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Infineon Technologies SAK-TC277TC-64F200S DC

Part No.:
SAK-TC277TC-64F200S DC
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
292-LFBGA
Datasheet:
AetrixSAK-TC277TC-64F200S DC.pdf
Description:
IC MCU 32BIT 4MB FLASH 292LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,004

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Product details

Overview

SAK-TC277TC-64F200S DC from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P and one TC1.6E), 4 MB program flash, 384 KB data flash, and integrated safety mechanisms including lockstep execution, ECC-protected memories, and Safety Management Unit (SMU). It operates at up to 200 MHz across the full industrial temperature range (–40 °C to +125 °C) and targets automotive powertrain and chassis control systems.

For engineers reviewing the SAK-TC277TC-64F200S DC datasheet, SAK-TC277TC-64F200S DC pinout, SAK-TC277TC-64F200S DC application, or SAK-TC277TC-64F200S DC equivalent, this page delivers verified core architecture details, validated BGA292 package mapping, confirmed safety features (SMU, HSM, lockstep), real-time peripheral timing (ASCLIN, ERAY, ETH), and functional alternatives for automotive ECU design.

Technical Context

The TC277 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores (200 MHz, dual MAC/FPU, 120 KB DSPR) and one power-efficient TC1.6E core (200 MHz, 112 KB DSPR), all binary-compatible and supported by lockstep shadowing for ASIL-D compliance. The on-chip bus system includes a 64-bit crossbar (SRI), 32-bit SPB, and SFI bridge enabling concurrent memory and peripheral access.

It integrates safety-critical subsystems including Memory Test Unit (MTU) with MBIST, Hardware I/O Monitor (IOM), and optional Hardware Security Module (HSM) supporting AES-128/256, SHA-256, and RSA-2048. Real-time peripherals include four ASCLIN channels (LIN v2.1 compliant, up to 50 MBaud), ERAY controller, Ethernet MAC (MII/RMII), and QSPI with slave/master timing support.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Three TriCore™ CPUs: two TC1.6P (200 MHz, dual MAC/FPU) + one TC1.6E (200 MHz, code-compatible)
Flash Memory 4 MB PFLASH (ECC-protected) + 384 KB DFLASH (EEPROM emulation capable)
SRAM 120 KB DSPR + 32 KB PSPR per TC1.6P; 112 KB DSPR + 24 KB PSPR for TC1.6E; all ECC-protected
Safety Features Lockstep shadow cores, SMU, MTU (MBIST), IOM, and optional HSM with crypto acceleration
Real-Time Peripherals 4× ASCLIN (LIN v2.1, 50 MBaud), ERAY, Ethernet (MII/RMII), QSPI, 64-channel DMA
Operating Temp. –40 °C to +125 °C (full specification, automotive-grade qualification)
Package BGA292 (15 × 15 mm, 0.8 mm pitch, lead-free, RoHS-compliant)

Pinout & Package

SAK-TC277TC-64F200S DC is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad exposed on underside for enhanced heat dissipation in automotive ECU modules. Pin functions are defined per Infineon's TC277x BGA292 pin configuration (DS Section 2.2.1).

Pin/Terminal Circuit Role Design Meaning
VDDP_1P3 Core Power Supply 1.3 V supply for CPU cores and L1 caches; requires low-noise regulation and local decoupling
VDDP_3P3 I/O Power Supply 3.3 V supply for general-purpose I/Os and peripheral interfaces; supports 5 V-tolerant pins via internal level shifters
ERAY_TXD / ERAY_RXD FlexRay Physical Layer Interface Differential pair for high-speed deterministic communication (10 Mbit/s); requires matched trace routing and 100 Ω termination
ETH_MDIO / ETH_MDC Ethernet Management Interface Open-drain MDIO and clocked MDC for PHY register access; operates at ≤2.5 MHz per IEEE 802.3
ASCLIN0_TX / ASCLIN0_RX LIN Bus Transceiver Interface UART-based LIN physical layer interface supporting ISO 17987-2/4; configurable baud rates up to 50 MBaud
TRSTN / TCK / TMS / TDI / TDO JTAG Debug Interface IEEE 1149.1-compliant boundary scan and debug access; supports real-time trace via DAP interface

Key Features

Feature Design Value
Heterogeneous TriCore™ Architecture Enables parallel real-time task partitioning: TC1.6P cores handle safety-critical control loops; TC1.6E manages diagnostics and communication stacks
On-Chip Safety Subsystem SMU monitors CPU lockstep mismatches, memory ECC errors, and clock domain faults-triggering safe state transitions within <10 µs
ECC-Protected Memory Hierarchy All SRAM (DSPR/PSPR/LMU) and Flash (PFLASH/DFLASH) include single-bit error correction and double-bit error detection (SECDED)
Hardware Security Module (HSM) Offloads cryptographic operations (AES-128/256, SHA-256, RSA-2048) from main cores-reducing software latency and attack surface
ASCLIN with LIN Hardware Support Dedicated LIN frame generation/detection logic eliminates CPU overhead for protocol handling-enabling sub-10 µs response to LIN wakeup events

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock control under transient load conditions.

IC Role / Device Role / Timing Role: Primary controller executing ASIL-D safety-critical algorithms with lockstep core validation and hardware watchdog supervision.

Use Value: Deterministic 200 MHz execution enables sub-1 µs interrupt latency for spark/fuel actuation-meeting ISO 26262 ASIL-D timing requirements.

Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque limitation during steering maneuvers.

IC Role / Device Role / Timing Role: Dual-core coordination: TC1.6P runs motor control loop (20 kHz PWM), TC1.6E handles CAN/Ethernet gateway and diagnostics.

Use Value: Integrated 64-channel DMA offloads ADC sampling and PWM update-freeing CPU cycles for safety monitoring without jitter.

Brake-by-Wire System Vehicle Domain Controller

Use Scenario: Redundant hydraulic pressure control, wheel speed fusion, and emergency brake intervention with <100 ms end-to-end latency.

IC Role / Device Role / Timing Role: Safety-critical executor with SMU-triggered safe state activation upon detected fault (e.g., sensor disagreement or memory corruption).

Use Value: MTU-enabled on-the-fly memory testing ensures RAM integrity before critical braking commands-eliminating need for external BIST logic.

Use Scenario: Centralized vehicle networking hub aggregating CAN FD, LIN, Ethernet, and FlexRay traffic for ADAS and infotainment domains.

IC Role / Device Role / Timing Role: High-bandwidth interconnect node using SRI crossbar to route 1 Gbps Ethernet frames while servicing 4× ASCLIN and ERAY simultaneously.

Use Value: Integrated ERAY controller provides deterministic 10 Mbit/s time-triggered communication-replacing discrete FlexRay transceivers and reducing BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
SAK-TC297TP-128F200N DC Higher memory: 8 MB PFLASH, 512 KB DFLASH, 128 KB DSPR per TC1.6P core; adds second Ethernet MAC Targeted at zonal controllers requiring larger OTA update partitions and dual-network redundancy Select when >4 MB flash or dual Ethernet is required; same BGA292 footprint but higher thermal dissipation
SAK-TC234L-32F133N AC Single TC1.6E core, 2 MB PFLASH, 128 KB RAM, no HSM or ERAY; LQFP176 package Cost-sensitive ASIL-B applications like body control modules or HVAC controllers Select for non-safety-critical or lower-compute applications where BGA assembly and HSM are unnecessary

Compared with SAK-TC277TC-64F200S DC, the TC297 offers expanded memory and dual Ethernet for zonal gateways, while the TC234L provides a cost-optimized LQFP alternative for ASIL-B domains-neither matches its triple-core lockstep + HSM + ERAY combination for ASIL-D powertrain use.

Availability

SAK-TC277TC-64F200S DC is available at Aetrix Electronics and suitable for automotive engine control units, electric power steering systems, and brake-by-wire modules requiring stable component supply, long lifecycle support, and ASIL-D certification readiness.

Supply support for SAK-TC277TC-64F200S DC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D centers and automotive-grade manufacturing facilities.

The AURIX™ TC27x product line was designed specifically for ASIL-D automotive applications-including powertrain, chassis, and advanced driver assistance-delivering deterministic real-time performance, hardware safety mechanisms, and secure boot capabilities.

FAQ

What safety certifications does SAK-TC277TC-64F200S DC support?

SAK-TC277TC-64F200S DC is qualified to AEC-Q100 Grade 1 and supports ISO 26262 ASIL-D development per Infineon's certified safety manual (V2.0, 2021). Its integrated SMU, lockstep cores, ECC memory, and MTU enable systematic fault detection and safe state entry within documented timing budgets.

Does this MCU include hardware cryptographic acceleration?

Yes-when configured with the optional Hardware Security Module (HSM), SAK-TC277TC-64F200S DC supports AES-128/256 encryption/decryption, SHA-256 hashing, and RSA-2048 signature verification in dedicated hardware, isolating security operations from the main TriCore™ cores.

What is the maximum operating frequency and temperature range?

The device operates at up to 200 MHz across the full industrial temperature range of –40 °C to +125 °C, with all electrical specifications guaranteed at this speed and temperature per Infineon's DC-step characterization (Data Sheet V1.2, Section 3.4).

Which debug interface does it use, and what trace capability is available?

SAK-TC277TC-64F200S DC uses IEEE 1149.1 JTAG for boundary scan and debug, plus a Debug Access Port (DAP) supporting real-time instruction and data trace via the Embedded Trace Macrocell (ETM) and Data Trace Macrocell (DTM), enabling cycle-accurate profiling in complex AUTOSAR environments.

SAK-TC277TC-64F200S DC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
292-LFBGA
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, POR, WDT
Number of I/O:
-
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
24K x 8
RAM Size:
424K x 8
Voltage - Supply (Vcc/Vdd):
1.17V ~ 5.5V
Data Converters:
A/D 60x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SAK-TC277TC-64F200S DC FAQ

1.How can I place an order for SAK-TC277TC-64F200S DC through Aetrix?

Please submit a Request for Quotation (RFQ) for SAK-TC277TC-64F200S DC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SAK-TC277TC-64F200S DC reliable?

The price and inventory of SAK-TC277TC-64F200S DC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SAK-TC277TC-64F200S DC is usually 5 days.

3.What payment methods are accepted for SAK-TC277TC-64F200S DC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SAK-TC277TC-64F200S DC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SAK-TC277TC-64F200S DC?

SAK-TC277TC-64F200S DC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SAK-TC277TC-64F200S DC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SAK-TC277TC-64F200S DC?

For technical support, including SAK-TC277TC-64F200S DC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SAK-TC277TC-64F200S DC requirements.

6.How does Aetrix verify that SAK-TC277TC-64F200S DC is sourced from the original manufacturer or authorized distributors?

All SAK-TC277TC-64F200S DC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SAK-TC277TC-64F200S DC meets industry standards.

7.What is the process for return or replacement of SAK-TC277TC-64F200S DC?

All SAK-TC277TC-64F200S DC units undergo pre-shipment inspection (PSI). If there is an issue with SAK-TC277TC-64F200S DC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SAK-TC277TC-64F200S DC part is unused and in its original packaging.

Return procedure for SAK-TC277TC-64F200S DC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SAK-TC277TC-64F200S DC Tags

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