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Vishay Siliconix SIC401BCD-T1-GE3
- Part No.:
- SIC401BCD-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 32-PowerVFQFN
- Datasheet:
-
SIC401BCD-T1-GE3.pdf
- Description:
- IC REG DL BUCK/LNR SYNC MLP55-32
- Quantity:
- Payment:
- Shipping:
Inventory:3,171
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Product details
Overview
SIC401BCD-T1-GE3 from Vishay Siliconix is a 15 A synchronous buck regulator with integrated power MOSFETs, bootstrap switch, and a programmable 200 mA LDO in a PowerPAK® MLP32-55G package. It delivers up to 93 % peak efficiency across 3 V–17 V input, supports 0.6 V–VIN×0.75 output, operates at 200 kHz–1 MHz, and enables all-ceramic designs for point-of-load power in servers and networking equipment.
For engineers reviewing the SIC401BCD-T1-GE3 datasheet, SIC401BCD-T1-GE3 pinout, SIC401BCD-T1-GE3 application, or SIC401BCD-T1-GE3 equivalent, key selection considerations include its pseudo-fixed-frequency adaptive on-time control, independent enable logic for switcher and LDO, selectable power-save mode (SiC401B), programmable UVLO via ENL, and integrated valley current limit protection.
Technical Context
The SIC401BCD-T1-GE3 implements pseudo-fixed-frequency adaptive on-time control using output ripple as the PWM ramp signal, eliminating error amplifier compensation components while enabling fast transient response. Its one-shot timer generates on-time proportional to VOUT and inversely proportional to VIN, ensuring stable regulation without external current-sense circuitry.
It integrates dual power paths: a 15 A synchronous buck stage with internal high- and low-side MOSFETs, and a 200 mA programmable LDO with bypass capability. The LDO can supply VDD bias or drive external loads, with switchover logic between VLDO and VOUT based on differential voltage thresholds (±130 mV).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3 V to 17 V - supports wide-input industrial and computing rails including 5 V, 12 V, and 15 V bus systems. |
| Output Current | 15 A continuous - sufficient for high-current CPU/GPU core supplies or multi-rail POL applications. |
| Switching Frequency | 200 kHz to 1 MHz - adjustable via tON resistor; higher frequencies reduce inductor size but increase switching loss. |
| Peak Efficiency | 93 % - achieved at mid-load with ceramic output capacitors, enabling thermally constrained designs. |
| LDO Output | Programmable 200 mA - configurable via FBL resistor divider; supports 3 V–5.5 V bias or external load driving. |
| Control Method | Pseudo-fixed-frequency adaptive on-time - eliminates loop compensation, reduces component count, and improves load transient response. |
| Package | PowerPAK MLP32-55G (5 mm × 5 mm) - thermally enhanced QFN with exposed thermal pad and 32-pin layout for high-current routing. |
Pinout & Package
Package: PowerPAK® MLP32-55G - 5 mm × 5 mm, 32-pin, thermally optimized QFN with exposed thermal pad (PAD 1, PAD 2, PAD 3). Pin 1 marked with dot; top-side marking reads "SiC401B".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB (Pin 1) | Feedback input | Connects to resistor divider from VOUT to AGND; sets output voltage with ±1 % reference accuracy. |
| VOUT (Pin 2) | Voltage sense / LDO switchover input | Senses switcher output; used by internal MUX to select between VLDO and VOUT for VDD bias. |
| VDD (Pin 3) | Bias supply input/output | Accepts external 3–5.5 V supply or outputs LDO-regulated voltage; powers internal circuitry. |
| AGND (Pins 4, 30, PAD 1) | Analog ground | Reference for FB, FBL, SS, ILIM; must be separated from PGND to minimize noise coupling. |
| FBL (Pin 5) | LDO feedback input | Resistor divider from VDD to AGND programs LDO output voltage (e.g., 3.3 V or 5 V). |
| VIN (Pins 6, 9–11, PAD 2) | Main input supply | High-current path for 3–17 V input; multiple pins reduce IR drop and improve thermal performance. |
| SS (Pin 7) | Soft-start timing | Capacitor-connected node; internal 3 μA current source ramps voltage to control startup slew rate. |
| BST (Pin 8) | Bootstrap supply | Connects 100 nF capacitor to LX; provides floating gate drive voltage for high-side MOSFET. |
| LX (Pins 13, 23–25, PAD 3) | Switching node | Phase node connecting internal high/low-side MOSFETs; requires low-inductance layout to minimize ringing. |
| PGND (Pins 15–22) | Power ground | High-current return path for MOSFETs and inductor; tied to thermal pad for heat dissipation. |
| PGOOD (Pin 26) | Power-good indicator | Open-drain output asserting high after VOUT reaches ±10 % regulation; requires external pull-up. |
| ILIM (Pin 27) | Current limit programming | Resistor from ILIM to LXS sets valley current limit threshold (e.g., 15 A nominal with 3.945 kΩ). |
| EN/PSV (Pin 29) | Enable / power-save control | Tri-state logic: GND = disable, VDD = power-save mode, float = forced continuous conduction mode (FCCM). |
| tON (Pin 31) | On-time programming | Resistor to AGND sets operating frequency; e.g., 133 kΩ yields ~300 kHz at VIN=12 V, VOUT=5 V. |
| ENL (Pin 32) | LDO enable / VIN UVLO programming | Drives LDO on/off; also accepts resistor divider from VIN to set programmable input UVLO threshold (2.4–2.95 V). |
Key Features
| Feature | Design Value |
|---|---|
| Integrated power train | High- and low-side MOSFETs + bootstrap switch in single MLP32-55G package - eliminates discrete gate driver and external bootstrap diode. |
| Programmable LDO | 200 mA output with bypass logic - supplies VDD bias or drives external circuits; avoids need for separate LDO IC. |
| Adaptive on-time control | No external compensation required - simplifies design, reduces BOM, and achieves <250 ns off-time for fast light-load response. |
| Independent enable logic | Separate EN/PSV (buck) and ENL (LDO) pins - enables flexible power sequencing and fault isolation in multi-rail systems. |
| Valley current limiting | Temperature-compensated ILIM pin - provides accurate overcurrent protection across -40 °C to +85 °C ambient. |
| Ultra-low quiescent current | 130 μA standby (ENL=VDD, EN/PSV=0 V) - extends battery life in always-on subsystems. |
Applications
| Server Point-of-Load Supply | Networking ASIC Core Power |
|---|---|
Use Scenario: Delivering 1.5 V @ 12 A to CPU/GPU cores in 1U rack servers with strict thermal envelope. IC Role / Device Role / Timing Role: Primary synchronous buck regulator with integrated MOSFETs and adaptive on-time control for rapid load transients. Use Value: 93 % peak efficiency and all-ceramic support reduce heatsink size and eliminate electrolytic capacitor aging concerns. | Use Scenario: Powering 12 nm ASICs in 100 GbE switches requiring tight output regulation (<±1 %) and sub-10 μs transient recovery. IC Role / Device Role / Timing Role: High-current POL regulator with programmable soft-start and PGOOD signaling for system-level power sequencing. Use Value: Programmable tON and ILIM allow tuning for optimal trade-off between efficiency and transient response under varying load profiles. |
| Desktop Motherboard VRM | Industrial Embedded Controller |
Use Scenario: Dual-phase implementation (two SIC401BCD-T1-GE3) supplying 1.05 V @ 20 A to desktop CPU with dynamic voltage scaling. IC Role / Device Role / Timing Role: Standalone buck controller with independent enable and LDO bypass for flexible VDD sourcing. Use Value: Selectable power-save mode (SiC401B) maintains >85 % efficiency at 100 mA load, reducing idle power in sleep states. | Use Scenario: Providing 3.3 V @ 5 A and 5 V @ 200 mA from 12 V rail in fanless industrial PLC with -40 °C to +85 °C operation. IC Role / Device Role / Timing Role: Dual-output power solution: buck stage for main logic, integrated LDO for I/O or sensor bias. Use Value: Single-chip integration reduces PCB area by >40 % vs. discrete buck + LDO, while maintaining full fault protection (OVP/UVP/OTP). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP2451DT-LF-Z | 3 A max output, no integrated LDO, fixed 2.2 MHz frequency, smaller TSOT23-8 package | Suitable only for low-current auxiliary rails; lacks programmability and thermal robustness for 15 A loads | Select when board space is critical and load < 3 A; not a functional replacement for SIC401BCD-T1-GE3's 15 A capability. |
| TPS546B24RVFT | 15 A, PMBus-enabled, 4–18 V input, integrated telemetry, larger 32-pin VQFN (6 mm × 6 mm) | Supports digital monitoring and dynamic voltage scaling; requires PMBus interface and firmware integration | Choose for systems needing real-time current/voltage reporting and remote configuration; adds complexity but enables advanced power management. |
Compared with MP2451DT-LF-Z and TPS546B24RVFT, the SIC401BCD-T1-GE3 uniquely combines 15 A analog buck regulation, integrated 200 mA LDO, and adaptive on-time control in a compact 5 mm × 5 mm footprint-offering the simplest BOM and fastest transient response without digital overhead.
Availability
SIC401BCD-T1-GE3 is available at Aetrix Electronics and suitable for server power delivery, networking ASIC supplies, and industrial embedded controllers requiring stable component supply, long-term lifecycle support, and consistent parametric performance across temperature.
Supply support for SIC401BCD-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-efficiency power management solutions with emphasis on thermal performance and reliability.
The SiC401 family targets high-density point-of-load conversion in computing and communications infrastructure, delivering integrated buck+LDO functionality to simplify multi-rail power architecture design.
FAQ
What is the maximum output current rating of the SIC401BCD-T1-GE3?
The SIC401BCD-T1-GE3 is rated for 15 A continuous output current under recommended operating conditions (TA = –40 °C to +85 °C, VIN = 12 V, proper PCB thermal layout). Peak current capability depends on thermal management; the device includes valley current limit protection set via the ILIM pin and calibrated to 15 A nominal with a 3.945 kΩ resistor.
How does the SIC401BCD-T1-GE3 implement power-save mode?
The SIC401BCD-T1-GE3 implements selectable power-save mode (PSM) via the EN/PSV pin: applying VDD to EN/PSV enables discontinuous conduction mode at light loads to maintain high efficiency. Unlike SiC401A's ultra-sonic PSM, SiC401BCD-T1-GE3 uses standard PSM with variable frequency below ~200 kHz, reducing switching losses without audible noise.
Can the internal LDO in the SIC401BCD-T1-GE3 be disabled and bypassed?
Yes, the internal LDO in the SIC401BCD-T1-GE3 can be fully disabled and bypassed. Driving ENL low disables the LDO, and connecting an external 3–5.5 V supply directly to the VDD pin bypasses the LDO entirely. This configuration improves overall efficiency when an external bias rail is available and avoids LDO dropout voltage penalties.
What package type and thermal characteristics does the SIC401BCD-T1-GE3 use?
The SIC401BCD-T1-GE3 uses the PowerPAK® MLP32-55G package: a 5 mm × 5 mm, 32-pin QFN with three exposed thermal pads (PAD 1, PAD 2, PAD 3) connected to AGND, VIN, and LX respectively. Its junction-to-ambient thermal resistance is 50 °C/W, supporting 3.4 W max power dissipation at 25 °C ambient - enabling 15 A operation with appropriate copper pour and airflow.
Does the SIC401BCD-T1-GE3 require external compensation components?
No, the SIC401BCD-T1-GE3 does not require external compensation components. Its pseudo-fixed-frequency adaptive on-time control architecture eliminates the need for error amplifier compensation networks. Stability is inherently maintained through ripple-based timing, reducing design complexity and component count while improving transient response.
SIC401BCD-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- microBUCK®
- Package/Case:
- 32-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Topology:
- Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
- Number of Outputs:
- 2
- Frequency - Switching:
- 200kHz ~ 1MHz
- Voltage/Current - Output 1:
- 0.6V ~ 5.5V, 15A
- Voltage/Current - Output 2:
- Adj to 0.75V, 200mA
- Voltage/Current - Output 3:
- -
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 3V ~ 17V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® MLP55-32
SIC401BCD-T1-GE3 FAQ
1.How can I place an order for SIC401BCD-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIC401BCD-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIC401BCD-T1-GE3 reliable?
The price and inventory of SIC401BCD-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIC401BCD-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SIC401BCD-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIC401BCD-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIC401BCD-T1-GE3?
SIC401BCD-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIC401BCD-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIC401BCD-T1-GE3?
For technical support, including SIC401BCD-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIC401BCD-T1-GE3 requirements.
6.How does Aetrix verify that SIC401BCD-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SIC401BCD-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIC401BCD-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SIC401BCD-T1-GE3?
All SIC401BCD-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIC401BCD-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIC401BCD-T1-GE3 part is unused and in its original packaging.
Return procedure for SIC401BCD-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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