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Vishay Siliconix SIC403ACD-T1-GE3

Part No.:
SIC403ACD-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
Voltage Regulators - Linear + Switching
Package:
32-PowerVFQFN
Datasheet:
AetrixSIC403ACD-T1-GE3.pdf
Description:
IC REG DL BUCK/LNR SYNC MLP55-32
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,461

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Product details

Overview

SIC403ACD-T1-GE3 from Vishay Siliconix is a 6 A synchronous buck regulator with integrated power MOSFETs, bootstrap switch, and a programmable 200 mA LDO in a PowerPAK® MLP32-55G package. It delivers up to 93 % peak efficiency at 1.2 V output, supports 3–28 V input, operates up to 1 MHz, and targets point-of-load regulation in notebook and server power rails.

For engineers reviewing the SIC403ACD-T1-GE3 datasheet, SIC403ACD-T1-GE3 pinout, SIC403ACD-T1-GE3 application, or SIC403ACD-T1-GE3 equivalent, key selection criteria include its adaptive on-time control architecture, independent enable for switcher/LDO, programmable UVLO via ENL, soft-start timing via SS pin, and ultra-sonic power-save mode exclusive to the SiC403A variant.

Technical Context

The SIC403ACD-T1-GE3 implements pseudo-fixed-frequency adaptive on-time control using output ripple as the PWM ramp signal, eliminating external compensation components and enabling fast transient response. Its one-shot timer generates on-time proportional to VOUT/VIN, with frequency set by an external resistor on the tON pin (200 kHz–1 MHz range).

It integrates dual power paths: a 6 A synchronous buck stage with valley current limiting and temperature-compensated ILIM pin, plus a 200 mA LDO with bypass logic, switch-over threshold of ±130 mV between VDD and VOUT, and independent ENL control. The device provides cycle-by-cycle current limit, soft shutdown, and power-good monitoring with 12 ms startup delay.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 3 V to 28 V - supports wide-input industrial and computing rails without pre-regulation.
Output Current 6 A continuous - sufficient for CPU core or GPU memory rail point-of-load conversion.
Switching Frequency 200 kHz to 1 MHz - adjustable via external RtON; higher frequencies reduce inductor size but increase switching loss.
Peak Efficiency 93 % at 1.2 V/6 A - achieved with all-ceramic output capacitors and integrated low-RDS(on) MOSFETs.
LDO Output Programmable 200 mA - supplies internal gate drive (5 V typical) or bypassed for external bias to maximize efficiency.
Control Architecture Adaptive on-time - enables fast load transient response (<10 µs) without error amplifier or loop compensation.
Reference Accuracy ±1 % internal 600 mV reference - ensures tight output voltage regulation across line/load/temperature.

Pinout & Package

Package: PowerPAK® MLP32-55G (5 mm × 5 mm, 32-pin, exposed thermal pad).

Pin/Terminal Circuit Role Design Meaning
1 (FB) Feedback input Connects to resistor divider from VOUT to AGND; regulates output using internal 600 mV reference.
2 (VOUT) Voltage sense & LDO switchover input Senses switcher output; determines internal LDO-to-VOUT switchover based on ±130 mV differential.
3 (VDD) Bias supply input/output Accepts external 3–5.5 V bias or outputs LDO-regulated voltage; powers internal circuitry.
4, 30, PAD 1 (AGND) Analog ground Reference for FB, FBL, SS, ILIM; must be separated from PGND to minimize noise coupling.
5 (FBL) LDO feedback input Connects to resistor divider from VDD to AGND to program LDO output voltage.
6, 9–11, PAD 2 (VIN) Main input supply 3–28 V input to high-side MOSFET and bootstrap circuit; multiple pins reduce IR drop and improve thermal path.
7 (SS) Soft-start timing Internal 3 µA current source charges external capacitor; sets output voltage ramp time.
8 (BST) Bootstrap supply Connects 100 nF+ capacitor to LX; generates floating gate drive voltage for high-side MOSFET.
13 (LXBST) LX boost node Internal connection to BST capacitor; improves bootstrap charge retention during high-duty-cycle operation.
23–25, PAD 3 (LX) Switching node Phase node connecting high/low MOSFETs and inductor; requires low-inductance layout to minimize ringing.
15–22 (PGND) Power ground High-current return path for MOSFETs and inductor; tied to thermal pad for thermal dissipation.
26 (PGOOD) Open-drain power-good indicator Asserts high-impedance when VOUT is within ±10 % of target; requires external pull-up for logic-level signaling.
27 (ILIM) Current limit programming Resistor from ILIM to LXS sets valley current limit threshold (4.8–7.2 A range at 5 V VDD).
28 (LXS) LX sense Connects to ILIM resistor; used for accurate valley current sensing during low-side conduction.
29 (EN/PSV) Enable & power-save control Ground = disable; float = forced continuous mode; VDD = ultra-sonic power-save (SiC403A only).
31 (tON) On-time programming Resistor to AGND sets switching frequency; accuracy degrades if VIN > (VDD − 1.6 V) × 10.
32 (ENL) LDO enable Ground = disable LDO; logic high = enable; resistor divider from VIN to AGND programs VIN UVLO threshold.

Key Features

Feature Design Value
Ultra-sonic power-save mode SiC403A-exclusive light-load operation ≥25 kHz - avoids audible noise while maintaining >85 % efficiency at 10 mA.
Independent switcher/LDO enable Separate EN/PSV and ENL pins - allows sequenced power-up, LDO bypass for external bias, or LDO-only operation.
Programmable VIN UVLO Set via resistor divider on ENL pin (2.4–2.95 V rising threshold) - enables custom brown-in/out behavior for system-level reliability.
Temperature-compensated current limit Valley current limit adjusts with junction temperature - maintains consistent overcurrent protection across -40 °C to +125 °C.
All-ceramic solution support No ESR dependency in control loop - eliminates need for electrolytic or tantalum output capacitors, reducing footprint and improving lifetime.
Soft shutdown Internal 15 Ω discharge path from VOUT to PGND when EN/PSV = GND - prevents uncontrolled output collapse during disable.

Applications

Notebook Core Voltage Rail Server Memory Subsystem

Use Scenario: Regulating 1.2 V core voltage for Intel/AMD mobile CPUs under dynamic load from 0 A to 6 A.

IC Role / Device Role / Timing Role: Primary synchronous buck converter with adaptive on-time control for sub-10 µs transient response.

Use Value: Maintains <±1 % output regulation during CPU burst loads using only ceramic output caps and no external compensation.

Use Scenario: Supplying DDR4/DDR5 VDDQ (1.2 V or 1.1 V) to memory modules in 1U servers with strict ripple limits.

IC Role / Device Role / Timing Role: Point-of-load regulator with PGOOD monitoring and programmable soft-start for synchronized rail sequencing.

Use Value: Delivers 93 % efficiency at full load and >88 % at 100 mA, reducing board-level heat density in thermally constrained chassis.

Networking ASIC Power Digital TV SoC Core Supply

Use Scenario: Powering 1.0 V–1.8 V cores of packet processing ASICs in switches/routers with rapid load steps.

IC Role / Device Role / Timing Role: High-efficiency buck regulator with valley current limit and zero-cross detection for robust short-circuit protection.

Use Value: Survives repeated output shorts during firmware updates without latch-off, thanks to cycle-by-cycle current limiting and soft shutdown.

Use Scenario: Generating 1.1 V core voltage for broadcast SoCs in digital HDTV platforms requiring low EMI and silent operation.

IC Role / Device Role / Timing Role: Ultra-sonic power-save enabled buck regulator (SiC403A) operating above 25 kHz to eliminate coil whine.

Use Value: Eliminates audible noise in consumer living environments while sustaining >85 % efficiency at standby currents below 50 mA.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
MP2315DJ-LF-Z 4 A rated, fixed 500 kHz frequency, no integrated LDO, smaller QFN-10 package Lacks programmable LDO and ultra-sonic PSM; suited for space-constrained, lower-current rails Select when LDO integration is unnecessary and PCB area is critical; verify thermal performance at 6 A.
TPS546B24RVFT 6 A, PMBus-enabled, 400 kHz–2 MHz programmable frequency, external MOSFETs, larger 28-pin VQFN Requires external power stage and complex digital configuration; adds telemetry and margining capability Choose when digital monitoring, remote fault logging, or multi-rail coordination is required over analog simplicity.

Compared with MP2315DJ-LF-Z and TPS546B24RVFT, the SIC403ACD-T1-GE3 uniquely combines 6 A capability, integrated LDO, ultra-sonic power-save, and adaptive on-time control in a compact 5×5 mm MLP package-making it optimal for cost-sensitive, noise-sensitive, and space-constrained computing power rails where analog simplicity and fast transient response are prioritized.

Availability

SIC403ACD-T1-GE3 is available at Aetrix Electronics and suitable for notebook, server, and networking equipment requiring stable component supply, high-efficiency point-of-load conversion, and ultra-sonic light-load operation.

Supply support for SIC403ACD-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix designs high-performance power semiconductors and integrated ICs focused on efficiency, miniaturization, and reliability for computing, industrial, and automotive systems.

The SiC403A product line delivers highly integrated microBUCK® regulators targeting space-constrained, high-efficiency DC/DC conversion in portable and infrastructure computing platforms.

FAQ

What is the maximum supported switching frequency for SIC403ACD-T1-GE3?

The SIC403ACD-T1-GE3 supports a programmable switching frequency range of 200 kHz to 1 MHz, set by an external resistor connected between the tON pin and AGND. At 1 MHz, the device maintains stable operation with all-ceramic output capacitors and achieves optimal trade-offs between inductor size and switching losses in high-density layouts.

Does SIC403ACD-T1-GE3 support ultra-sonic power-save mode?

Yes, the SIC403ACD-T1-GE3 (SiC403A variant) supports ultra-sonic power-save mode, which forces minimum switching frequency to ~25 kHz to eliminate audible coil whine. This mode activates automatically when EN/PSV is pulled high and load drops below threshold, distinguishing it from the SiC403B's standard power-save implementation.

How is the LDO output voltage programmed on SIC403ACD-T1-GE3?

The LDO output voltage on SIC403ACD-T1-GE3 is programmed using an external resistor divider connected to the FBL pin. One end connects to VDD (LDO output), the other to AGND, with the midpoint feeding FBL. The LDO regulates to maintain 0.6 V at FBL, allowing precise setting of VDD from 1.8 V to 5.5 V depending on resistor values.

What is the purpose of the LXBST pin on SIC403ACD-T1-GE3?

The LXBST pin on SIC403ACD-T1-GE3 is an internal connection to the BST capacitor node that enhances bootstrap charge retention during high-duty-cycle operation (e.g., high VIN-to-VOUT ratios). It reduces gate drive droop and improves high-side MOSFET turn-on robustness without requiring additional external components.

Can SIC403ACD-T1-GE3 operate without the internal LDO enabled?

Yes, SIC403ACD-T1-GE3 can operate with the internal LDO disabled by grounding the ENL pin. In this configuration, an external 3–5.5 V bias must be supplied to the VDD pin to power the IC. Disabling the LDO eliminates its dropout loss and improves overall system efficiency when a clean external bias is available.

SIC403ACD-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
microBUCK®
Package/Case:
32-PowerVFQFN
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Topology:
Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
Number of Outputs:
2
Frequency - Switching:
200kHz ~ 1MHz
Voltage/Current - Output 1:
0.6V ~ 5.5V, 6A
Voltage/Current - Output 2:
Adj to 0.75V, 200mA
Voltage/Current - Output 3:
-
w/LED Driver:
No
w/Supervisor:
No
w/Sequencer:
No
Voltage - Supply:
3V ~ 28V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® MLP55-32

SIC403ACD-T1-GE3 FAQ

1.How can I place an order for SIC403ACD-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIC403ACD-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIC403ACD-T1-GE3 reliable?

The price and inventory of SIC403ACD-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIC403ACD-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIC403ACD-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIC403ACD-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIC403ACD-T1-GE3?

SIC403ACD-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIC403ACD-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIC403ACD-T1-GE3?

For technical support, including SIC403ACD-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIC403ACD-T1-GE3 requirements.

6.How does Aetrix verify that SIC403ACD-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIC403ACD-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIC403ACD-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIC403ACD-T1-GE3?

All SIC403ACD-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIC403ACD-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIC403ACD-T1-GE3 part is unused and in its original packaging.

Return procedure for SIC403ACD-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIC403ACD-T1-GE3 Tags

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