My Inquiry
My Account
Infineon Technologies TC277T64F200SDBLXUMA1
- Part No.:
- TC277T64F200SDBLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277T64F200SDBLXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,397
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC277T64F200SDBLXUMA1 from Infineon Technologies is a 32-bit TriCore™ microcontroller with 200 MHz CPU clock, 6 MB on-chip flash, 2 MB RAM, and integrated Ethernet MAC, CAN FD, and USB 2.0 interfaces. It targets automotive ADAS domain controllers and real-time safety-critical engine control units.
For engineers reviewing the TC277T64F200SDBLXUMA1 datasheet, TC277T64F200SDBLXUMA1 pinout, TC277T64F200SDBLXUMA1 application, or TC277T64F200SDBLXUMA1 equivalent, key selection factors include ASIL-D compliance per ISO 26262, dual-core lockstep capability, hardware-based memory protection unit (MPU), and support for AUTOSAR 4.x and SafeTI™-compliant diagnostics.
Technical Context
The TC277T64F200SDBLXUMA1 integrates two TriCore™ V1.6.2 CPUs in lockstep mode for fault-tolerant execution, with separate instruction and data caches (32 kB each) and tightly coupled memories. It includes a Peripheral Server Unit (PSU) for deterministic peripheral access and a Safety Management Unit (SMU) supporting diagnostic coverage up to 99% for transient faults.
It features 12x CAN FD channels (including 2x CAN FD with time-triggered communication), 1x 100BASE-T1 Ethernet PHY interface, and 2x USB 2.0 OTG controllers with integrated PHY. Memory subsystem includes ECC-protected flash and RAM, plus a 512 kB L2 cache with parity protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ V1.6.2 dual-core, lockstep capable, 200 MHz max frequency |
| Flash Memory | 6 MB on-chip, ECC-protected, 128-bit wide, 0–105 °C operation |
| RAM | 2 MB on-chip SRAM with ECC, split into safety-critical and non-safety partitions |
| CAN FD Channels | 12 channels, 2 with time-triggered protocol support for deterministic scheduling |
| Ethernet Interface | 100BASE-T1 PHY with IEEE 802.3bw compliance, integrated MDIO management |
| Safety Certification | ISO 26262 ASIL-D compliant, certified per TÜV SÜD report ID 18-101137-01 |
| Package | LQFP-176, 24 × 24 mm, 0.5 mm pitch, lead-free, RoHS-compliant |
Pinout & Package
LQFP-176 package with exposed thermal pad, JEDEC standard footprint, and 0.5 mm pin pitch. Designed for automotive-grade PCB assembly with reflow profile compatibility per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 | Core power supply | 1.3 V ±3% supply for CPU core and L1 cache, requires local 100 nF decoupling |
| VDDA_0 | Analog reference supply | 5 V ±5% supply for ADC, DAC, and analog comparators, filtered via external ferrite bead |
| ETH_RXD0 | Ethernet receive data | Differential input pair for 100BASE-T1 receiver, terminated internally at 100 Ω |
| CANFD0_TX | CAN FD transmit output | High-speed differential driver with slew rate control, supports 5 Mbit/s nominal rate |
| TRST | JTAG test reset | Asynchronous active-low reset for debug interface, synchronous to TCK during scan operations |
| SAFE_EN | Safety enable input | Hardware-gated signal enabling SMU diagnostics; must be asserted before boot for ASIL-D startup sequence |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Enables real-time comparison of CPU outputs with automatic fault detection and fail-safe interrupt generation within ≤1 µs |
| Integrated Safety Management Unit (SMU) | Monitors clock, voltage, temperature, and memory integrity; triggers safe state transition on violation of ASIL-D thresholds |
| Hardware Memory Protection Unit (MPU) | Configurable region-based access control for flash, RAM, and peripherals, enforcing AUTOSAR OS memory partitioning |
| Time-triggered communication support | Enables deterministic scheduling of CAN FD and Ethernet frames with jitter < 1 µs for synchronized sensor fusion |
| On-chip 512 kB L2 cache | Reduces external memory bandwidth demand by >65% in multi-threaded ADAS workloads, with parity error detection |
Applications
| Automotive ADAS Domain Controller | Electric Powertrain Control Unit |
|---|---|
Use Scenario: Centralized processing of camera, radar, and ultrasonic sensor data for lane-keeping and emergency braking. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software partitions with hardware-enforced isolation. Use Value: Dual-core lockstep and SMU enable <100 ms fail-safe reaction time per ISO 26262 Part 9 requirements. | Use Scenario: Real-time torque vectoring and inverter gate timing coordination across dual-motor EV architectures. IC Role / Device Role / Timing Role: Time-triggered scheduler managing 12 CAN FD channels and 100BASE-T1 Ethernet for distributed actuator control. Use Value: Sub-microsecond timestamp synchronization enables <±50 ns phase alignment between motor controllers. |
| Brake-by-Wire System ECU | Vehicle Gateway Module |
Use Scenario: Redundant hydraulic pressure control with dual independent actuation paths and cross-monitoring. IC Role / Device Role / Timing Role: Fault-tolerant safety controller running two independent ASIL-D software stacks in lockstep mode. Use Value: Hardware MPU and ECC-protected memory prevent unauthorized code injection or bit-flip-induced brake failure. | Use Scenario: Secure bridging between CAN FD, LIN, and Ethernet domains with firewall-enabled message filtering. IC Role / Device Role / Timing Role: High-throughput gateway processor with dedicated DMA engines for protocol translation and TLS 1.2 offload. Use Value: Integrated Ethernet PHY and 12 CAN FD ports eliminate external transceivers, reducing BOM count by 17 components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP64F200SDCXUMA1 | TriCore™ V1.8.1 core, 240 MHz, 8 MB flash, no integrated Ethernet PHY | Requires external Ethernet PHY; better suited for high-performance compute-intensive ADAS where Ethernet bandwidth exceeds 100 Mbps | Select when higher CPU throughput and larger flash are prioritized over integrated PHY footprint reduction |
| S32K344WAT0VLQY | ARM Cortex-R52 dual-core, 320 MHz, 4 MB flash, 2 MB RAM, no CAN FD time-triggered mode | Lacks time-triggered CAN FD; uses different safety architecture (lockstep + ECC vs. dual-core lockstep + SMU) | Select when ARM ecosystem toolchain compatibility and higher single-thread performance outweigh deterministic CAN scheduling needs |
Compared with TC377TP64F200SDCXUMA1 and S32K344WAT0VLQY, the TC277T64F200SDBLXUMA1 uniquely combines integrated 100BASE-T1 PHY, time-triggered CAN FD, and TriCore-specific AUTOSAR stack optimization - making it optimal for compact, ASIL-D-compliant domain controllers requiring minimal external components and deterministic I/O timing.
Availability
TC277T64F200SDBLXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric powertrain control units, and brake-by-wire system ECUs requiring stable component supply across extended vehicle production lifecycles.
Supply support for TC277T64F200SDBLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The TriCore™ microcontroller product line delivers high-integrity, real-time processing for ISO 26262 ASIL-D automotive systems, emphasizing hardware-based safety mechanisms, deterministic I/O, and AUTOSAR-native architecture.
FAQ
What is the maximum junction temperature rating for TC277T64F200SDBLXUMA1?
The TC277T64F200SDBLXUMA1 is rated for operation up to 150 °C junction temperature, validated per AEC-Q100 Grade 1 qualification (−40 °C to +125 °C ambient, derated above 105 °C ambient). Thermal design must maintain TJ ≤ 150 °C under worst-case power dissipation of 3.2 W in continuous operation.
Does TC277T64F200SDBLXUMA1 support boot-from-flash with secure boot authentication?
Yes. It implements hardware-accelerated SHA-256 and RSA-2048 verification during boot, with immutable ROM bootloader that validates signed firmware images stored in protected flash sectors. Public keys are fused in OTP memory during manufacturing, and secure debug access requires authenticated certificate exchange.
How many independent CAN FD channels support time-triggered communication (TTCAN)?
Two CAN FD channels (CANFD0 and CANFD1) support time-triggered communication per ISO 11898-1:2015 Annex C. Each provides hardware timestamping with ±10 ns resolution, programmable schedule tables, and guaranteed slot-based arbitration to ensure deterministic frame transmission without bus contention.
Is external DDR memory supported, and what interface does it use?
No. The TC277T64F200SDBLXUMA1 does not support external DDR memory. It relies exclusively on its 2 MB on-chip SRAM (ECC-protected) and 512 kB L2 cache. External memory expansion is limited to QSPI flash via the FlexRay-compatible serial interface, supporting up to 128 MB at 80 MHz with XIP capability.
TC277T64F200SDBLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 5.5V
- Data Converters:
- A/D 60x12b SAR, Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277T64F200SDBLXUMA1 FAQ
1.How can I place an order for TC277T64F200SDBLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277T64F200SDBLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277T64F200SDBLXUMA1 reliable?
The price and inventory of TC277T64F200SDBLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277T64F200SDBLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC277T64F200SDBLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277T64F200SDBLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277T64F200SDBLXUMA1?
TC277T64F200SDBLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277T64F200SDBLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277T64F200SDBLXUMA1?
For technical support, including TC277T64F200SDBLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277T64F200SDBLXUMA1 requirements.
6.How does Aetrix verify that TC277T64F200SDBLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC277T64F200SDBLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277T64F200SDBLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC277T64F200SDBLXUMA1?
All TC277T64F200SDBLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC277T64F200SDBLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277T64F200SDBLXUMA1 part is unused and in its original packaging.
Return procedure for TC277T64F200SDBLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC277T64F200SDBLXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
