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Vishay Siliconix SIP32467DB-T2-GE1
- Part No.:
- SIP32467DB-T2-GE1
- Manufacturer:
- Vishay Siliconix
- Package:
- 4-UFBGA, WLCSP
- Datasheet:
-
SIP32467DB-T2-GE1.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:1 4WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:4,448
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Product details
Overview
SiP32467DB-T2-GE1 from Vishay Siliconix is a slew-rate-controlled, logic-low-enabled high-side load switch operating from 1.2 V to 5.5 V input, featuring 54 mΩ typical RDS(on) at 3 V, reverse current blocking, and integrated EN pull-up resistor. It delivers controlled inrush current management in space-constrained portable power rails such as smartphone PMIC output stages.
For engineers reviewing the SiP32467DB-T2-GE1 datasheet, SiP32467DB-T2-GE1 pinout, SiP32467DB-T2-GE1 application, or SiP32467DB-T2-GE1 equivalent, this device is selected for low-voltage, low-RDS(on), bidirectional off-isolation load switching where output discharge is not required and WCSP4 footprint minimization is critical.
Technical Context
The SiP32467DB-T2-GE1 integrates a negative charge pump to maintain high gate-to-source voltage across its N-channel MOSFET, enabling stable low on-resistance down to 1.2 V input. Its slew rate control limits dV/dt at the output to suppress inrush current during turn-on.
It provides true reverse current blocking when disabled (EN = high), preventing backflow from higher-voltage outputs to lower-voltage inputs. Unlike SiP32468, it omits the integrated output discharge switch - confirming its role as a non-discharge variant within the same WCSP4 family.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 1.2 V to 5.5 V - supports single-cell Li-ion, USB, and multi-rail PMIC outputs without level shifting |
| RDS(on) (typ. @ 3 V) | 54 mΩ - enables ≤1.2 A continuous current with <65 mW conduction loss at 1 A |
| Turn-on Rise Time | 170 μs - programmable slew rate prevents system-level voltage droop and EMI spikes |
| Reverse Blocking Current | <1 nA @ VOUT = 5 V, VIN = 0 V - ensures isolation integrity in battery-backup or dual-supply domains |
| Quiescent Current | 6 μA @ VIN = 3.3 V - minimizes standby power in always-on subsystems |
| EN Input Logic | Active-low, CMOS-compatible - direct interface with 1.2 V–3.3 V microcontroller GPIOs |
| Thermal Resistance θJA | 205 °C/W - defines thermal derating curve; max 1.2 A continuous current limited by package dissipation |
Pinout & Package
SiP32467DB-T2-GE1 uses a 4-bump wafer-level chip-scale package (WCSP4), 0.76 mm × 0.76 mm, 0.4 mm pitch, with 0.208 mm bump height and 0.8 mm × 0.8 mm die outline. The package is lead-free, RoHS-compliant, and features SAC396 solder bumps.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | OUT | Switch output node - connects to downstream load capacitance and must be decoupled with ≥0.1 μF ceramic capacitor |
| A2 | IN | Power input - accepts 1.2 V–5.5 V supply; requires ≥4.7 μF local bypass for transient suppression |
| B1 | GND | Ground reference - shared return path for internal logic, charge pump, and switch body; must be low-impedance |
| B2 | EN | Enable control - active-low logic input with integrated 2.6 MΩ pull-up to IN; drives switch ON when pulled ≤0.4 V |
Key Features
| Feature | Design Value |
|---|---|
| Slew rate control | 170 μs rise time - eliminates inrush-induced rail collapse in high-capacitance loads like display bias rails |
| Reverse current blocking | <1 nA leakage - enables safe hot-swap and battery backup operation without external diodes |
| Integrated EN pull-up | 2.6 MΩ resistor to IN - removes need for external biasing and guarantees default OFF state at power-up |
| Bidirectional off isolation | Validated for VOUT > VIN conditions - supports flexible power routing in multi-source systems |
| Low-voltage operation | Functional down to 1.2 V - compatible with advanced process nodes and ultra-low-power SoCs |
Applications
| Smartphone Power Rail Switching | Portable Medical Sensor Hub |
|---|---|
Use Scenario: Isolating camera module power domain from main SoC rail during sleep mode to reduce system quiescent current. IC Role / Device Role / Timing Role: High-side load switch controlling 3.3 V camera bias rail; enabled only during image capture sequences. Use Value: 6 μA quiescent current and 1.2 V minimum operation extend battery life; 54 mΩ RDS(on) avoids voltage drop under 800 mA peak load. | Use Scenario: Enabling/disabling ECG front-end analog signal chain powered from a regulated 1.8 V LDO. IC Role / Device Role / Timing Role: Low-noise, low-leakage power gate between LDO and precision analog circuitry. Use Value: <1 nA reverse blocking current preserves sensor bias stability; WCSP4 footprint saves PCB area in compact wearable form factor. |
| Industrial Handheld Terminal | Tablet USB Peripheral Port Control |
Use Scenario: Managing power to barcode scanner interface IC during intermittent use to meet IEC 62368 standby power limits. IC Role / Device Role / Timing Role: Slew-controlled enable switch for 5 V peripheral rail, synchronized with host MCU GPIO. Use Value: 170 μs controlled rise time prevents USB enumeration failures caused by fast VBUS ramp; 5.5 V max rating covers wide-input industrial adapters. | Use Scenario: Controlling power to USB-C accessory detection circuitry to minimize parasitic drain when no device is attached. IC Role / Device Role / Timing Role: Bidirectional off-isolation switch placed between VBUS and accessory ID line conditioning circuit. Use Value: Validated bidirectional blocking allows safe VBUS presence sensing even when accessory supplies voltage first; 0.76 mm × 0.76 mm WCSP4 fits tight layout constraints near connector. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SiP32468DB-T2-GE1 | Includes integrated output discharge switch (RPD ≈ 80 Ω); otherwise identical pinout, RDS(on), and slew behavior | Required where automatic VOUT discharge is needed after disable (e.g., to reset downstream logic or meet USB detach timing) | Select SiP32468DB-T2-GE1 only if output discharge functionality is explicitly required; SiP32467DB-T2-GE1 avoids unnecessary discharge-related leakage and simplifies control timing. |
| TCK11xx series (Toshiba) | Higher RDS(on) (≥75 mΩ @ 3 V); no integrated EN pull-up; requires external biasing | Used in cost-sensitive consumer designs where slightly higher conduction loss is acceptable and board space permits external resistor | Choose TCK11xx only when BOM consolidation favors Toshiba's broader portfolio; SiP32467DB-T2-GE1 offers superior integration and lower system-level component count. |
Compared with SiP32468DB-T2-GE1, SiP32467DB-T2-GE1 removes output discharge to reduce leakage and simplify enable sequencing; versus Toshiba TCK11xx, it delivers lower RDS(on), integrated EN pull-up, and tighter thermal specs - making it optimal for space- and efficiency-critical portable designs.
Availability
SiP32467DB-T2-GE1 is available at Aetrix Electronics and suitable for smartphone power management, portable medical instrumentation, industrial handheld terminals, and tablet peripheral control requiring stable component supply and long-term lifecycle support.
Supply support for SiP32467DB-T2-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-reliability power management solutions for demanding commercial and industrial applications.
The SiP32467DB-T2-GE1 belongs to Vishay's slew-rate-controlled load switch product line, engineered specifically for low-voltage, high-density portable electronics where precise inrush control and minimal footprint are essential.
FAQ
What is the maximum continuous current rating for SiP32467DB-T2-GE1?
The SiP32467DB-T2-GE1 is rated for 1.2 A maximum continuous switch current per Absolute Maximum Ratings. This limit is thermally defined by its 205 °C/W junction-to-ambient resistance and 125 °C max junction temperature. At 70 °C ambient, worst-case RDS(on) of 135 mΩ yields ~1.99 A theoretical thermal limit, but Vishay specifies 1.2 A as the safe, derated operational ceiling to ensure long-term reliability and margin.
Does SiP32467DB-T2-GE1 include an output discharge function?
No, SiP32467DB-T2-GE1 does not include an integrated output discharge switch. That feature is exclusive to SiP32468DB-T2-GE1. The SiP32467DB-T2-GE1 relies on external circuitry or natural load discharge for VOUT settling after disable - confirmed by "No" in the RDISCHARGE column of the Ordering Information table and absence of RPD parameter in its specifications.
What is the EN pin logic polarity and voltage threshold for SiP32467DB-T2-GE1?
The EN pin of SiP32467DB-T2-GE1 is active-low: the switch turns ON when EN ≤ 0.4 V (VIL) and turns OFF when EN ≥ 1 V (VIH). An internal 2.6 MΩ pull-up resistor connects EN to IN, ensuring default OFF state at power-up unless actively driven low - eliminating need for external pull-down resistors in most implementations.
Can SiP32467DB-T2-GE1 be used in bidirectional power flow scenarios?
Yes, SiP32467DB-T2-GE1 supports bidirectional off-isolation: when disabled (EN = high), it blocks reverse current from VOUT to VIN even if VOUT exceeds VIN - verified by reverse blocking current ≤1 nA under VOUT = 5 V, VIN = 0 V. However, it is not designed for active reverse conduction; forward conduction only occurs from IN to OUT when enabled.
What package type and dimensions does SiP32467DB-T2-GE1 use?
SiP32467DB-T2-GE1 uses a WCSP4 (Wafer-Level Chip-Scale Package) with 2 × 2 bump array, 0.4 mm pitch, and overall footprint of 0.76 mm × 0.76 mm. The die size is 0.8 mm × 0.8 mm, total height is 0.5 mm, and bumps are SAC396 alloy with 208 μm height - fully compliant with IPC-7351B land pattern recommendations for 0.15–0.20 mm diameter solder pads.
SIP32467DB-T2-GE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Package/Case:
- 4-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 1.2V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 1.2A
- Rds On (Typ):
- 50mOhm
- Input Type:
- Non-Inverting
- Features:
- Slew Rate Controlled
- Fault Protection:
- Reverse Current
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.76x0.76)
SIP32467DB-T2-GE1 FAQ
1.How can I place an order for SIP32467DB-T2-GE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIP32467DB-T2-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIP32467DB-T2-GE1 reliable?
The price and inventory of SIP32467DB-T2-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIP32467DB-T2-GE1 is usually 5 days.
3.What payment methods are accepted for SIP32467DB-T2-GE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIP32467DB-T2-GE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIP32467DB-T2-GE1?
SIP32467DB-T2-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIP32467DB-T2-GE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIP32467DB-T2-GE1?
For technical support, including SIP32467DB-T2-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIP32467DB-T2-GE1 requirements.
6.How does Aetrix verify that SIP32467DB-T2-GE1 is sourced from the original manufacturer or authorized distributors?
All SIP32467DB-T2-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIP32467DB-T2-GE1 meets industry standards.
7.What is the process for return or replacement of SIP32467DB-T2-GE1?
All SIP32467DB-T2-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with SIP32467DB-T2-GE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIP32467DB-T2-GE1 part is unused and in its original packaging.
Return procedure for SIP32467DB-T2-GE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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