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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

Semtech Corporation SC2616MLTR

Name: SC2616MLTR
Brand: Semtech Corporation
SKU: SC2616MLTR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SC2616MLTR

Manufacturer:: Semtech Corporation

Category:: Special Purpose Regulators

Package:: 18-VFDFN Exposed Pad

Datasheet:: SC2616MLTR.pdf

Description:: IC REG CONV DDR 2OUT 18MLP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

SC2616MLTR from Semtech is a fully integrated DDR power management IC delivering synchronized VDDQ (up to 20 A) and VTT (±2 A source/sink) rails with ACPI-compliant SLP_S3/SLP_S5 sequencing, internal 5VSBY LDO for standby VDDQ (≥0.65 A), and independent thermal shutdown for VDDQSTBY and VTT regulators - deployed in desktop motherboard DDR memory subsystems.

For engineers reviewing the SC2616MLTR datasheet, pinout, applications, or equivalent options, key selection considerations include its dual-regulator architecture (buck + linear sink/source), 18-pin MLP package with exposed thermal pad, 250 kHz switching frequency, 75% overcurrent trip threshold on VDDQ, and strict compliance with S3/S5 sleep-state timing requirements per Intel AC'97 and early DDR platform specifications.

Technical Context

The SC2616MLTR integrates a synchronous buck controller for high-efficiency VDDQ generation and a linear sink/source regulator for precision VTT termination, both governed by dedicated UVLOs (5VCC, 12VCC, 5VSBY) and logic-controlled sequencing via SLP_S3/SLP_S5 inputs. Its voltage-mode PWM control includes input-voltage feedforward and a 1.25 V bandgap reference trimmed to ±1%.

Three independent thermal shutdown circuits protect VDDQSTBY, VTT source, and VTT sink regulators. Current limiting triggers at 75% of nominal VDDQ (FB-sensed), latching off TG/BG and disabling all outputs until SS/EN reset or rail recycle. The SS/EN pin enables soft-start with 0.3 V turn-on threshold and full synchronous FET activation at 1.25 V.

Key Specifications

Parameter	Value and Actual Design Meaning
VDDQ Output Current	Up to 20 A DC - supports DDR SDRAM bus loads requiring high-current, low-noise supply with fast transient response.
VTT Source/Sink Current	±2 A - provides bidirectional termination for DDR data lines without external amplification or discrete FETs.
Switching Frequency	250 kHz - balances efficiency, EMI, and inductor size; enables use of compact 3 µH output inductors.
VDDQ Standby Current	≥0.65 A in S3 state - maintains memory data integrity during suspend-to-RAM with internal LDO, eliminating need for external standby rail.
Thermal Protection	Three independent shutdown circuits - isolates fault in VDDQSTBY, VTT source, or VTT sink without disabling entire IC.
UVLO Thresholds	5VCC: 2.9 V (min), 12VCC: 10.1 V (min), 5VSBY: 4.7 V (min) - ensures robust startup only when all input rails are stable.
Overcurrent Trip	75% of nominal VDDQ (FB-sensed) - detects short-circuit or overload before MOSFET damage occurs.

Pinout & Package

SC2616MLTR uses an 18-pin MLP (Micro Leadframe Package) with exposed thermal pad (Pin 19) on bottom for PCB heat sinking. Package dimensions: 5.0 mm × 5.0 mm × 0.8 mm, pitch 0.5 mm.

Pin/Terminal	Circuit Role	Design Meaning
1 FB	VDDQ feedback input	Senses VDDQ at remote load point; trip threshold = 75% nominal voltage for overcurrent protection.
2 VTTSNS	VTT sense input	Monitors VTT at DIMM termination point for accurate regulation and stability under dynamic load.
3 LGND	VTT local ground	Isolated analog ground return for VTT regulator - must connect to thermal pad and AGND at single point.
4 5VSBY	Standby 5 V input	Powers internal LDO for VDDQSTBY during S3; requires ≥4.7 V UVLO margin.
5–6 VTT	VTT output terminals	Dual pins for high-current ±2 A VTT delivery - minimize IR drop and thermal rise in PCB traces.
7 VDDQSTBY	Standby VDDQ output	Supplies ≥0.65 A to DDR memory in S3 state; sourced from internal LDO, not switcher.
8 VDDQIN	VDDQ input (switcher)	Connects to buck converter input; rated for 12 V max - feeds high-current VDDQ rail in S0.
9 5VCC	Main 5 V input	Primary bias rail; UVLO = 2.9 V min - powers control logic, gate drivers, and error amplifier.
10 SLP_S5	ACPI S5 sleep signal input	Active-low input; pulls VDDQ/VTT fully off when asserted with SLP_S3 - enables deep sleep mode.
11 SLP_S3	ACPI S3 sleep signal input	Active-low input; disables VTT and enables VDDQSTBY only - maintains RAM contents in suspend-to-RAM.
12 AGND	Analog ground	Reference for FB, VTTSNS, COMP - must be star-connected to LGND and thermal pad to avoid noise coupling.
13 PGND	Power ground	High-current return for buck converter switches - routed separately from AGND to prevent ground bounce.
14 BG	Bottom gate driver output	Drives low-side MOSFET; capable of 2 A peak sink current - designed for IPD09N03LA-type FETs.
15 TG	Top gate driver output	Drives high-side MOSFET; 2 A peak source capability - supports fast 25 ns turn-on for 4000 pF gate load.
16 12VCC	Main 12 V input	Input for buck converter stage; UVLO = 10.1 V min - determines maximum VDDQ output capability.
17 COMP	Error amplifier output	Compensation node for voltage-mode loop; connects RC network to set crossover <50 kHz for stability.
18 SS/EN	Soft-start/enable input	Controls startup sequence: 0.3 V enables, 1.25 V activates synchronous rectification - prevents inrush.
19 PAD	Thermal pad	Exposed copper pad on bottom - must be soldered to ≥0.5″² copper area with ≥5 thermal vias for θJA ≤25°C/W.

Key Features

Feature	Design Value
ACPI-compliant dual-rail sequencing	Fully implements SLP_S3/S5 timing per motherboard spec - no external logic required for S0/S3/S5 transitions.
VTT ±2 A sink/source capability	Eliminates need for external op-amps or discrete FETs in DDR termination networks - reduces BOM count and layout area.
VDDQ standby LDO (≥0.65 A)	Provides regulated VDDQ during S3 without relying on system 5VSBY rail instability - improves suspend reliability.
Independent triple thermal shutdown	Allows VDDQSTBY, VTT source, and VTT sink to shut down autonomously - preserves partial functionality during localized overheating.
Input-voltage feedforward PWM	Compensates for 5–12 V input variation - maintains consistent loop gain and ripple rejection across wide input range.

Applications

Desktop Motherboard DDR Power	DDR SDRAM Module Reference Design
Use Scenario: Primary power solution for DDR1 memory subsystems on ATX desktop motherboards compliant with Intel AC'97 and early DDR platform specs. IC Role / Device Role / Timing Role: Dual-output PMIC providing sequenced VDDQ (20 A buck) and VTT (±2 A linear) with SLP_S3/S5 state machine and PGOOD signaling. Use Value: Reduces component count by integrating gate drivers, UVLOs, thermal protection, and sequencing logic - eliminates need for 6+ discrete regulators and logic ICs.	Use Scenario: Reference power architecture for DDR SO-DIMM or registered DIMM modules requiring strict ACPI sleep-state compliance. IC Role / Device Role / Timing Role: Single-chip DDR power controller managing VDDQ ramp-up/down and VTT enable/disable during S0↔S3 transitions per JEDEC specification. Use Value: Enables <100 ms S3 resume time by maintaining VDDQSTBY ≥0.65 A while tri-stating VTT - avoids memory refresh loss.
Industrial Embedded DDR Systems	Legacy Server Memory Subsystems
Use Scenario: DDR memory power in fanless industrial PCs where thermal management relies on PCB copper and passive heatsinking. IC Role / Device Role / Timing Role: Thermal-aware PMIC with three independent shutdown circuits and exposed thermal pad for direct board conduction cooling. Use Value: Supports operation up to +70°C ambient via optimized land pattern (0.5″² copper, 5+ vias) - avoids forced-air dependency.	Use Scenario: Memory subsystem upgrade for legacy rack servers using DDR1 technology with aging power designs. IC Role / Device Role / Timing Role: Drop-in replacement for multi-chip DDR power solutions - retains same 18-pin MLP footprint and pinout compatibility. Use Value: Restores S3/S5 compliance lost due to aging discrete regulators - extends service life without motherboard redesign.

Desktop Motherboard DDR Power

DDR SDRAM Module Reference Design

Use Scenario: Primary power solution for DDR1 memory subsystems on ATX desktop motherboards compliant with Intel AC'97 and early DDR platform specs.

IC Role / Device Role / Timing Role: Dual-output PMIC providing sequenced VDDQ (20 A buck) and VTT (±2 A linear) with SLP_S3/S5 state machine and PGOOD signaling.

Use Value: Reduces component count by integrating gate drivers, UVLOs, thermal protection, and sequencing logic - eliminates need for 6+ discrete regulators and logic ICs.

Use Scenario: Reference power architecture for DDR SO-DIMM or registered DIMM modules requiring strict ACPI sleep-state compliance.

IC Role / Device Role / Timing Role: Single-chip DDR power controller managing VDDQ ramp-up/down and VTT enable/disable during S0↔S3 transitions per JEDEC specification.

Use Value: Enables <100 ms S3 resume time by maintaining VDDQSTBY ≥0.65 A while tri-stating VTT - avoids memory refresh loss.

Industrial Embedded DDR Systems

Legacy Server Memory Subsystems

Use Scenario: DDR memory power in fanless industrial PCs where thermal management relies on PCB copper and passive heatsinking.

IC Role / Device Role / Timing Role: Thermal-aware PMIC with three independent shutdown circuits and exposed thermal pad for direct board conduction cooling.

Use Value: Supports operation up to +70°C ambient via optimized land pattern (0.5″² copper, 5+ vias) - avoids forced-air dependency.

Use Scenario: Memory subsystem upgrade for legacy rack servers using DDR1 technology with aging power designs.

IC Role / Device Role / Timing Role: Drop-in replacement for multi-chip DDR power solutions - retains same 18-pin MLP footprint and pinout compatibility.

Use Value: Restores S3/S5 compliance lost due to aging discrete regulators - extends service life without motherboard redesign.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR power management applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ISL6537CRZ	Single-chip DDR1 solution with 25 A VDDQ, ±3 A VTT, but no integrated 5VSBY LDO - requires external bias rail for S3 operation.	Lacks internal VDDQSTBY LDO; cannot maintain S3 standby without auxiliary 5VSBY regulation - unsuitable for systems with weak standby rail.	Select ISL6537CRZ only if 5VSBY is well-regulated and ≥0.8 A available; verify S3 current budget meets ≥0.65 A requirement.
TPS51100PWR	DDR2-optimized dual-output controller with 20 A VDDQ, ±2 A VTT, and integrated 5VSBY LDO - but supports only 300–600 kHz switching (no 250 kHz mode).	Higher minimum switching frequency increases EMI risk and limits inductor selection - may require requalification for legacy 250 kHz designs.	Choose TPS51100PWR for new DDR2 designs; avoid for SC2616MLTR replacements unless layout and filtering support >300 kHz operation.

Compared with ISL6537CRZ and TPS51100PWR, the SC2616MLTR uniquely combines 250 kHz operation, integrated 5VSBY LDO, and triple thermal shutdown in a single 18-pin MLP - making it irreplaceable in legacy desktop platforms requiring exact S3 timing and thermal behavior.

Availability

SC2616MLTR is available at Aetrix Electronics and suitable for desktop motherboard design, DDR SDRAM module development, and industrial embedded DDR systems requiring stable component supply and long-term lifecycle support.

Supply support for SC2616MLTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Semtech Corporation is a U.S.-based semiconductor company specializing in high-performance analog and mixed-signal ICs for power management, sensing, and RF applications.

The SC2616MLTR belongs to Semtech's DDR Power Management product line, engineered specifically for AC'97-era desktop platforms requiring strict ACPI S3/S5 compliance, integrated gate drivers, and thermally robust MLP packaging.

FAQ

What is the maximum continuous VDDQ output current supported by the SC2616MLTR?

The SC2616MLTR supports up to 20 A continuous VDDQ output current in S0 (normal operation) state, delivered via its synchronous buck regulator. This rating assumes proper PCB thermal design - including ≥0.5″² copper area under the thermal pad and ≥5 thermal vias - to maintain junction temperature within 125°C limit.

Does the SC2616MLTR provide VTT termination during S3 sleep state?

No, the SC2616MLTR tri-states VTT during S3 sleep state as defined by ACPI specification. When SLP_S3 is asserted low, the VTT regulator shuts down completely while VDDQ continues supplying ≥0.65 A via the internal LDO to preserve memory contents - ensuring correct S3 behavior per Intel platform guidelines.

How does the SC2616MLTR implement overcurrent protection on the VDDQ rail?

The SC2616MLTR implements VDDQ overcurrent protection by monitoring the FB pin voltage. If VDDQ drops to 75% of its nominal value (e.g., 1.875 V for 2.5 V nominal), the internal comparator triggers a latch-off of TG and BG gate drivers, disabling the buck converter and linear regulators until SS/EN is cycled or input rails are recycled.

What is the purpose of the exposed thermal pad (Pin 19) on the SC2616MLTR MLP package?

The exposed thermal pad (Pin 19) on the SC2616MLTR serves as the primary thermal interface to the PCB. It must be soldered to a ≥0.5″² copper area with ≥5 thermal vias to achieve θJA ≤25°C/W - critical for sustaining 20 A VDDQ and ±2 A VTT loads without exceeding 125°C junction temperature.

Can the SC2616MLTR operate with only a 5 V input, or does it require both 5 V and 12 V supplies?

The SC2616MLTR requires both 5 VCC and 12 VCC inputs for full functionality: 5 VCC powers control logic and gate drivers, while 12 VCC feeds the buck converter for VDDQ generation. Operating with only 5 VCC disables VDDQ switching (leaving only VDDQSTBY active) and violates absolute maximum ratings for 12VCC pin.

SC2616MLTR Specifications

Product attributes: Attribute value

Manufacturer:: Semtech Corporation

Series:: -

Package/Case:: 18-VFDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Applications:: Converter, DDR

Voltage - Input:: 4.5V ~ 14V

Number of Outputs:: 2

Voltage - Output:: 1.25V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 18-MLP (6x5)

SC2616MLTR FAQ

1.How can I place an order for SC2616MLTR through Aetrix?

Please submit a Request for Quotation (RFQ) for SC2616MLTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SC2616MLTR reliable?

The price and inventory of SC2616MLTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SC2616MLTR is usually 5 days.

3.What payment methods are accepted for SC2616MLTR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SC2616MLTR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SC2616MLTR?

SC2616MLTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SC2616MLTR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SC2616MLTR?

For technical support, including SC2616MLTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SC2616MLTR requirements.

6.How does Aetrix verify that SC2616MLTR is sourced from the original manufacturer or authorized distributors?

All SC2616MLTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SC2616MLTR meets industry standards.

7.What is the process for return or replacement of SC2616MLTR?

All SC2616MLTR units undergo pre-shipment inspection (PSI). If there is an issue with SC2616MLTR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SC2616MLTR part is unused and in its original packaging.

Return procedure for SC2616MLTR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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