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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

Vishay Siliconix SI9169BQ-T1-E3

Name: SI9169BQ-T1-E3
Brand: Vishay Siliconix
SKU: SI9169BQ-T1-E3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SI9169BQ-T1-E3

Manufacturer:: Vishay Siliconix

Category:: Special Purpose Regulators

Package:: 20-TSSOP (0.173", 4.40mm Width)

Datasheet:: SI9169BQ-T1-E3.pdf

Description:: IC REG CONV 1 CELL 1OUT 20TSSOP

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Product details

Overview

SI9169BQ-T1-E3 from Vishay Siliconix is a high-frequency, fully integrated synchronous buck/boost DC-DC converter IC designed for single-cell Li-ion power rails in cellular handsets. It delivers up to 1 A output current at 3.6 V, supports 2.7–6 V input, operates up to 2 MHz switching frequency, and features programmable PWM/PSM mode control with <200 µA quiescent current in PSM - enabling efficient baseband and PA power delivery in space-constrained mobile applications.

For engineers reviewing the SI9169BQ-T1-E3 datasheet, SI9169BQ-T1-E3 pinout, SI9169BQ-T1-E3 application, or SI9169BQ-T1-E3 equivalent, key selection considerations include its -25 °C to 85 °C industrial temperature rating, TSSOP-20 package, 100 % duty cycle capability in buck mode, integrated MOSFETs, and synchronization support for noise-sensitive RF subsystems.

Technical Context

The SI9169BQ-T1-E3 implements voltage-mode control with an internal 2 MHz oscillator adjustable via ROSC (25–300 kΩ), enabling compact magnetics design. Its dual-mode topology is selected by the MODE pin (AGND for buck, VDD for boost), and it integrates UVLO, POR, soft-start, and overtemperature protection (trip at 165 °C, hysteresis 25 °C).

It uses dedicated PGND and GND pins for signal/power separation, supports external synchronization (FSYNC/FOSC = 1.2–1.5×), and employs fixed 20 ns break-before-make timing to prevent shoot-through. The error amplifier provides 2 MHz GBW and 3.5 V/µs slew rate for fast transient response in both buck and boost configurations.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.7 V to 6 V - supports full discharge range of single-cell Li-ion batteries (2.8–4.2 V typical) without external LDO pre-regulation.
Max Output Current	1000 mA at 3.6 V - sufficient for baseband processors and medium-power RF PAs in GSM/UMTS handsets.
Switching Frequency	Up to 2 MHz - enables use of ≤2 mm height inductors and <10 µF total output capacitance, reducing board area.
Quiescent Current	<200 µA in PSM mode - extends standby battery life while maintaining regulation during light-load conditions.
Duty Cycle Range	Buck: up to 100 %; Boost: up to 75 % - 100 % enables linear-regulator-like operation near battery EOL; 75 % prevents inductor saturation in boost.
Reference Voltage	1.30 V ±20 mV - sets feedback threshold for precise output voltage programming via external resistor divider.
Shutdown Current	<1 µA - minimizes battery drain during system sleep or power-off states.
Operating Temp	-25 °C to +85 °C - qualified for industrial-grade handset and portable electronics environments.

Pinout & Package

The SI9169BQ-T1-E3 is housed in a lead-free, RoHS-compliant 20-pin TSSOP package (6.5 mm × 4.4 mm × 1.1 mm max height) with exposed thermal pad (PGND-connected) for enhanced power dissipation.

Pin/Terminal	Circuit Role	Design Meaning
1	GND	Low-power controller ground; optional connection for loads <600 mA - simplifies layout when full current not required.
2	SD	Active-low shutdown control - reduces total supply current to <1 µA, enabling deep-sleep system states.
3	PWM/PSM	Mode select input - logic high enables constant-frequency PWM; low enables pulse-skipping for light-load efficiency.
4–6	VIN/OUT	Shared node for buck input / boost output - eliminates need for separate input/output traces in dual-mode designs.
7	SYNC	External clock sync input - accepts logic-high-to-low edge to align switching with system clocks, reducing EMI in RF sections.
8	GND	Second low-power ground - separates analog reference ground from digital control ground to minimize noise coupling.
9	VREF	1.3 V precision reference output - requires 0.1 µF decoupling capacitor to stabilize feedback loop and suppress reference noise.
10	FB	Inverting input of error amplifier - connects to resistor divider from VO to set regulated output voltage (e.g., 2.7 V, 3.3 V, 3.6 V).
11	COMP	Error amplifier output - interfaces with external RC compensation network to optimize stability and transient response.
12	ROSC	Oscillator frequency programming - resistor value (25–300 kΩ) directly sets switching frequency from 200 kHz to 2 MHz.
13	VDD	Analog supply input - powers internal bias, reference, and control circuitry; shares 2.7–6 V input range with VIN/OUT.
14	VO	Direct output voltage sensing - used in PSM mode to monitor peak inductor current and maintain regulation without FB loop delay.
15	VS	MOSFET driver supply - powers gate drivers for integrated high-side P-channel and low-side N-channel switches.
16–17	PGND	Power ground return - dedicated path for high-current switch node return, minimizing ground bounce and improving EMI performance.
18	MODE	Topology select - tied to AGND for buck; to VDD for boost - configures internal drive logic and duty-cycle limits accordingly.
19–20	COIL	Inductor connection node - carries full switching current (up to 3 A peak); requires low-inductance, wide-copper routing.

Key Features

Feature	Design Value
Fully integrated MOSFETs	On-chip 130 mΩ P-channel (high-side) and 160 mΩ N-channel (low-side) switches eliminate external FETs and gate drivers, reducing BOM count and layout complexity.
100 % duty cycle buck mode	Enables dropout-free operation down to battery voltages as low as 2.8 V, extending talk time by delivering full output voltage even at end-of-life cell voltage.
Programmable PWM/PSM mode	Dynamic switching between high-efficiency pulse-skipping (PSM) at light load and stable PWM at full load maintains >90 % efficiency across 10 µA–1 A load range.
Synchronization input (SYNC)	Allows alignment of switching edges to system clocks or other converters, reducing beat frequencies and conducted EMI in multi-rail power systems.
Integrated soft-start and UVLO	6 ms soft-start prevents inrush current; 2.4 V UVLO with 0.1 V hysteresis ensures clean startup and avoids oscillation during battery ramp-up.
Thermal shutdown with hysteresis	165 °C trip point with 25 °C hysteresis disables output until junction cools to 140 °C, protecting against sustained overload or poor heatsinking.

Applications

Cellular Baseband Power	RF Power Amplifier Supply
Use Scenario: Powering ARM-based baseband processors and memory subsystems in 2G/3G smartphones with dynamic load profiles (10 mA idle to 800 mA active). IC Role / Device Role / Timing Role: Primary buck converter supplying regulated 2.7 V or 3.3 V rail; operates in PWM mode during call processing and transitions to PSM during standby. Use Value: Delivers 95 % peak efficiency at 3.6 V input and 1 A load, while <200 µA PSM quiescent current extends standby time beyond 300 hours on a 1000 mAh battery.	Use Scenario: Providing dynamically adjustable 3.6 V supply to GSM/EDGE power amplifiers requiring fast load transient response and low output ripple. IC Role / Device Role / Timing Role: Synchronous boost converter configured via MODE pin; uses 2 MHz switching to minimize output ripple (<10 mV p-p) and enable fast current step response. Use Value: Achieves 90 % efficiency at 300 mA load with 3.3 V input, and 2 MHz operation allows use of 1.5 µH inductor with 2 mm height - critical for ultra-thin handset form factors.
Portable Media Player Core Logic	USB OTG Host Power
Use Scenario: Regulating 1.8 V core voltage for application processors in handheld media players with bursty video decode workloads. IC Role / Device Role / Timing Role: Buck converter operating in PWM mode with COMP-compensated loop; utilizes 2 MHz switching to reduce output capacitor requirements to <10 µF ceramic. Use Value: Maintains ±1 % output regulation across 0–1 A load steps within 5 µs, eliminating need for large bulk capacitors and enabling PCB area savings >30 % vs. 500 kHz solutions.	Use Scenario: Generating 5 V USB OTG host supply from a 3.6 V Li-ion battery in smartphones and tablets. IC Role / Device Role / Timing Role: Synchronous boost converter with MODE = VDD; uses 75 % max duty cycle limit to prevent inductor saturation during 500 mA load transients. Use Value: Provides stable 5.0 V ±2 % output at 500 mA with <15 mV p-p ripple, meeting USB 2.0 host power requirements without external LDO post-regulation.

Cellular Baseband Power

RF Power Amplifier Supply

Use Scenario: Powering ARM-based baseband processors and memory subsystems in 2G/3G smartphones with dynamic load profiles (10 mA idle to 800 mA active).

IC Role / Device Role / Timing Role: Primary buck converter supplying regulated 2.7 V or 3.3 V rail; operates in PWM mode during call processing and transitions to PSM during standby.

Use Value: Delivers 95 % peak efficiency at 3.6 V input and 1 A load, while <200 µA PSM quiescent current extends standby time beyond 300 hours on a 1000 mAh battery.

Use Scenario: Providing dynamically adjustable 3.6 V supply to GSM/EDGE power amplifiers requiring fast load transient response and low output ripple.

IC Role / Device Role / Timing Role: Synchronous boost converter configured via MODE pin; uses 2 MHz switching to minimize output ripple (<10 mV p-p) and enable fast current step response.

Use Value: Achieves 90 % efficiency at 300 mA load with 3.3 V input, and 2 MHz operation allows use of 1.5 µH inductor with 2 mm height - critical for ultra-thin handset form factors.

Portable Media Player Core Logic

USB OTG Host Power

Use Scenario: Regulating 1.8 V core voltage for application processors in handheld media players with bursty video decode workloads.

IC Role / Device Role / Timing Role: Buck converter operating in PWM mode with COMP-compensated loop; utilizes 2 MHz switching to reduce output capacitor requirements to <10 µF ceramic.

Use Value: Maintains ±1 % output regulation across 0–1 A load steps within 5 µs, eliminating need for large bulk capacitors and enabling PCB area savings >30 % vs. 500 kHz solutions.

Use Scenario: Generating 5 V USB OTG host supply from a 3.6 V Li-ion battery in smartphones and tablets.

IC Role / Device Role / Timing Role: Synchronous boost converter with MODE = VDD; uses 75 % max duty cycle limit to prevent inductor saturation during 500 mA load transients.

Use Value: Provides stable 5.0 V ±2 % output at 500 mA with <15 mV p-p ripple, meeting USB 2.0 host power requirements without external LDO post-regulation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck/boost converter applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPS63020DSJR	Higher 2.5 A output current; wider 1.8–5.5 V input; no SYNC pin; 2.4 MHz fixed frequency.	Targeted at higher-current portable devices (e.g., tablets); lacks synchronization for RF-coordinated power systems.	Choose for higher current needs and simpler layout; avoid if EMI-sensitive RF synchronization is required.
MAX8646ETE+	3 MHz max frequency; integrated I²C interface for dynamic voltage scaling; -40 °C to 85 °C rating.	Designed for advanced DVFS in application processors; requires I²C control infrastructure.	Choose for software-controlled voltage scaling; avoid if standalone analog control is preferred or cost sensitivity is high.

Compared with TPS63020DSJR and MAX8646ETE+, the SI9169BQ-T1-E3 offers unique synchronization capability and 100 % buck duty cycle for maximum battery utilization, making it optimal for cost-sensitive, RF-integrated cellular handsets where analog control suffices and EMI coordination is critical.

Availability

SI9169BQ-T1-E3 is available at Aetrix Electronics and suitable for cellular handset power management, portable media player core logic, and USB OTG host supply applications requiring stable component supply and legacy design continuity.

Supply support for SI9169BQ-T1-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-reliability power management, MOSFETs, and precision analog devices for demanding industrial and consumer applications.

The Si9169 product line was engineered specifically for high-density, battery-powered mobile electronics - integrating synchronous switching, adaptive mode control, and thermal robustness to replace multi-component buck/boost solutions in space-constrained cellular platforms.

FAQ

What is the operating temperature range for the SI9169BQ-T1-E3?

The SI9169BQ-T1-E3 is rated for industrial operation from -25 °C to +85 °C. This specification is confirmed in the Vishay datasheet (Document Number: 70945, Rev. E) under Ordering Information and Absolute Maximum Ratings. The SI9169DQ-T1-E3 variant extends the lower limit to -40 °C, but the SI9169BQ-T1-E3 strictly adheres to the -25 °C minimum. Thermal shutdown activates at 165 °C with 25 °C hysteresis, ensuring safe operation within this ambient range.

Can the SI9169BQ-T1-E3 operate in both buck and boost modes on the same PCB?

Yes, the SI9169BQ-T1-E3 supports both buck and boost topologies on a single PCB via the MODE pin: connect MODE to AGND for buck operation, or to VDD for boost. The VIN/OUT pins serve as input in buck mode and output in boost mode, and the internal MOSFET drive logic automatically adapts. However, the maximum controllable duty cycle differs - 85 % in buck (Si9169BQ) and 65 % in boost - and the inductor must be rated for bidirectional current flow and appropriate saturation current in both configurations.

What is the purpose of Pin 1 on the SI9169BQ-T1-E3, and when must it be connected?

Pin 1 on the SI9169BQ-T1-E3 is labeled GND and serves as a low-power controller ground. According to the Vishay datasheet, it may be left unconnected for load currents below 600 mA to simplify layout. However, for full 1 A load conditions, Pin 1 must be connected to the low-power controller ground plane to ensure proper biasing of internal analog circuitry and maintain regulation accuracy and thermal stability under maximum stress.

Does the SI9169BQ-T1-E3 support external clock synchronization, and what are the requirements?

Yes, the SI9169BQ-T1-E3 supports external clock synchronization via the SYNC pin. A logic-high-to-low transition on SYNC forces alignment of the internal oscillator. The external clock frequency must fall within 1.2× to 1.5× the internal oscillator frequency (e.g., 2.4–3.0 MHz for a 2 MHz internal clock). The SYNC pin must be pulled to VDD if unused. This feature is explicitly documented in the Functional Block Diagram and PIN DESCRIPTION section of the datasheet (Document Number: 70945).

Is the SI9169BQ-T1-E3 still in production, and what is its lifecycle status?

No, the SI9169BQ-T1-E3 is End of Life (EOL), with discontinuation effective December 2014, as stated in the Vishay datasheet (Document Number: 70945, Rev. E, 08-Oct-07): "Product is End of Life 12/2014". While Aetrix Electronics maintains limited legacy stock for design continuity and repair, no new manufacturing runs are planned. Customers are advised to evaluate drop-in alternatives such as the TPS63020DSJR or plan migration to newer-generation buck/boost ICs with extended support.

SI9169BQ-T1-E3 Specifications

Product attributes: Attribute value

Manufacturer:: Vishay Siliconix

Series:: -

Package/Case:: 20-TSSOP (0.173", 4.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Applications:: Converter, 1-Cell Lithium Ion Portable Communication Devices

Voltage - Input:: 2.7V ~ 6V

Number of Outputs:: 1

Voltage - Output:: Adj to 1.3V

Operating Temperature:: -25°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 20-TSSOP

SI9169BQ-T1-E3 FAQ

1.How can I place an order for SI9169BQ-T1-E3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SI9169BQ-T1-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI9169BQ-T1-E3 reliable?

The price and inventory of SI9169BQ-T1-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI9169BQ-T1-E3 is usually 5 days.

3.What payment methods are accepted for SI9169BQ-T1-E3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI9169BQ-T1-E3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI9169BQ-T1-E3?

SI9169BQ-T1-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI9169BQ-T1-E3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI9169BQ-T1-E3?

For technical support, including SI9169BQ-T1-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI9169BQ-T1-E3 requirements.

6.How does Aetrix verify that SI9169BQ-T1-E3 is sourced from the original manufacturer or authorized distributors?

All SI9169BQ-T1-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI9169BQ-T1-E3 meets industry standards.

7.What is the process for return or replacement of SI9169BQ-T1-E3?

All SI9169BQ-T1-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SI9169BQ-T1-E3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI9169BQ-T1-E3 part is unused and in its original packaging.

Return procedure for SI9169BQ-T1-E3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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