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Vishay Siliconix SIC414CD-T1-GE3
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- Part No.:
- SIC414CD-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 28-WFQFN Exposed Pad
- Datasheet:
-
SIC414CD-T1-GE3.pdf
- Description:
- IC REG DL BUCK/LNR SYNC 28MLPQ
- Quantity:
- Payment:
- Shipping:
Inventory:3,287
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Product details
Overview
SIC414CD-T1-GE3 from Vishay Siliconix is a 6 A synchronous buck regulator with integrated power MOSFETs, bootstrap switch, and a 5 V / 200 mA LDO in a PowerPAK® MLP28-44GW package. It operates from 3 V to 28 V input, delivers 0.75 V–5.5 V output, supports 200 kHz–1 MHz switching, and achieves >95 % peak efficiency-used for point-of-load regulation in notebook and server CPU core supplies.
For engineers reviewing the SIC414CD-T1-GE3 datasheet, SIC414CD-T1-GE3 pinout, SIC414CD-T1-GE3 application, or SIC414CD-T1-GE3 equivalent, this page provides verified functional identity, validated pin roles, confirmed LDO bypass logic, ultrasonic power-save mode behavior, and real-world load-transient performance data per Vishay S20-0483-Rev. D.
Technical Context
The SIC414CD-T1-GE3 implements pseudo-fixed-frequency adaptive on-time control using output ripple as the PWM ramp signal-eliminating need for external current-sense resistors or error amplifier compensation. Its tON pin sets on-time via resistor-to-ground, enabling precise frequency programming from 200 kHz to 1 MHz.
It integrates dual enable logic: EN/PSV controls buck operation (ultrasonic power-save when tied to V5V) and ENL independently enables the 5 V LDO while also serving as VIN UVLO sense input. The VLDO/VOUT switch-over threshold is ±140 mV, and valley current limit is programmable from 3 A to 5 A via ILIM–LXS resistor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input voltage range | 3 V to 28 V - supports wide-input industrial and computing rails including 12 V and 24 V systems. |
| Output voltage range | 0.75 V to 5.5 V - digitally adjustable via FB resistor divider; regulates valley of ripple, not DC average. |
| Continuous output current | 6 A - sustained delivery without thermal derating at +85 °C ambient with proper PCB layout. |
| Switching frequency | 200 kHz to 1 MHz - programmable via tON pin resistor; enables optimization of size vs. EMI vs. light-load efficiency. |
| LDO output | 5 V ±2 % at 200 mA - internally regulated; bypassable with external 5 V supply to improve system efficiency. |
| Peak efficiency | 95 % - achieved at mid-load (e.g., 3 A) with 12 VIN/1 VOUT, 500 kHz, ceramic output capacitors. |
| UVLO threshold | 2.6 V (typ.) rising edge at ENL - programmable via resistor divider from VIN to ENL to AGND. |
| Power good accuracy | ±10 % / ±20 % window around VFB = 750 mV - ensures reliable rail sequencing in multi-rail systems. |
Pinout & Package
Package: PowerPAK® MLP28-44GW (4 mm × 4 mm, 28-pin, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB (Pin 1) | Feedback input | Connects to resistor divider from VOUT to AGND; references internal 750 mV bandgap to regulate output valley voltage. |
| V5V (Pin 2) | Bias supply input | Accepts external 3.3 V or 5 V; powers analog circuits and gate drivers; used as reference for EN/PSV logic thresholds. |
| AGND (Pins 3, 26, PAD1) | Analog ground | Reference for FB, tON, ILIM, and internal comparators; must be separated from PGND for noise immunity. |
| VOUT (Pin 4) | Switcher output sense | Senses output voltage and enables internal VLDO-to-VOUT switchover logic based on differential voltage. |
| VIN (Pins 5, 8–11, PAD2) | Main input supply | Distributed high-current input path; multiple pins reduce IR drop and improve thermal spreading. |
| VLDO (Pin 6) | LDO output | 5 V / 200 mA regulated output; can power gate drivers or external loads; bypassable via external 5 V on V5V. |
| BST (Pin 7) | Bootstrap supply | Connects to BST capacitor (BST–LXBST); generates floating supply for high-side MOSFET gate drive. |
| LXBST (Pin 12) | Bootstrap return | Return node for BST capacitor; tied directly to LX during low-side conduction for charge replenishment. |
| LX (Pins 15, 20, 21, PAD3) | Switching node | Phase node connecting internal high- and low-side FETs; requires low-inductance layout to minimize ringing. |
| PGND (Pins 13, 14, 16–19) | Power ground | High-current return path for VIN, LX, and LDO; multiple pins reduce ground bounce and improve thermal dissipation. |
| PGOOD (Pin 22) | Open-drain status indicator | Asserts high-impedance when VFB is within ±10 % / ±20 % of 750 mV; requires external pull-up for logic-level signaling. |
| ILIM (Pin 23) | Current limit set | Connects to RILIM–LXS network; programs valley current limit between 3 A and 5 A with temperature compensation. |
| LXS (Pin 24) | Current sense return | Low-side FET source connection point for valley current sensing; referenced to ILIM comparator offset. |
| EN/PSV (Pin 25) | Buck enable / power-save select | Ground disables buck; float enables forced continuous mode; tied to V5V enables ultrasonic power-save (SIC414 only). |
| tON (Pin 27) | On-time programming | Resistor-to-AGND sets tON duration; determines operating frequency per fSW ≈ VOUT/(tON × VIN). |
| ENL (Pin 28) | LDO enable / VIN UVLO sense | Ground disables LDO; logic-high enables LDO and VIN UVLO monitoring; resistor divider from VIN sets UVLO threshold. |
Key Features
| Feature | Design Value |
|---|---|
| Ultrasonic power-save mode | Enables SiC414-specific 25 kHz minimum switching frequency at light loads-eliminates audible noise in consumer audio systems. |
| Integrated 5 V / 200 mA LDO with bypass logic | Reduces BOM count by supplying gate drive bias; bypassable with external 5 V to avoid LDO dropout losses under high current. |
| Pseudo-fixed-frequency adaptive on-time control | Delivers <10 µs transient response without error amplifier or compensation network-enables smaller output capacitance. |
| Programmable VIN UVLO via ENL pin | Allows custom brown-out protection using resistor divider; rising-edge threshold is 2.6 V (typ.), hysteresis is 0.2 V. |
| Smart power-save protection | Disables power-save and forces low-side conduction if VFB rises >10 % above 750 mV-prevents OVP shutdown due to leakage currents. |
| Temperature-compensated valley current limit | Maintains consistent 3–5 A over-temperature trip across -40 °C to +85 °C ambient-improves reliability in thermally stressed environments. |
Applications
| Server CPU Core Supply | Notebook GPU Rail |
|---|---|
|
Use Scenario: Regulating 0.8 V–1.2 V at up to 6 A for Intel/AMD server processors under dynamic load steps. IC Role / Device Role / Timing Role: Primary synchronous buck controller with integrated FETs and LDO-bypassed gate drive. Use Value: Achieves >93 % efficiency at 4 A with 12 VIN/1 VOUT, minimizing thermal load in dense 1U chassis. |
Use Scenario: Delivering clean, fast-response 1.05 V power to discrete GPU in thin-and-light notebooks. IC Role / Device Role / Timing Role: Point-of-load regulator with ultrasonic power-save to eliminate coil whine during video playback. Use Value: Maintains 25 kHz minimum switching frequency under light load-meets OEM acoustic noise specifications. |
| Networking ASIC Bias | Industrial FPGA Core Rail |
|
Use Scenario: Powering 1.8 V I/O or 0.95 V core rails for 10G/25G Ethernet PHYs and packet processors. IC Role / Device Role / Timing Role: High-efficiency buck converter with programmable frequency to avoid EMI bands near 2.4 GHz radios. Use Value: 200 kHz–1 MHz tuning allows placement of fundamental and harmonics outside critical RF bands. |
Use Scenario: Providing stable 1.0 V core voltage to Xilinx Artix-7 or Intel Cyclone V FPGA in factory automation controllers. IC Role / Device Role / Timing Role: Robust buck regulator with UVLO programming, PGOOD sequencing, and -40 °C to +85 °C operation. Use Value: Guaranteed start-up at 3 VIN and reliable shutdown below 2.4 V prevents brown-out glitches in unregulated 24 V field wiring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SiC424CD-T1-GE3 | Same package and pinout; supports standard power-save (no minimum frequency), not ultrasonic mode. | Better suited for battery-powered devices where lowest quiescent current matters more than acoustic noise. | Select SiC424CD-T1-GE3 if ultrasonic operation is unnecessary and light-load efficiency is prioritized over noise control. |
| MP2451DT-LF-Z | 3 A rated, 2 MHz max frequency, no integrated LDO, requires external bootstrap diode and gate driver components. | Targeted at cost-sensitive, space-constrained applications where 6 A capability and LDO integration are not required. | Choose MP2451DT-LF-Z only for sub-3 A loads and designs accepting higher component count and reduced integration. |
Compared with SiC424CD-T1-GE3, SIC414CD-T1-GE3 adds ultrasonic power-save for silent operation but trades off slightly higher light-load IQ; versus MP2451DT-LF-Z, it delivers double current, eliminates external bootstrap components, and integrates an LDO-reducing total solution size by ~35 %.
Availability
SIC414CD-T1-GE3 is available at Aetrix Electronics and suitable for server motherboard development, notebook GPU power design, and industrial FPGA core supply requiring stable component supply, full production traceability, and long-term lifecycle support.
Supply support for SIC414CD-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and power ICs, specializing in high-efficiency, high-reliability power management solutions for computing, industrial, and communications markets.
The SiC414 belongs to Vishay's microBUCK® family of integrated buck regulators-designed specifically for compact, high-current point-of-load applications demanding fast transient response, ultralow noise, and seamless integration with modern processor power requirements.
FAQ
What is the key functional difference between SIC414CD-T1-GE3 and SiC424CD-T1-GE3?
The SIC414CD-T1-GE3 implements ultrasonic power-save mode with a guaranteed minimum 25 kHz switching frequency at light loads to prevent audible coil whine, whereas SiC424CD-T1-GE3 uses standard power-save with no minimum frequency-prioritizing lowest possible quiescent current. Both share identical pinout, package, and LDO functionality, but SIC414CD-T1-GE3 is selected specifically for noise-sensitive computing applications like notebooks and digital HDTV.
How does the SIC414CD-T1-GE3 achieve fast transient response without an error amplifier?
The SIC414CD-T1-GE3 uses pseudo-fixed-frequency adaptive on-time control, where output ripple voltage serves as the PWM ramp signal. This architecture eliminates the need for an error amplifier and external compensation network, reducing loop delay to <10 µs. As a result, the SIC414CD-T1-GE3 maintains tight output regulation during rapid load steps-such as CPU burst activity-while enabling smaller output capacitors and simpler PCB layout.
Can the internal 5 V LDO in SIC414CD-T1-GE3 be disabled independently of the buck regulator?
Yes-the ENL pin provides independent control of the internal 5 V LDO. Driving ENL to AGND disables the LDO while leaving the buck regulator fully operational (if EN/PSV is active). Conversely, grounding EN/PSV disables only the buck stage while allowing the LDO to remain enabled-enabling flexible power sequencing and partial-system standby modes in complex multi-rail designs using SIC414CD-T1-GE3.
What is the purpose of the SmartDrive™ feature in SIC414CD-T1-GE3?
SmartDrive™ in the SIC414CD-T1-GE3 controls the turn-on slew rate of the high-side MOSFET to softly commutate the low-side body diode-reducing switching losses and electromagnetic interference. During each DH pulse, the gate driver initially applies lower drive strength until the LX node rises 0.5 V above PGND, then switches to full drive. This minimizes voltage spikes and ringing on the LX node, improving reliability and easing EMI filter design in systems using SIC414CD-T1-GE3.
How is the switching frequency programmed on SIC414CD-T1-GE3?
The switching frequency of SIC414CD-T1-GE3 is set via an external resistor (RtON) connected between the tON pin (Pin 27) and AGND. The relationship is approximated by fSW ≈ VOUT / (tON × VIN), where tON is determined by RtON. For example, a 133 kΩ resistor yields ~300 kHz at VIN = 15 V and VOUT = 3 V. The datasheet provides exact equations accounting for V5V and VIN dependencies to ensure accurate frequency setting across input and output conditions.
SIC414CD-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- microBUCK®
- Package/Case:
- 28-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Topology:
- Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
- Number of Outputs:
- 2
- Frequency - Switching:
- 200kHz ~ 1MHz
- Voltage/Current - Output 1:
- 0.75V ~ 5.5V, 6A
- Voltage/Current - Output 2:
- 5V, 200mA
- Voltage/Current - Output 3:
- -
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 3V ~ 28V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-MLPQ (4x4)
SIC414CD-T1-GE3 FAQ
1.How can I place an order for SIC414CD-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIC414CD-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIC414CD-T1-GE3 reliable?
The price and inventory of SIC414CD-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIC414CD-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SIC414CD-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIC414CD-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIC414CD-T1-GE3?
SIC414CD-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIC414CD-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIC414CD-T1-GE3?
For technical support, including SIC414CD-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIC414CD-T1-GE3 requirements.
6.How does Aetrix verify that SIC414CD-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SIC414CD-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIC414CD-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SIC414CD-T1-GE3?
All SIC414CD-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIC414CD-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIC414CD-T1-GE3 part is unused and in its original packaging.
Return procedure for SIC414CD-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIC414CD-T1-GE3 Tags
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