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Infineon Technologies SAK-TC275TC-64F200N DC
- Part No.:
- SAK-TC275TC-64F200N DC
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
SAK-TC275TC-64F200N DC.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,355
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Product details
Overview
SAK-TC275TC-64F200N DC from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three lockstep-capable CPU cores (two TC1.6P at up to 200 MHz and one TC1.6E), 4 MB embedded PFlash with ECC, 384 KB DFlash for EEPROM emulation, and integrated safety mechanisms including SMU, MTU, and IOM. It targets automotive powertrain and chassis control systems requiring ASIL-D compliance.
For engineers reviewing the SAK-TC275TC-64F200N DC datasheet, SAK-TC275TC-64F200N DC pinout, SAK-TC275TC-64F200N DC application, or SAK-TC275TC-64F200N DC equivalent, this page delivers verified core architecture details, LQFP176 package mapping, real-time peripheral timing (ASCLIN, QSPI, ETH), safety feature implementation, and validated automotive-grade alternatives.
Technical Context
The TC275TC implements a deterministic multi-core architecture with dual high-performance TC1.6P cores operating in lockstep with a dedicated safety monitor, plus a scalar TC1.6E core for background tasks. All cores share a 64-bit SRI crossbar enabling concurrent memory and peripheral access without arbitration delay.
Its safety subsystem includes hardware-enforced memory protection via ECC on all NVM/SRAM, lockstep execution monitoring, and dedicated Safety Management Unit (SMU) that aggregates and prioritizes fault signals from MTU, IOM, and peripheral watchdogs - enabling full ASIL-D decomposition per ISO 26262 Part 5.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Three TriCore™: two TC1.6P (200 MHz, FPU + MAC), one TC1.6E (200 MHz, code-compatible); all support lockstep pairing |
| Embedded Memory | 4 MB PFlash (ECC-protected), 384 KB DFlash (EEPROM emulation), 32 KB LMU, BootROM; no external memory interface required |
| Real-Time Peripherals | 4× ASCLIN (LIN v2.1 compliant, up to 50 MBaud), 2× QSPI (master/slave), 1× Ethernet MAC (MII/RMII), 1× E-Ray, 64-channel DMA |
| Safety Features | SMU, MTU (MBIST + ECC init), IOM (I/O pin health monitoring), lockstep CPU pairs, ASIL-D ready per ISO 26262 |
| Package & Pin Count | LQFP176 (24×24 mm, 0.5 mm pitch); 176 pins with defined 5 V/3.3 V switchable I/O, LVDSH/LVDSM, and dedicated safety reset paths |
| Operating Range | −40 °C to +125 °C ambient; 1.3 V core, 3.3 V I/O, 5 V tolerant on selected pads; qualified per AEC-Q100 Grade 1 |
Pinout & Package
LQFP176 package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad; pin functions defined per Infineon's TC275x LQFP176 Pin Configuration (Data Sheet Section 2.1.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3 | Core Power Supply | 1.3 V supply input for CPU and logic domains; requires local decoupling per layout guidelines |
| VDDIO_3.3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks; supports 5 V-tolerant operation on designated pins |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to external 20–40 MHz crystal; internal oscillator circuitry enables precise clock generation for PLL |
| ERAY_TXD0 / ERAY_RXD0 | Ethernet Reliable Automotive Bus | Dedicated differential pair for E-Ray communication; supports deterministic time-triggered networking at 10/100 Mbps |
| ETH_MDC / ETH_MDIO | PHY Management Interface | IEEE 802.3-compliant MDIO bus for configuring external Ethernet PHY registers |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | Standard 5-pin JTAG port supporting boundary scan, flash programming, and real-time debug via DAP |
Key Features
| Feature | Design Value |
|---|---|
| TriCore™ Multi-Core Architecture | Two lockstep TC1.6P cores + independent TC1.6E core enable ASIL-D decomposition while maintaining deterministic real-time response |
| On-Chip Safety Infrastructure | Integrated SMU, MTU, and IOM provide hardware-monitored fault detection, memory self-test, and I/O integrity verification - eliminating need for external safety monitors |
| Hardware Security Module (HSM) | Optional HSM variant supports AES-128/256, SHA-256, RSA-2048, and secure boot key management - certified to Common Criteria EAL4+ |
| ASCLIN with LIN Hardware Support | Four ASCLIN channels include dedicated LIN frame handling (v1.3/v2.0/v2.1/J2602), reducing CPU load by >70% vs. software-based LIN stacks |
| QSPI with Execute-in-Place (XIP) | Supports direct code execution from external QSPI flash; eliminates need for RAM copy and reduces boot time by ~40% |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control under transient load conditions. IC Role / Device Role / Timing Role: Primary controller executing ASIL-D safety-critical engine algorithms with lockstep core validation and cycle-accurate interrupt latency ≤ 100 ns. Use Value: Enables deterministic 200 MHz instruction throughput and ECC-protected 4 MB flash storage for calibration data - meeting ISO 26262 ASIL-D requirements without external safety co-processor. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction during sensor faults. IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P cores execute torque control loop at 10 kHz while TC1.6E handles CAN FD diagnostics and firmware updates. Use Value: Integrated 64-channel DMA offloads ADC sampling and PWM update cycles, reducing CPU utilization by 35% versus single-core solutions. |
| Brake-by-Wire System | Advanced Driver Assistance (ADAS) Sensor Fusion Hub |
|
Use Scenario: Redundant hydraulic pressure control with dual independent actuator drivers and real-time fault arbitration. IC Role / Device Role / Timing Role: Safety-critical controller using SMU-managed fault tree analysis and IOM-monitored I/O to validate brake command integrity before output. Use Value: On-chip MTU performs periodic memory built-in self-test (MBIST) during idle cycles - ensuring SRAM/Flash reliability without runtime penalty. |
Use Scenario: Time-synchronized fusion of radar, camera, and ultrasonic inputs for object tracking and path prediction. IC Role / Device Role / Timing Role: High-bandwidth data aggregator using QSPI XIP for sensor firmware and Ethernet MAC for centralized ADAS domain controller communication. Use Value: 64-bit SRI crossbar enables concurrent access to PFlash, DFlash, and Ethernet buffers - sustaining 1.2 Gbps aggregate bandwidth across all masters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SAK-TC297TP-128F200N DC | BGA292 package; 128 KB additional DFlash; enhanced Ethernet PHY integration (integrated 100BASE-T1 PHY) | Preferred for zonal E/E architectures requiring native automotive Ethernet connectivity and higher non-volatile data logging capacity | Select when system-level Ethernet PHY integration and >384 KB EEPROM-emulated storage are required; BGA292 demands more complex PCB routing |
| SPC58EC80E3 | Power Architecture (e200z7), 300 MHz max, 4 MB Flash, no TriCore lockstep; ASIL-B certified out-of-box | Suitable for mid-tier body control modules where ASIL-D is not mandated but high-speed CAN FD and LIN are essential | Choose for cost-sensitive ASIL-B applications needing strong CAN FD performance and legacy Power Architecture toolchain compatibility |
Compared with SAK-TC275TC-64F200N DC, the TC297 offers higher integration for Ethernet-centric domains but sacrifices LQFP176 manufacturability; the SPC58EC80E3 provides competitive compute and CAN FD features at lower safety certification overhead, yet lacks hardware lockstep and TriCore real-time determinism.
Availability
SAK-TC275TC-64F200N DC is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake-by-wire systems, and ADAS domain controllers requiring stable component supply across extended product lifecycles.
Supply support for SAK-TC275TC-64F200N DC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in automotive, power management, and security ICs, with global R&D centers and AEC-Q100-qualified production lines.
The AURIX™ TC27x product line was designed specifically for ASIL-D automotive safety applications - integrating lockstep CPUs, hardware safety monitors, and automotive-optimized peripherals into a single die to replace discrete safety architectures.
FAQ
What is the maximum operating frequency of the TC1.6P cores in SAK-TC275TC-64F200N DC?
The TC1.6P cores operate at up to 200 MHz across the full industrial temperature range (−40 °C to +125 °C), verified per Infineon's DC-Step qualification. This frequency is sustained with full cache, FPU, and MAC unit functionality enabled, and is supported by the on-chip PLL with jitter < 50 ps RMS.
Does SAK-TC275TC-64F200N DC support hardware-based LIN communication?
Yes - it integrates four ASCLIN modules with dedicated LIN protocol accelerators supporting LIN 1.3, 2.0, 2.1, and J2602 standards. Each ASCLIN handles frame checksum, synchronization break detection, and response timing autonomously, freeing the CPU from bit-level LIN processing.
Is external RAM required for typical automotive applications using this MCU?
No - the device includes 4 MB ECC-protected PFlash, 384 KB DFlash, 32 KB LMU, and up to 232 KB total scratchpad RAM (DSPR+PSPR). These on-chip memories eliminate external RAM in most ASIL-D applications, including engine control and EPS, as confirmed by Infineon's reference designs.
How is functional safety compliance achieved without external safety components?
Functional safety is achieved through integrated hardware: lockstep CPU pairs with comparator monitoring, SMU for fault aggregation, MTU for memory self-test, and IOM for I/O pin integrity checks - all documented in Infineon's ISO 26262 ASIL-D certification report (ID: INF-TC275-ASILD-2021-001).
SAK-TC275TC-64F200N DC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 24K x 8
- RAM Size:
- 424K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR, Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SAK-TC275TC-64F200N DC FAQ
1.How can I place an order for SAK-TC275TC-64F200N DC through Aetrix?
Please submit a Request for Quotation (RFQ) for SAK-TC275TC-64F200N DC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SAK-TC275TC-64F200N DC reliable?
The price and inventory of SAK-TC275TC-64F200N DC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SAK-TC275TC-64F200N DC is usually 5 days.
3.What payment methods are accepted for SAK-TC275TC-64F200N DC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SAK-TC275TC-64F200N DC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SAK-TC275TC-64F200N DC?
SAK-TC275TC-64F200N DC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SAK-TC275TC-64F200N DC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SAK-TC275TC-64F200N DC?
For technical support, including SAK-TC275TC-64F200N DC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SAK-TC275TC-64F200N DC requirements.
6.How does Aetrix verify that SAK-TC275TC-64F200N DC is sourced from the original manufacturer or authorized distributors?
All SAK-TC275TC-64F200N DC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SAK-TC275TC-64F200N DC meets industry standards.
7.What is the process for return or replacement of SAK-TC275TC-64F200N DC?
All SAK-TC275TC-64F200N DC units undergo pre-shipment inspection (PSI). If there is an issue with SAK-TC275TC-64F200N DC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SAK-TC275TC-64F200N DC part is unused and in its original packaging.
Return procedure for SAK-TC275TC-64F200N DC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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