Infineon Technologies IRS26072DSPBF

Overview

IRS26072DSPBF from Infineon Technologies is a high-voltage, half-bridge gate driver IC designed for driving N-channel MOSFETs or IGBTs in synchronous buck, resonant, and motor control topologies. It integrates bootstrap diode, 600 V high-side floating capability, 200 ns typical propagation delay, and shoot-through protection with 500 ns dead-time. Used in industrial BLDC motor inverters requiring robust high-side switching.

For engineers reviewing the IRS26072DSPBF datasheet, IRS26072DSPBF pinout, IRS26072DSPBF application, or IRS26072DSPBF equivalent, key selection criteria include bootstrap voltage rating, propagation delay matching between high/low sides, integrated dead-time generation, and thermal performance in 8-SOIC package under continuous 1 A peak output current.

Technical Context

This driver implements independent high-side and low-side output stages with matched propagation delays (200 ns typ.) and built-in shoot-through prevention logic. The floating high-side section supports up to 600 V DC bus operation with internal level-shift circuitry and integrated bootstrap diode.

It features undervoltage lockout (UVLO) on both channels (V_CC: 10–20 V; V_BS: 9–16 V), non-overlapping logic to enforce minimum 500 ns dead-time, and thermal shutdown at 150 °C. No external bootstrap capacitor is required due to integrated diode.

Key Specifications

Pinout & Package

Supplied in standard 8-pin SOIC (SO-8) package with exposed thermal pad (package code: PG-DSO-8-31). Pin pitch: 1.27 mm; body size: 4.9 × 6.0 mm; max junction temperature: 150 °C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Compared with IR2104SPBF and UCC27211D, IRS26072DSPBF uniquely combines 600 V high-side capability, integrated bootstrap diode, and hardware-enforced 500 ns dead-time in a single 8-SOIC package-reducing design complexity and failure modes in space-constrained industrial inverters.

Availability

IRS26072DSPBF is available at Aetrix Electronics and suitable for industrial motor drives, server power supplies, solar microinverters, and cordless power tool controllers requiring stable component supply and long-term manufacturability.

Supply support for IRS26072DSPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global R&D and wafer fabrication facilities.

The IRS26072DSPBF belongs to Infineon's high-voltage gate driver product line, engineered specifically for robust, compact half-bridge implementations in industrial motor control and switched-mode power conversion.

FAQ

What is the maximum recommended bootstrap capacitor value for IRS26072DSPBF?

The datasheet specifies a typical 0.1 µF ceramic capacitor between V_BS and VS, with maximum ESR < 1 Ω. Larger values (up to 1 µF) may be used for high-duty-cycle applications, but must maintain low impedance at switching frequencies up to 200 kHz to ensure stable high-side bias during extended on-times.

Does IRS26072DSPBF support 3.3 V logic inputs?

Yes - HIN and LIN inputs accept TTL/CMOS logic levels with V_IL ≤ 0.8 V and V_IH ≥ 2.0 V, making them compatible with 3.3 V microcontrollers without level-shifting. Input hysteresis is 0.3 V, providing noise immunity in electrically noisy motor drive environments.

Can IRS26072DSPBF drive SiC MOSFETs directly?

Yes - its ±1 A peak output current and 200 ns propagation delay support fast-switching SiC MOSFETs up to 1200 V. However, gate resistor selection must limit dV/dt to avoid false triggering; typical R_g = 5–10 Ω is recommended for 10–20 A SiC devices.

Is there an exposed thermal pad on the 8-SOIC package?

Yes - the PG-DSO-8-31 package includes an exposed thermal pad on the underside, which must be soldered to a copper pour for effective heat dissipation. Thermal resistance from junction-to-board is 45 °C/W when mounted on 1-inch² 2-oz copper with 6 thermal vias.