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Vishay Siliconix SIC401ACD-T1-GE3

Part No.:
SIC401ACD-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
Voltage Regulators - Linear + Switching
Package:
32-PowerVFQFN
Datasheet:
AetrixSIC401ACD-T1-GE3.pdf
Description:
IC REG DL BUCK/LNR SYNC MLP55-32
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:15,337

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Product details

Overview

SIC401ACD-T1-GE3 from Vishay Siliconix is a 15 A synchronous buck regulator with integrated power MOSFETs, bootstrap switch, and a programmable 200 mA LDO in a PowerPAK® MLP32-55G package. It delivers up to 93 % peak efficiency across 3 V–17 V input, supports 0.6 V–VIN×0.75 output, operates at 200 kHz–1 MHz, and targets point-of-load regulation in notebook and server power rails.

For engineers reviewing the SIC401ACD-T1-GE3 datasheet, SIC401ACD-T1-GE3 pinout, SIC401ACD-T1-GE3 application, or SIC401ACD-T1-GE3 equivalent, key selection criteria include its pseudo-fixed-frequency adaptive on-time control, independent enable for switcher/LDO, selectable ultra-sonic power-save mode (SiC401A), and integrated valley current limit with temperature compensation.

Technical Context

The SIC401ACD-T1-GE3 implements pseudo-fixed-frequency adaptive on-time control using output ripple as the PWM ramp signal, eliminating error amplifier and compensation components. Its one-shot timer generates on-time proportional to VOUT and inversely proportional to VIN, enabling fast transient response and predictable frequency behavior.

It integrates dual power paths: a 15 A synchronous buck stage with internal high-side/low-side MOSFETs and LX node, plus a 200 mA programmable LDO with bypass logic and switch-over between VLDO and VOUT. The LDO can supply VDD bias or drive external n-channel MOSFETs, with independent ENL control and 1.2 V dropout at 100 mA.

Key Specifications

ParameterValue and Actual Design Meaning
Input voltage range3 V to 17 V - supports wide-input industrial and computing rails including 5 V, 12 V, and 15 V bus systems.
Output current15 A continuous - enables single-chip point-of-load conversion for CPU/GPU core rails without external MOSFETs.
Switching frequency200 kHz to 1 MHz - programmable via tON resistor; higher frequencies reduce inductor size but increase switching loss.
Peak efficiency93 % - achieved at mid-load with ceramic output capacitors, enabling compact all-ceramic designs.
LDO outputProgrammable 200 mA - configurable via FBL resistor divider; supports 3 V–5.5 V bias or external gate drive.
Control methodPseudo-fixed-frequency adaptive on-time - eliminates loop compensation, reduces component count, and improves load transient response.
PackagePowerPAK MLP32-55G (5 mm × 5 mm) - thermally enhanced QFN with exposed thermal pad and multiple PGND/LX pins for low-inductance layout.

Pinout & Package

Package: PowerPAK® MLP32-55G - 5 mm × 5 mm, 32-pin, thermally optimized QFN with exposed thermal pad (PAD 1, PAD 2, PAD 3). Features multiple parallel LX and PGND terminals to minimize parasitic inductance and improve thermal dissipation.

Pin/TerminalCircuit RoleDesign Meaning
FB (Pin 1)Feedback inputConnects to resistor divider from VOUT to AGND; sets output voltage with ±1 % reference accuracy.
VOUT (Pin 2)Voltage sense / LDO switchover inputSenses switcher output; used internally to compare against VLDO for automatic switchover when |VLDO − VOUT| < 130 mV.
VDD (Pin 3)Bias supply input/outputAccepts external 3–5.5 V supply or outputs LDO-regulated voltage; powers internal circuitry and gate drivers.
AGND (Pins 4, 30, PAD 1)Analog groundReference for FB, FBL, SS, ILIM; must be separated from PGND and connected to quiet analog ground plane.
FBL (Pin 5)LDO feedback inputConnects to resistor divider from VDD to AGND; programs LDO output voltage independently of main regulator.
VIN (Pins 6, 9–11, PAD 2)Main input supply3–17 V input to high-side MOSFET and bootstrap circuit; multiple pins reduce IR drop and improve current sharing.
SS (Pin 7)Soft-start capacitorInternal 3 μA current source charges external capacitor; controls VOUT ramp rate to prevent inrush current.
BST (Pin 8)Bootstrap supplyConnects 100 nF+ capacitor to LX; generates floating gate drive voltage for high-side MOSFET.
LXBST (Pin 13)LX boost connectionDirect tie to BST capacitor; enhances bootstrap charge retention during high-duty-cycle operation.
LX (Pins 23–25, PAD 3)Switching nodeDrives external inductor; multiple pins reduce trace inductance and EMI; connects to internal high/low-side MOSFETs.
PGND (Pins 15–22)Power groundHigh-current return path for MOSFETs and inductor; must be solid copper pour tied to thermal pad for thermal performance.
PGOOD (Pin 26)Open-drain status indicatorAsserts high-impedance when VOUT is within ±10 % of target; requires external pull-up for logic-level signaling.
ILIM (Pin 27)Current limit programmingResistor from ILIM to LXS sets valley current limit threshold (12.75–17.25 A); includes temperature compensation.
LXS (Pin 28)LX senseConnects to ILIM resistor; provides accurate sensing of inductor current zero-crossing for valley detection.
EN/PSV (Pin 29)Enable / power-save controlLogic high enables ultra-sonic power-save mode (SiC401A); float enables forced continuous conduction mode.
tON (Pin 31)On-time programmingResistor to AGND sets nominal on-time (999–1220 ns @ 12 V/5 V); determines operating frequency in adaptive on-time mode.
ENL (Pin 32)LDO enableDrive low to disable LDO; use resistor divider from VIN to ENL to program VIN UVLO threshold (2.4–2.95 V).

Key Features

FeatureDesign Value
All-ceramic solution supportEliminates electrolytic capacitors by leveraging adaptive on-time control and stable loop dynamics with low-ESR MLCCs.
Independent switcher/LDO enableEN/PSV and ENL pins allow separate sequencing and fault isolation-e.g., keep LDO active while disabling buck stage.
Ultra-sonic power-save mode (SiC401A)Operates below 20 kHz only during light loads, avoiding audible noise while maintaining regulation without burst-mode artifacts.
Temperature-compensated current limitValley current limit adjusts with junction temperature to maintain consistent overcurrent protection across -40 °C to +125 °C.
Programmable soft-start and soft-shutdownSS pin controls startup ramp; soft-shutdown discharges VOUT through internal FET when EN/PSV is pulled low.
Integrated bootstrap switchReduces external component count by integrating the bootstrap diode/switch, improving reliability and reducing board space.

Applications

Notebook Core Voltage RegulationServer Point-of-Load Supply

Use Scenario: Regulating 1.0–1.5 V core voltage for Intel/AMD mobile CPUs under dynamic load from 0 A to 15 A.

IC Role / Device Role / Timing Role: Primary synchronous buck converter with integrated MOSFETs and adaptive on-time control for fast transient response.

Use Value: Delivers 93 % peak efficiency and sub-100 µs load-step recovery using only ceramic output capacitors-reducing BOM cost and footprint.

Use Scenario: Providing stable 3.3 V or 5 V auxiliary rail for FPGA I/O banks or memory interfaces in 1U servers.

IC Role / Device Role / Timing Role: Standalone buck regulator with programmable frequency and independent LDO for biasing auxiliary circuits.

Use Value: Enables single-chip solution with 15 A capability and 200 mA LDO, eliminating discrete bias supplies and simplifying layout.

Digital HDTV SoC PowerNetworking ASIC Core Rail

Use Scenario: Powering ARM-based SoC cores (e.g., Amlogic, Realtek) requiring 0.8–1.2 V at up to 12 A in compact TV mainboards.

IC Role / Device Role / Timing Role: High-efficiency microBUCK® regulator with ultra-sonic power-save mode to eliminate audible coil whine during standby.

Use Value: Maintains regulation down to 1 mA load with no acoustic noise-critical for consumer audio-visual environments.

Use Scenario: Delivering 0.85 V core voltage to multi-core networking ASICs (e.g., Broadcom BCM56xx) with rapid load transients up to 10 A/µs.

IC Role / Device Role / Timing Role: Adaptive on-time buck controller with valley current limit and fast comparator-based loop for < 20 µs transient recovery.

Use Value: Achieves ±15 mV output deviation under 0→11 A load step-preserving ASIC timing margins without oversized bulk capacitance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MP2451DT-LF-Z3 A max output, no integrated LDO, fixed 2.2 MHz frequency, smaller TSOT23-8 packageTargeted at low-power peripherals-not suitable for 15 A core railsSelect only for sub-3 A auxiliary rails where size and fixed frequency outweigh need for high current or bias integration.
TPS54560QDGQRQ15.5 A max, external MOSFETs required, adjustable frequency 100 kHz–2.5 MHz, automotive-grade (-40 °C to +125 °C)Requires external high-side/low-side FETs and driver; suited for harsh-environment industrial useChoose when AEC-Q100 qualification, extended temperature, or design flexibility with discrete FETs is mandatory.

Compared with MP2451DT-LF-Z and TPS54560QDGQRQ1, the SIC401ACD-T1-GE3 uniquely integrates 15 A power stages and a 200 mA LDO in a single 5 mm × 5 mm package, enabling compact, high-current point-of-load designs without external FETs or bias ICs-ideal for space-constrained computing and consumer electronics.

Availability

SIC401ACD-T1-GE3 is available at Aetrix Electronics and suitable for notebook core voltage regulation, server point-of-load supplies, digital HDTV SoC power, and networking ASIC core rails requiring stable component supply, long-term lifecycle support, and qualified automotive-grade alternatives.

Supply support for SIC401ACD-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-performance power management solutions with emphasis on efficiency, thermal robustness, and reliability.

The SiC401A product line delivers integrated microBUCK® regulators targeting high-current, space-constrained DC/DC conversion in computing, consumer, and communications infrastructure-designed to replace multi-component solutions with single-chip efficiency and simplified layout.

FAQ

What is the maximum continuous output current supported by the SIC401ACD-T1-GE3?

The SIC401ACD-T1-GE3 supports 15 A continuous output current under recommended operating conditions (TA ≤ +85 °C, proper PCB thermal design). This rating assumes adequate copper area, thermal vias to inner layers, and airflow. Derating applies above +85 °C ambient or with insufficient heatsinking-refer to RthJA = 50 °C/W and maximum PD = 3.4 W at 25 °C ambient.

Does the SIC401ACD-T1-GE3 require external MOSFETs for operation?

No, the SIC401ACD-T1-GE3 integrates both high-side and low-side power MOSFETs, bootstrap switch, and gate drivers. It operates as a complete synchronous buck regulator with only external components: input/output capacitors, inductor, feedback resistors, BST capacitor, and optional soft-start capacitor. No external FETs are needed for 15 A operation.

How does the ultra-sonic power-save mode in the SIC401ACD-T1-GE3 differ from standard pulse-skipping mode?

The SIC401ACD-T1-GE3's ultra-sonic power-save mode (enabled via EN/PSV = VDD) operates switching below 20 kHz only during light loads, eliminating audible coil whine while maintaining tight output regulation. Unlike standard pulse-skipping, it avoids large output voltage excursions and EMI spikes by preserving controlled low-frequency bursts with consistent timing-verified in SiC401A-specific test data.

Can the internal LDO in the SIC401ACD-T1-GE3 be disabled and bypassed?

Yes, the internal 200 mA LDO can be fully disabled by grounding ENL (Pin 32), and bypassed by supplying an external 3–5.5 V bias to VDD (Pin 3). When bypassed, the LDO output is disconnected, allowing external bias to power gate drivers and internal circuitry-improving overall system efficiency by eliminating LDO dropout loss.

What is the purpose of the LXS (Pin 28) and ILIM (Pin 27) pins on the SIC401ACD-T1-GE3?

LXS (Pin 28) and ILIM (Pin 27) form a precision valley current-sense pair: LXS connects directly to the source of the low-side MOSFET, and ILIM accepts a resistor to LXS that sets the current-limit threshold (12.75–17.25 A). This arrangement enables accurate, temperature-compensated overcurrent protection without requiring a sense resistor in the high-side path.

SIC401ACD-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
microBUCK®
Package/Case:
32-PowerVFQFN
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Topology:
Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
Number of Outputs:
2
Frequency - Switching:
200kHz ~ 1MHz
Voltage/Current - Output 1:
0.6V ~ 5.5V, 15A
Voltage/Current - Output 2:
Adj to 0.75V, 200mA
Voltage/Current - Output 3:
-
w/LED Driver:
No
w/Supervisor:
No
w/Sequencer:
No
Voltage - Supply:
3V ~ 17V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® MLP55-32

SIC401ACD-T1-GE3 FAQ

1.How can I place an order for SIC401ACD-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIC401ACD-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIC401ACD-T1-GE3 reliable?

The price and inventory of SIC401ACD-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIC401ACD-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIC401ACD-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIC401ACD-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIC401ACD-T1-GE3?

SIC401ACD-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIC401ACD-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIC401ACD-T1-GE3?

For technical support, including SIC401ACD-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIC401ACD-T1-GE3 requirements.

6.How does Aetrix verify that SIC401ACD-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIC401ACD-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIC401ACD-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIC401ACD-T1-GE3?

All SIC401ACD-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIC401ACD-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIC401ACD-T1-GE3 part is unused and in its original packaging.

Return procedure for SIC401ACD-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIC401ACD-T1-GE3 Tags

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