Infineon Technologies SLE 7736 C
- Part No.:
- SLE 7736 C
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- -
- Datasheet:
-
SLE 7736 C.pdf
- Description:
- IC EEPROM COUNTER 237BIT C-PKG
- Quantity:
- Payment:

- Shipping:

Inventory:3,317
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SLE 7736 C from Infineon Technologies is an intelligent 237-bit EEPROM counter IC for secure prepaid card applications, featuring 221-bit EEPROM + 16-bit mask-ROM, five-stage abacus counter (up to 33,352 units), high-security authentication with dual optional keys (48-bit each), and Card-Trash physical devaluation mechanism. It operates at 5 V ±10% (Class A), supports ISO/IEC 7816 synchronous transmission, and targets pay-TV and prepaid telephone cards.
For engineers reviewing the SLE 7736 C datasheet, SLE 7736 C pinout, SLE 7736 C application, or SLE 7736 C equivalent, key selection criteria include counter endurance (≥10⁵ cycles), authentication response time (≤30 ms @ 100 kHz), Card-Trash activation logic, counter tearing backup flags, and die-level contact configuration for embedding in smart card modules.
Technical Context
The SLE 7736 C implements a synchronous ISO/IEC 7816 interface with dedicated CLK, RST, I/O (open-drain), VCC, and GND contacts - no internal oscillator or voltage regulator. Its security architecture integrates shielded metal layers, EEPROM-only security cells, and logical sensory functions to resist physical/electrical side-channel attacks.
The chip executes challenge-response authentication using a secret 48-bit Authentication Key 1 (and optionally Key 2), computes up to 16-bit responses with cipher block chaining support, and certifies counter decrements. The five-stage abacus counter includes four anti-tearing backup bits and supports mask-configurable tearing protection enable/disable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 221-bit EEPROM + 16-bit mask-ROM; 104-bit user memory split across identification, counter, and data areas |
| Counter Range | Up to 33,352 count units via five-stage abacus; guaranteed 21,064 units for production testing |
| Authentication | 16-bit response calculation ≤30 ms @ 100 kHz clock; supports dual 48-bit keys and cipher block chaining |
| Endurance & Retention | ≥10⁵ write/erase cycles per bit; ≥30 years data retention at −40°C to +80°C |
| Supply & Power | 5 V ±10% (Class A); typical supply current 300 µA; internal programming voltage generation |
| ESD Protection | Typical 4000 V HBM; designed for contact-based smart card insertion/removal cycles |
| Security Logic | Card-Trash mechanism physically disables authentication and programming voltage generation upon activation |
Pinout & Package
Package: Bare die (C-type) for customer packaging into smart card modules; contact pad layout optimized for ISO/IEC 7816-2 compliant embedding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Supply voltage input | Accepts 4.5–5.5 V DC; powers all internal circuitry including EEPROM programming charge pump |
| RST | Asynchronous reset input | Active-low signal initiating cold/warm reset sequence per ISO/IEC 7816-3 timing requirements |
| CLK | Clock input | Synchronous timing reference for address increment, command decoding, and authentication execution |
| GND | Ground reference | Common return path for VCC, I/O, and internal logic; critical for ESD discharge path integrity |
| I/O | Bi-directional data line | Open-drain interface for serial command/response exchange per ISO/IEC 7816-3 T=0 protocol |
| N.C. | No connection | Unused pad; electrically isolated and not bonded during module assembly |
Key Features
| Feature | Design Value |
|---|---|
| Card-Trash mechanism | Physically disables authentication unit and internal programming voltage generator to prevent reuse after devaluation |
| Counter tearing protection | Four backup bits track abacus stage integrity during power loss; mask-configurable enable/disable |
| Dual authentication keys | 48-bit PROM-stored Authentication Key 1 (mandatory) + optional 48-bit Key 2 for layered terminal verification |
| Secure memory partitioning | Separate 40-bit counter area, 64-bit ID area (ROM/PROM), and 16-bit free-access data areas enforce access control |
| Advanced layout security | 1.2 µm IMEM CMOS process with metal shielding, secure wiring, and no backside isolation requirement |
Applications
| Prepaid Telephone Cards | Pay-TV Smart Cards |
|---|---|
Use Scenario: Disposable calling cards used in public payphones with value decrement on call initiation. IC Role / Device Role / Timing Role: Secure counter IC managing remaining call units; validates reload commands and prevents cloning via challenge-response. Use Value: Five-stage abacus counter ensures precise unit tracking across 33,352 increments; Card-Trash permanently disables chip after zero balance. | Use Scenario: Conditional access modules inserted into set-top boxes to authorize premium channel viewing. IC Role / Device Role / Timing Role: Authentication engine verifying subscription status via terminal-initiated challenge; stores encrypted entitlement data in protected PROM zones. Use Value: Dual-key authentication enables phased terminal upgrade (SAM-based); cipher block chaining certifies counter decrements during service revocation. |
| Transport Ticketing Systems | Secure Identity Tokens |
Use Scenario: Reusable transit passes validated at turnstiles with per-ride deduction and balance inquiry. IC Role / Device Role / Timing Role: Contact-based counter IC interfacing with reader via ISO/IEC 7816 T=0 protocol; handles transport code delivery and balance updates. Use Value: Transport Code protection secures initial card issuance; 30-year data retention ensures multi-year token lifecycle without refresh. | Use Scenario: Government-issued ID tokens requiring tamper-proof personalization and revocation capability. IC Role / Device Role / Timing Role: Secure storage element holding biometric template hashes and revocation flags; activated only after mutual authentication. Use Value: Mask-programmable ROM stores immutable manufacturer code; Card-Trash provides physical revocation independent of software state. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar secure counter IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SLE 7736E C | 48-bit issuer personalization PROM (vs. 40-bit in SLE 7736); 3rd byte programmed by card manufacturer, not Infineon | Enables flexible post-manufacture personalization for multi-issuer deployments | Select when card issuers require full control over 3rd-byte encoding during final personalization |
| SLE 5536S C | Lacks Card-Trash mechanism; no authentication key 2; lower security layout (NMOS vs. IMEM) | Legacy systems without physical devaluation or dual-key verification needs | Select only for backward compatibility where advanced security features are unused |
Compared with SLE 7736E C, the SLE 7736 C fixes the 3rd byte at Infineon for traceability; compared with SLE 5536S C, it adds Card-Trash, dual-key auth, and IMEM-based side-channel resistance - critical for new deployments requiring certified physical revocation.
Availability
SLE 7736 C is available at Aetrix Electronics and suitable for prepaid telephone cards, pay-TV smart cards, transport ticketing systems, and secure identity tokens requiring stable component supply and long-term lifecycle assurance.
Supply support for SLE 7736 C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in security ICs, power management, and automotive electronics, headquartered in Munich.
The Eurochip 77 family - including SLE 7736 C - was engineered specifically for high-assurance contact smart cards in telecom and pay-TV, emphasizing physical attack resistance, ISO/IEC 7816 compliance, and field-proven counter reliability.
FAQ
What is the function of the Card-Trash mechanism in SLE 7736 C?
The Card-Trash mechanism is a physical devaluation feature that permanently disables core security functions - including authentication and internal programming voltage generation - upon activation. It is triggered by external command and implemented via irreversible metallization fuse blowing, ensuring the chip cannot be reused after service termination. This differs from software-based lockout as it survives reprogramming attempts.
How does counter tearing protection work in SLE 7736 C?
Counter tearing protection uses four dedicated backup bits to mirror the state of each abacus stage during EEPROM write operations. If power loss occurs mid-write, these bits allow recovery to the last consistent count value. The feature is mask-configurable: enabled by default in SLE 7736 C, but can be disabled at wafer level for applications accepting reduced robustness in exchange for marginally faster writes.
Can SLE 7736 C operate at 3 V?
No - the SLE 7736 C variant is specified only for 4.5–5.5 V operation (Class A). For 2.7–5.5 V support, Infineon offers the SLE 7736-V3 C variant, which uses modified internal voltage regulation and timing circuits. Using SLE 7736 C outside its rated voltage range risks incomplete EEPROM writes, authentication timeout failures, or premature wear of security cells.
What distinguishes SLE 7736 C from SLE 7736E C in memory layout?
SLE 7736 C allocates 40 bits for issuer personalization data in PROM, while SLE 7736E C provides 48 bits. More critically, the 3rd byte of the manufacturer data field is mask-programmed by Infineon in SLE 7736 C (fixed at manufacture), but left open for programming by the card manufacturer during personalization in SLE 7736E C - enabling dynamic assignment of application-specific identifiers across multiple issuers.
SLE 7736 C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- Security
- Core Processor:
- -
- Program Memory Type:
- -
- Controller Series:
- -
- RAM Size:
- -
- Interface:
- -
- Number of I/O:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
SLE 7736 C FAQ
1.How can I place an order for SLE 7736 C through Aetrix?
Please submit a Request for Quotation (RFQ) for SLE 7736 C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SLE 7736 C reliable?
The price and inventory of SLE 7736 C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SLE 7736 C is usually 5 days.
3.What payment methods are accepted for SLE 7736 C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SLE 7736 C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SLE 7736 C?
SLE 7736 C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SLE 7736 C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SLE 7736 C?
For technical support, including SLE 7736 C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SLE 7736 C requirements.
6.How does Aetrix verify that SLE 7736 C is sourced from the original manufacturer or authorized distributors?
All SLE 7736 C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SLE 7736 C meets industry standards.
7.What is the process for return or replacement of SLE 7736 C?
All SLE 7736 C units undergo pre-shipment inspection (PSI). If there is an issue with SLE 7736 C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SLE 7736 C part is unused and in its original packaging.
Return procedure for SLE 7736 C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SLE 7736 C Tags

-
CYPD3175-24LQXQ
Infineon Technologies

-
SLB9672VU20FW1523XTMA1
Infineon Technologies

-
SLB9670VQ20FW785XTMA1
Infineon Technologies

-
SLB9672XU20FW1523XTMA1
Infineon Technologies

-
SLB9673XU20FW2613XTMA1
Infineon Technologies

-
CYPD3125-40LQXIT
Infineon Technologies

-
AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

-
SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

-
SLB9672AU20FW1613XTMA1
Infineon Technologies

-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
