Qorvo QPM5811EVB01

Overview

QPM5811EVB01 from Qorvo is an evaluation board designed to accelerate development and characterization of the QPM5811 GaAs MMIC T/R module - a 8.5–10.5 GHz front-end module integrating T/R switch, LNA (26 dB gain, 2.0 dB NF), and PA (27.5 dBm pulsed output, 45% PAE). It supports X-band phased array radar prototyping with RF interfaces optimized for Southwest Microwave 2.92 mm end-launch connectors.

For engineers reviewing the QPM5811EVB01 datasheet, pinout, applications, or equivalent options, this board enables rapid validation of RF performance, bias sequencing, thermal behavior, and switching timing of the QPM5811 under real-world pulsed and CW conditions across −40°C to +85°C.

Technical Context

The QPM5811EVB01 implements a fully populated, impedance-matched microstrip layout using Rogers RO4003C (ε_r = 3.35) substrate with 0.008″ thickness and 0.5 oz copper layers. It provides direct access to all QPM5811 control pins (VG_PA, TXSW, RXSW, VREF, VSS), DC supplies (VD_PA, VD_LNA), and RF ports (TXIN/RXOUT, TXOUT/RXIN) via SMA-compatible 2.92 mm end-launch connectors (J1, J2).

Bias-up/down sequencing is implemented per Qorvo's documented procedure: VG_PA must be set before drain supplies; TXSW/RXSW transitions require Mode 3 (both OFF) as interim state for ≥5 ns; and gate current limits are enforced at ≤10 mA. The board includes decoupling networks (1000 pF, 10 µF) and 10 Ω series resistors on control lines to suppress ringing.

Key Specifications

Availability

QPM5811EVB01 is available at Aetrix Electronics and suitable for X-band radar prototyping, electronic warfare subsystem validation, and military-grade communications transceiver development requiring stable component supply, traceable sourcing, and rapid-turn evaluation support.

Supply support for QPM5811EVB01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Qorvo is a U.S.-based RF semiconductor company specializing in high-frequency GaAs, GaN, and SiGe solutions for defense, aerospace, and infrastructure applications.

The QPM5811EVB01 belongs to Qorvo's X-band radar evaluation platform family, engineered to de-risk integration of high-power, low-noise T/R modules into compact, thermally constrained phased array systems.

FAQ

What is the primary function of the QPM5811EVB01?

The QPM5811EVB01 is an evaluation board purpose-built to characterize and validate the QPM5811 GaAs MMIC T/R module. It provides calibrated RF paths, controlled bias sequencing, and accessible test points for measuring receive noise figure, transmit power, switching time, harmonic suppression, and thermal performance across the full 8.5–10.5 GHz band under pulsed and CW conditions.

Does the QPM5811EVB01 support both pulsed and continuous-wave operation of the QPM5811?

Yes, the QPM5811EVB01 supports both operational modes. Its PCB layout, decoupling network, and connector interface are validated for pulsed RF testing (100 µs pulse width, 10% duty cycle) and CW measurements. The board accommodates external pulse generators and RF signal analyzers, and its thermal design sustains QPM5811 channel temperatures up to 119.7°C during worst-case pulsed operation.

Which RF connectors are used on the QPM5811EVB01, and why were they selected?

The QPM5811EVB01 uses Southwest Microwave 1092-01A-5 2.92 mm end-launch connectors (J1 and J2). These connectors were selected for their broadband performance (DC to 40 GHz), low insertion loss (<0.15 dB at 10 GHz), and precise launch geometry onto the RO4003C microstrip - ensuring minimal discontinuity and verified <−10 dB return loss across the QPM5811's 8.5–10.5 GHz operating band.

How does the QPM5811EVB01 implement bias sequencing for the QPM5811?

The QPM5811EVB01 follows Qorvo's documented bias-up/bias-down sequence: VG_PA is set first (to −3.3 V or −0.7 V), then VD_PA and VD_LNA are applied; TXSW/RXSW transitions require Mode 3 (both OFF) for ≥5 ns between states. The board includes 10 Ω series resistors on control lines and dedicated test points for monitoring VG_PA, VD_PA, and VD_LNA to ensure compliance with absolute maximum ratings and optimal quiescent current stability.

Is thermal management addressed on the QPM5811EVB01, and how does it relate to QPM5811 specifications?

Yes - the QPM5811EVB01 PCB layout allocates thermal relief pads and ground plane area beneath the QPM5811's 6 × 6 mm QFN package to enhance heat dissipation. This supports the QPM5811's specified thermal resistance (θ_JC = 33.0 °C/W under pulsed worst-case conditions) and enables sustained operation at baseplate temperatures up to +85°C while maintaining channel temperature below 119.7°C, as verified in Qorvo's thermal characterization data.