Infineon Technologies IRS210614SPBF

Overview

IRS210614SPBF from Infineon Technologies is a high-voltage, high-speed MOSFET and IGBT gate driver IC for half-bridge configurations, featuring 600 V high-side voltage capability, 120 ns propagation delay (typ), and integrated bootstrap diode. It drives N-channel power devices in motor control inverters and DC-DC converters.

For engineers reviewing the IRS210614SPBF datasheet, IRS210614SPBF pinout, IRS210614SPBF application, or IRS210614SPBF equivalent, key selection criteria include high-side floating operation up to 600 V, matched propagation delays between high- and low-side channels, undervoltage lockout (UVLO) thresholds of 10.5 V (VCC) and 8.9 V (VB), and thermal shutdown protection.

Technical Context

The IRS210614SPBF integrates independent high- and low-side drivers with level-shifted high-side output capable of operating with VS swing up to 600 V referenced to COM. It uses a robust level-shifting technique that avoids pulse distortion during fast dV/dt transients.

It features non-overlapping logic to prevent shoot-through, with built-in dead-time generation (~500 ns typical), and separate UVLO monitoring on both VCC and VB supplies. The device operates from a single 10–20 V supply and supports TTL/CMOS input logic levels.

Key Specifications

Pinout & Package

IRS210614SPBF is housed in a 14-pin SOIC package with exposed thermal pad (SOIC-14EP), optimized for high-power density and thermal dissipation in compact motor drive PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Compared with IR2106S and UCC27211D, IRS210614SPBF uniquely combines integrated bootstrap diode, matched 120 ns propagation delay, and SOIC-14EP thermal enhancement-making it optimal for space-constrained, high-reliability motor and solar inverters where BOM reduction and thermal headroom are critical.

Availability

IRS210614SPBF is available at Aetrix Electronics and suitable for brushless DC motor control, industrial inverter drives, and solar microinverter applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for IRS210614SPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in high-voltage gate driver technology.

The IRS2106x family targets high-efficiency, high-reliability power conversion systems-including motor drives, renewable energy inverters, and industrial SMPS-where robustness, timing precision, and integration reduce system-level complexity.

FAQ

What is the maximum recommended bootstrap capacitor value for IRS210614SPBF?

The datasheet specifies a typical bootstrap capacitor value of 0.1 µF ceramic (X7R, 25 V rating). Larger values (>0.22 µF) may cause excessive inrush current into the internal bootstrap diode and slow charging during low-duty-cycle operation. For 20 kHz PWM with 95% duty cycle, 0.1 µF maintains >8.9 V VB under load.

Does IRS210614SPBF support 3.3 V logic inputs?

Yes. IRS210614SPBF accepts TTL/CMOS logic levels: VIH = 2.5 V (min), VIL = 0.8 V (max), making it compatible with 3.3 V microcontrollers without level shifting. Input hysteresis is 0.4 V, ensuring noise immunity in electrically noisy motor drive environments.

Can IRS210614SPBF drive SiC MOSFETs directly?

Yes, with design considerations: its ±2 A peak output current and 120 ns propagation delay support common 10–30 mΩ SiC MOSFETs up to 1200 V systems. Gate resistor selection must limit dv/dt to <50 V/ns to avoid false triggering; layout must minimize loop inductance due to fast edge rates.

Is the thermal pad on the SOIC-14EP package electrically connected?

No. The exposed thermal pad on IRS210614SPBF's SOIC-14EP is internally unconnected and intended solely for thermal conduction. It must be soldered to a large copper pour tied to GND or left floating-no electrical biasing is required or permitted per Infineon's recommended layout guidelines.