Infineon Technologies ND260N16KHPSA1

Overview

ND260N16KHPSA1 from Netz-Dioden-Modul is a 1600 V, 260 A average on-state current, dual-arm press-pack rectifier diode module with AlN internal insulation, rated for 150 °C junction temperature and designed for high-power industrial AC/DC conversion in six-pulse bridge configurations.

For engineers reviewing the ND260N16KHPSA1 datasheet, ND260N16KHPSA1 pinout, ND260N16KHPSA1 application, or ND260N16KHPSA1 equivalent, key selection criteria include repetitive peak reverse voltage (1600 V), RMS on-state current (410 A), thermal resistance junction-to-case (0.164 °C/W), surge current rating (8.3 kA), and pressure-contact Si pellet construction.

Technical Context

This dual-arm rectifier module implements a bipolar silicon diode structure with pressure-contact die attachment and aluminum nitride (AlN) ceramic isolation. It supports both two-pulse (B2) and six-pulse (B6) bridge topologies under forced or natural cooling, with conduction-angle-dependent derating (e.g., 260 A IFAVM at Θ = 180° sin).

Transient thermal impedance ZthJC is characterized by seven R–τ network elements, enabling accurate loss and temperature modeling over time scales from 0.8 ms to 2.85 s. The module's 0.68 mΩ slope resistance and 0.7 V threshold voltage define its forward conduction behavior at Tvj max and high current (800 A).

Key Specifications

Pinout & Package

ND260N16KHPSA1 is a press-pack dual-arm rectifier module housed in an insulated metal baseplate package with AlN ceramic isolation. Mechanical mounting uses M1 screws (5 Nm torque ±15%) and M2 terminal bolts (12 Nm torque ±10%). Weight: 700 g. Creepage distance: 24 mm.

Key Features

Applications

Availability

ND260N16KHPSA1 is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power supplies, rail traction auxiliary systems, and medium-voltage DC distribution requiring stable component supply and long-term production continuity.

Supply support for ND260N16KHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Netz-Dioden-Modul is a German manufacturer specializing in high-power semiconductor modules for industrial energy conversion, with expertise in press-pack diode and thyristor design since the 1980s.

The ND260N series targets high-reliability AC/DC rectification in harsh environments, emphasizing thermal robustness, surge resilience, and mechanical stability for use in traction, power generation, and heavy industry.

FAQ

What is the maximum allowable case temperature for ND260N16KHPSA1?

The maximum allowable case temperature is not explicitly defined as a standalone limit; instead, the device is rated for operation up to 150 °C junction temperature (Tvj max) with derated current based on measured case temperature. At TC = 100 °C, the average on-state current is 260 A; higher case temperatures require proportional reduction per the TC = f(IFAVM) curve on page 6 of the datasheet.

Is ND260N16KHPSA1 suitable for natural convection cooling?

Yes - the datasheet provides transient thermal impedance data (ZthCA) for natural cooling using KM17 (60 W) heatsinks, with RthCH = 0.04 °C/W per arm. Under natural convection, the module supports up to ~180 A IFAVM depending on ambient temperature and heatsink size, as shown in the "Maximum allowable case temperature" graph on page 6.

Does ND260N16KHPSA1 have a specified reverse recovery charge (Qr)?

Yes - Qr is specified in the datasheet on page 8: at Tvj = Tvj max, vR ≤ 0.5 VRRM, and vRM = 0.8 VRRM, Qr ranges from ~100 µC to ~3000 µC depending on di/dt (1–100 A/µs) and forward current (50–800 A). No single typical value is given; designers must select Qr from the plotted Qr = f(–di/dt) curves.

How does the dual-arm configuration affect PCB or heatsink layout?

The dual-arm structure requires symmetrical mounting on a single heatsink with electrically isolated terminals (A1/K1 and A2/K2). Mechanical layout must ensure equal clamping force across both arms to maintain uniform thermal contact and current sharing; misalignment risks thermal runaway in one arm. No PCB is used - it mounts directly to a heatsink via M1 screws.