Infineon Technologies ND89N16KHPSA1

Overview

ND89N16KHPSA1 from Semikron is a press-pack dual-diode rectifier module rated for 1600 V repetitive peak reverse voltage (VRRM), 89 A average on-state current (IFAVM) per arm at TC = 100°C, and 140 A RMS on-state current (IFRMSM). It features silicon die with AlN internal insulation, designed for high-reliability industrial AC/DC conversion in three-phase six-pulse (B6) and single-phase two-pulse (B2) bridge configurations.

For engineers reviewing the ND89N16KHPSA1 datasheet, ND89N16KHPSA1 pinout, ND89N16KHPSA1 application, or ND89N16KHPSA1 equivalent, this module's thermal resistance (RthJC = 0.215 °C/W per arm, DC), low forward voltage (VF max = 1.5 V @ 300 A, Tvj max), and 150 °C maximum junction temperature are critical for heatsink selection, overload capability, and parallel operation in medium-power motor drives and UPS systems.

Technical Context

This dual-arm press-pack diode module implements a common-cathode configuration with isolated Si pellets mounted via pressure contact on an AlN ceramic substrate. Each arm supports independent conduction with matched thermal impedance (ZthJC) and identical electrical ratings - enabling symmetrical current sharing in B2/B6 rectifier topologies without external balancing components.

Its transient thermal behavior is defined by analytical R–τ network parameters (e.g., R₁ = 0.005 °C/W, τ₁ = 40 µs), supporting accurate loss and temperature prediction under non-sinusoidal or short-duration overload conditions. The module requires mechanical mounting torque of 4 Nm (±15%) on M1 fasteners and 4 Nm (±10%) on M2 terminals.

Key Specifications

Pinout & Package

ND89N16KHPSA1 is housed in a press-pack module with two isolated arms (common-cathode topology), featuring three main terminals: Anode 1 (A1), Anode 2 (A2), and Cathode (K). Mounting uses M1 mechanical fasteners and M2 terminal screws; no PCB footprint - direct heatsink clamping required.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-power rectifier module applications.

Compared with SKD 89/16 and DD89N16K, ND89N16KHPSA1 offers identical core ratings but distinguishes itself through its A10/91 specification version, which includes validated transient thermal models (ZthJC analytical R–τ network) and explicit 15 mm creepage distance - critical for safety-certified industrial systems.

Availability

ND89N16KHPSA1 is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power supplies, welding power supplies, and renewable energy inverters requiring stable component supply and long-term lifecycle support.

Supply support for ND89N16KHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Semikron is a German manufacturer specializing in power semiconductor modules, drivers, and integrated systems for industrial, renewable energy, and traction applications.

ND89N16KHPSA1 belongs to the DD89N series of press-pack rectifier modules, engineered for high-reliability, high-current AC/DC conversion in harsh environments where solder-free construction and thermal robustness are mandatory.

FAQ

What is the maximum allowable case temperature for ND89N16KHPSA1?

The maximum case temperature is not independently specified; instead, the device is rated for IFAVM = 89 A at TC = 100°C. Its absolute thermal limit derives from Tvj max = 150°C and RthJC = 0.215 °C/W, meaning TC must remain ≤ 150°C − (IFAVM × RthJC) under actual load. At full 89 A, TC must stay ≤ 131°C to maintain safe junction margin.

Does ND89N16KHPSA1 support paralleling of multiple modules?

Yes - its matched dual-arm design, uniform pressure-contact mounting, and identical RthJC values enable direct parallel connection without external current-sharing aids. Successful paralleling requires symmetric busbar layout, equal-length interconnects, and simultaneous thermal coupling to a common heatsink to maintain <2°C temperature delta between modules.

Is a heatsink required, and what type is recommended?

Yes, active heatsinking is mandatory. Semikron specifies KM14 (Papst 4650) for forced-air cooling (supporting 89 A continuous) and KM14 (50 W-rated) for natural convection (derated to ~45 A). Thermal interface material must be applied uniformly at 0.1–0.15 mm thickness, and mounting torque must be held to 4 Nm ±10% on M2 terminals to ensure consistent RthCH.

What does "HPSA1" signify in the part number ND89N16KHPSA1?

"HPSA1" denotes the specific manufacturing revision and test configuration: H = high-reliability screening, P = pressure-contact assembly, SA = AlN isolation substrate, and A1 = first release of the K.Spec A10/91 datasheet version. This suffix confirms compliance with Semikron's industrial-grade qualification including vibration testing (50 m/s² at 50 Hz) and 160 g weight tolerance.