault coverage while achieving >85% efficiency at 5% load - critical for server idle-state power budgets.

Can IR3506MTRPBF operate without an IR3522 control IC?

No. The IR3506 is a phase-only IC requiring external control signals: DACIN (voltage reference), EAIN (error amplifier output), CLKIN (system clock), and PHSIN (phase timing). These are generated exclusively by the IR3522 or compatible master controller; standalone operation is not supported per datasheet architecture and pin functionality.

What is the maximum allowable voltage on the BOOST pin?

The BOOST pin has an absolute maximum rating of 40 V relative to SW, with recommended operating conditions limiting BOOST–SW to ≤8 V. Exceeding 40 V risks permanent damage; operation above 8 V degrades reliability and may trigger over-voltage protection. Designers must ensure bootstrap capacitor voltage remains within this window during all transients and startup conditions.

IR3506MTRPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
XPhase3™
Package/Case:
16-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Processor
Current - Supply:
10mA
Voltage - Supply:
4.75V ~ 7.5V
Operating Temperature:
0°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-MLPQ (3x3)

IR3506MTRPBF FAQ

1.How can I place an order for IR3506MTRPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IR3506MTRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IR3506MTRPBF reliable?

The price and inventory of IR3506MTRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IR3506MTRPBF is usually 5 days.

3.What payment methods are accepted for IR3506MTRPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IR3506MTRPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IR3506MTRPBF?

IR3506MTRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IR3506MTRPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IR3506MTRPBF?

For technical support, including IR3506MTRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IR3506MTRPBF requirements.

6.How does Aetrix verify that IR3506MTRPBF is sourced from the original manufacturer or authorized distributors?

All IR3506MTRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IR3506MTRPBF meets industry standards.

7.What is the process for return or replacement of IR3506MTRPBF?

All IR3506MTRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IR3506MTRPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IR3506MTRPBF part is unused and in its original packaging.

Return procedure for IR3506MTRPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IR3506MTRPBF Tags

  • IR3506MTRPBF
  • IR3506MTRPBF PDF
  • IR3506MTRPBF Datasheet
  • IR3506MTRPBF Specifications
  • IR3506MTRPBF Images
  • Infineon Technologies
  • Infineon Technologies IR3506MTRPBF
  • Buy IR3506MTRPBF
  • IR3506MTRPBF Price
  • IR3506MTRPBF Distributor
  • IR3506MTRPBF Supplier
  • IR3506MTRPBF Wholesale
Related Products
TPS2511DGNR
TPS2511DGNR

Texas Instruments

UTC2000/MG
UTC2000/MG

Microchip Technology

TUSB320HAIRWBR
TUSB320HAIRWBR

Texas Instruments

TPS61252DSGR
TPS61252DSGR

Texas Instruments

PI5USB30216CXUAEX
PI5USB30216CXUAEX

Diodes Incorporated

SN6501DBVR
SN6501DBVR

Texas Instruments

CYPD3177-24LQXQT
CYPD3177-24LQXQT

Infineon Technologies

SN6501QDBVRQ1
SN6501QDBVRQ1

Texas Instruments

STUSB1600AQTR
STUSB1600AQTR

STMicroelectronics

SN6505BDBVR
SN6505BDBVR

Texas Instruments

SN6501DBVT
SN6501DBVT

Texas Instruments

TPS65150PWPR
TPS65150PWPR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER