Melexis Technologies NV MLX90640ESF-BAA-000-SP

Overview

MLX90640ESF-BAA-000-SP from Melexis is a factory-calibrated 32×24-pixel thermal infrared array in a 4-lead TO39 package, delivering 768 FIR pixels with 0.1K RMS NETD at 1Hz, I²C digital interface, and dual subpage refresh architecture for ambient (Ta) and IR pixel data. It operates from 3.3V, draws <23mA, supports programmable 0.5–64Hz frame rates, and targets non-contact temperature measurement in HVAC, automotive climate control, and presence detection.

For engineers reviewing the MLX90640ESF-BAA-000-SP datasheet, pinout, applications, or equivalent options, this device delivers calibrated thermal imaging with integrated Ta and VDD sensors, chess/TV reading patterns, EEPROM-stored calibration coefficients, and RoHS-compliant TO39 packaging for rapid integration into embedded thermal sensing systems.

Technical Context

The MLX90640ESF-BAA-000-SP implements a dual-subpage measurement architecture where IR pixel data and ambient temperature (Ta) are updated alternately-each subpage refreshed at the configured frame rate (e.g., 4Hz → 250ms), while Ta calculation requires both subpages, effectively halving its update rate. Its internal RAM stores raw IR, Ta, and VDD sensor outputs accessible via I²C.

It uses a 34MHz RC oscillator, bandgap reference, and PTAT sensor for on-chip temperature compensation; calibration data-including per-pixel Kta(i,j), Kv(i,j), offset, sensitivity, TGC, and corner temperatures-is factory-programmed into EEPROM and must be restored before object temperature calculation. The device supports FM+ I²C up to 1MHz with 5V-tolerant SDA/SCL pins and default slave address 0x33.

Key Specifications

Pinout & Package

MLX90640ESF-BAA-000-SP uses an industry-standard 4-lead TO39 metal can package with hermetically sealed IR window, optimized for thermal stability and ESD robustness (4kV AEC-Q100 Class 2). Pin 1 (SDA) and Pin 4 (SCL) are 5V-tolerant; Pin 2 (VDD) and Pin 3 (GND) define the analog/digital power domain.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar thermal imaging applications.

Compared with MLX90640ESF-BAB-000-SP and AMG8833, the MLX90640ESF-BAA-000-SP uniquely combines narrow 55°×35° FOV, 0.1K NETD, full per-pixel calibration, and dual-subpage Ta/IR synchronization-making it the only option among the three qualified for ASHRAE-compliant thermal comfort sensing and industrial radiometric monitoring.

Availability

MLX90640ESF-BAA-000-SP is available at Aetrix Electronics and suitable for smart HVAC control, automotive cabin comfort systems, and industrial equipment monitoring requiring stable component supply, calibrated thermal imaging performance, and long-lifecycle support.

Supply support for MLX90640ESF-BAA-000-SP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Melexis is a Belgian semiconductor company specializing in intelligent sensors and driver ICs for automotive, industrial, and consumer applications, with core expertise in magnetic, infrared, and pressure sensing.

The MLX90640 product line was designed specifically for high-accuracy, low-cost thermal imaging in resource-constrained embedded systems-emphasizing factory calibration, I²C simplicity, and robust TO39 packaging for real-world environmental reliability.

FAQ

What is the field of view (FOV) of the MLX90640ESF-BAA-000-SP?

The MLX90640ESF-BAA-000-SP has a fixed 55° horizontal × 35° vertical field of view, optimized for medium-range thermal imaging where spatial precision is prioritized over wide-area coverage. This FOV matches the "BAA" option code defined in Melexis' ordering guide and is mechanically implemented via the lens assembly in the TO39 package. It differs from the 110°×75° FOV of the BAB variant.

How does the MLX90640ESF-BAA-000-SP achieve 0.1K NETD?

The MLX90640ESF-BAA-000-SP achieves 0.1K RMS Noise Equivalent Temperature Difference at 1Hz through a combination of low-noise analog front-end design, factory-trimmed pixel response uniformity, dual-subpage temporal noise averaging, and integrated Ta/VDD compensation. This specification is measured under controlled conditions per ISO 18434-1 and requires stable 3.3V ±0.05V supply and proper PCB thermal isolation to replicate in end systems.

Does the MLX90640ESF-BAA-000-SP require external calibration?

No-the MLX90640ESF-BAA-000-SP is fully factory-calibrated with all 768 pixel coefficients (offset, sensitivity, Kta, Kv), TGC, corner temperatures, and Ta/VDD sensor parameters permanently stored in on-chip EEPROM. Host firmware must load these values into RAM before computing object temperature, but no user-performed calibration is needed. The device ships ready for radiometric operation.

What I²C configuration is required to communicate with the MLX90640ESF-BAA-000-SP?

The MLX90640ESF-BAA-000-SP uses standard FM+ I²C with default 7-bit slave address 0x33 (0x66 write, 0x67 read), supports clock frequencies up to 1MHz, and features 5V-tolerant SDA/SCL pins. Pull-up resistors (typically 2.2–4.7kΩ to 3.3V) are required on both lines. EEPROM writes must observe 5ms delays between operations, and the I²C bus must be free of contention during device initialization.

Can the MLX90640ESF-BAA-000-SP operate in environments above 85°C?

No-the MLX90640ESF-BAA-000-SP is rated for operation from −40°C to +85°C ambient temperature (TAMB), as specified in its absolute maximum ratings. Exceeding +85°C risks permanent damage to the silicon die and IR window seal. For higher-temperature environments, external thermal shielding or heat-sinking of the TO39 package is required to maintain case temperature within spec-Melexis does not guarantee performance beyond this range.