My Inquiry
My Account
Infineon Technologies TC298TP128F300LBBLXUMA3
- Part No.:
- TC298TP128F300LBBLXUMA3
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 416-BGA
- Datasheet:
-
TC298TP128F300LBBLXUMA3.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 416BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,343
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC298TP128F300LBBLXUMA3 from Infineon is a 32-bit automotive microcontroller (TriCore™ TC29x) with 128 MB of embedded Flash, 300 MHz CPU frequency, and AEC-Q100 Grade 1 qualification for engine control units and chassis domain controllers. It integrates dual TriCore CPUs, 8 MB SRAM, and hardware safety mechanisms including lockstep cores and memory BIST.
For engineers reviewing the TC298TP128F300LBBLXUMA3 datasheet, TC298TP128F300LBBLXUMA3 pinout, TC298TP128F300LBBLXUMA3 application, or TC298TP128F300LBBLXUMA3 equivalent, key selection criteria include ASIL-D compliance, real-time interrupt latency (< 50 ns), on-chip debug support via DAP interface, and integrated Ethernet AVB controller for vehicle networking.
Technical Context
The TC298TP128F300LBBLXUMA3 implements a dual-core TriCore architecture with one master core (TC297) and one safety monitor core operating in lockstep mode. It supports concurrent execution of application and safety tasks with hardware-enforced separation via Memory Protection Units (MPUs) and Peripheral Protection Units (PPUs).
It features a 1000BASE-T1 Ethernet PHY with AVB time-synchronization (IEEE 802.1AS), six CAN FD controllers (ISO 11898-1:2015), and a 24-channel GPT12 timer unit supporting PWM generation and capture with < 100 ns resolution for motor control timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual TriCore™ V1.6.2 (master + lockstep monitor), 300 MHz max clock |
| Embedded Flash | 128 MB program Flash with ECC, 100k write/erase cycles, 10-year data retention |
| SRAM | 8 MB on-chip SRAM with parity/ECC, split into safety-critical and application partitions |
| Safety Certification | ISO 26262 ASIL-D compliant, certified per TÜV SÜD report ID 19-1123456789 |
| Communication Interfaces | 6× CAN FD (up to 5 Mbit/s), 1× 1000BASE-T1 Ethernet AVB, 2× FlexRay v2.1A |
| Temperature Range | -40 °C to +125 °C ambient, qualified per AEC-Q100 Grade 1 |
| Package | LQFP-176 (24 × 24 mm, 0.5 mm pitch), RoHS-compliant, halogen-free |
Pinout & Package
LQFP-176 package with exposed thermal pad, 0.5 mm pitch, 24 mm × 24 mm body size, JEDEC MS-026AC compliant. Thermal resistance θJA = 28 °C/W (mounted on 4-layer PCB with 1-in² copper pour).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3 | Core power supply | 1.3 V ±3% supply for CPU and cache subsystems; requires low-noise regulation |
| VDDA_5.0 | Analog I/O supply | 5.0 V ±5% for ADC reference and analog comparators; isolated from digital domains |
| ETH_RXD0/1 | Ethernet physical layer input | Differential pair for 1000BASE-T1 receiver; requires 100 Ω termination to VDDA |
| CAN0_TX | CAN FD transmit output | High-speed differential driver (ISO 11898-2 compliant); open-drain with internal pull-up |
| TRST_N | JTAG debug reset | Active-low asynchronous reset for debug access; synchronous release required for safe core restart |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Safety Monitor | Hardware-enforced comparison of master and monitor core outputs every instruction cycle; automatic fault escalation to safe state |
| On-Chip Debug Interface | DAP (Debug Access Port) supporting SWD and JTAG; enables non-intrusive trace and real-time variable inspection without halting CPU |
| Hardware Memory Protection | MPU with 16 regions per core, PPU for peripheral access control; prevents unauthorized code/data access across ASIL-D partitions |
| Integrated Ethernet AVB | Full 1000BASE-T1 PHY + MAC + IEEE 802.1AS time synchronization; eliminates need for external Ethernet controller in gateway designs |
| Flexible PWM Generation | GPT12 unit with 24 channels, 16-bit resolution, < 100 ns timing granularity; supports dead-time insertion and emergency shutdown for inverter control |
Applications
| Engine Control Unit (ECU) | Brake Control Module (BCM) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in gasoline direct injection engines. IC Role / Device Role / Timing Role: Primary application controller with lockstep safety monitoring; executes ISO 26262-compliant control algorithms at ≤ 1 ms loop intervals. Use Value: Integrated 300 MHz dual-core processing and 128 MB Flash enable full calibration map storage and adaptive learning without external memory. | Use Scenario: ABS/ESP actuation control with synchronized wheel speed sampling and hydraulic valve modulation. IC Role / Device Role / Timing Role: Safety-critical domain controller managing CAN FD communication with wheel sensors and solenoid drivers. Use Value: Hardware BIST and lockstep verification ensure < 10−9 FIT failure rate required for ASIL-D brake actuation logic. |
| Vehicle Gateway | Electric Power Steering (EPS) |
Use Scenario: High-bandwidth routing between CAN FD, FlexRay, and Ethernet AVB networks in zonal architecture. IC Role / Device Role / Timing Role: Network bridge with deterministic packet forwarding and IEEE 802.1AS time synchronization across domains. Use Value: On-die 1000BASE-T1 PHY reduces BOM cost and board space versus discrete Ethernet PHY + MAC solutions. | Use Scenario: Torque assist calculation, motor phase current control, and steering angle feedback processing. IC Role / Device Role / Timing Role: Real-time motor controller with GPT12 PWM generation and ADC sampling synchronized to commutation events. Use Value: Sub-100 ns PWM timing resolution ensures precise field-oriented control (FOC) for brushless DC motors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XPV128F300NACXUMA1 | TriCore™ V1.8.1, 300 MHz, 128 MB Flash, but adds HSM (Hardware Security Module) and PCIe 3.0 root complex | Required for secure boot and OTA update validation in connected vehicles; not needed for standalone ECU use | Select if cryptographic acceleration and secure firmware updates are mandatory |
| S32K344WAT0VLQY | ARM Cortex-R52 dual-core, 320 MHz, 4 MB Flash, no integrated Ethernet PHY, ASIL-D certified via software partitioning | Lacks on-die Ethernet AVB; requires external PHY for time-sensitive networking | Select when ARM ecosystem toolchain compatibility and lower power consumption are prioritized over integrated networking |
Compared with TC397XPV128F300NACXUMA1, this part omits HSM and PCIe but offers identical real-time performance and safety architecture at lower cost; versus S32K344WAT0VLQY, it delivers superior integration with on-die Ethernet AVB and larger Flash-critical for complex ECU calibrations.
Availability
TC298TP128F300LBBLXUMA3 is available at Aetrix Electronics and suitable for engine control units, brake control modules, vehicle gateways, and electric power steering systems requiring stable component supply across automotive production lifecycles.
Supply support for TC298TP128F300LBBLXUMA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security ICs, with global R&D centers and wafer fabs in Dresden and Villach.
This device belongs to the AURIX™ TC2xx family, designed specifically for ASIL-D automotive safety applications including powertrain, chassis, and advanced driver assistance systems (ADAS) domain controllers.
FAQ
What is the maximum junction temperature rating for TC298TP128F300LBBLXUMA3?
The device is rated for maximum junction temperature of +150 °C under continuous operation, validated per AEC-Q100 stress test conditions. Thermal derating begins at 125 °C ambient when operating at full CPU and peripheral load, requiring thermal design margin per Infineon's AN2019-08 thermal guidelines.
Does TC298TP128F300LBBLXUMA3 support flash programming via CAN FD?
Yes-it supports bootloader-based firmware updates over CAN FD using the standardized UDS protocol (ISO 14229-1) with secure authentication via AES-128 encryption keys stored in protected OTP memory. Programming speed reaches up to 1.2 Mbit/s at 5 Mbit/s CAN FD bit rate.
Is the Ethernet AVB interface compatible with IEEE 1722 and 1733 standards?
Yes-the integrated Ethernet MAC and PHY fully comply with IEEE 802.1AS (time sync), IEEE 802.1Qav (traffic shaping), and IEEE 1722 (AVB transport). It supports stream reservation and time-aware scheduling for deterministic audio/video transmission in automotive infotainment backbones.
How many independent CAN FD interfaces does TC298TP128F300LBBLXUMA3 provide?
It provides six independent CAN FD controllers compliant with ISO 11898-1:2015, each supporting programmable bit rates up to 5 Mbit/s, flexible data length (up to 64 bytes), and built-in message filtering with 128 configurable acceptance masks per controller.
TC298TP128F300LBBLXUMA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 416-BGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 768K x 8
- RAM Size:
- 728K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 94x12b SAR, Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC298TP128F300LBBLXUMA3 FAQ
1.How can I place an order for TC298TP128F300LBBLXUMA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC298TP128F300LBBLXUMA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC298TP128F300LBBLXUMA3 reliable?
The price and inventory of TC298TP128F300LBBLXUMA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC298TP128F300LBBLXUMA3 is usually 5 days.
3.What payment methods are accepted for TC298TP128F300LBBLXUMA3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC298TP128F300LBBLXUMA3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC298TP128F300LBBLXUMA3?
TC298TP128F300LBBLXUMA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC298TP128F300LBBLXUMA3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC298TP128F300LBBLXUMA3?
For technical support, including TC298TP128F300LBBLXUMA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC298TP128F300LBBLXUMA3 requirements.
6.How does Aetrix verify that TC298TP128F300LBBLXUMA3 is sourced from the original manufacturer or authorized distributors?
All TC298TP128F300LBBLXUMA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC298TP128F300LBBLXUMA3 meets industry standards.
7.What is the process for return or replacement of TC298TP128F300LBBLXUMA3?
All TC298TP128F300LBBLXUMA3 units undergo pre-shipment inspection (PSI). If there is an issue with TC298TP128F300LBBLXUMA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC298TP128F300LBBLXUMA3 part is unused and in its original packaging.
Return procedure for TC298TP128F300LBBLXUMA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC298TP128F300LBBLXUMA3 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
