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Infineon Technologies TC299TP128F300NBCKXUMA2

Part No.:
TC299TP128F300NBCKXUMA2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
516-LFBGA
Datasheet:
AetrixTC299TP128F300NBCKXUMA2.pdf
Description:
IC MCU 32BIT 8MB FLASH 516LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,743

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Product details

Overview

TC299TP128F300NBCKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, lockstep shadow core for ASIL-D safety compliance, 8 MB program flash with ECC, 768 KB data flash for EEPROM emulation, and integrated 128-channel DMA. It targets automotive powertrain and chassis control systems requiring functional safety up to ISO 26262 ASIL-D.

For engineers reviewing the TC299TP128F300NBCKXUMA2 datasheet, TC299TP128F300NBCKXUMA2 pinout, TC299TP128F300NBCKXUMA2 application, or TC299TP128F300NBCKXUMA2 equivalent, key selection criteria include dual-core lockstep timing integrity, ERAY/ETH/ASCLIN interface coexistence, BGA516 thermal-mechanical reliability, and flash ECC coverage across PFLASH/DFLASH/LMU memory domains.

Technical Context

The TC299TP128F300NBCKXUMA2 implements a deterministic real-time architecture with two independent TriCore™ TC1.6P superscalar CPUs (300 MHz max), each with dedicated 120 KB DSPR + 32 KB PSPR RAM, 16 KB ICACHE, and 8 KB DCACHE. The lockstepped shadow core provides hardware-level fault detection for safety-critical execution paths.

Its on-chip communication subsystem includes ERAY (flexible time-triggered bus), 10/100 Ethernet MAC with MII/RMII support, 6x ASCLIN (UART/SPI/LIN), QSPI, I²C, and EBU parallel interface - all accessible via a 64-bit SRI crossbar enabling concurrent master access without arbitration stalls.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual 32-bit TriCore™ TC1.6P @ up to 300 MHz; enables parallel real-time task partitioning with lockstep shadow core for ASIL-D fault containment.
Memory 8 MB ECC-protected PFLASH + 768 KB DFLASH (EEPROM emulation) + 32 KB LMU + BootROM; supports safe firmware updates and runtime data logging.
Package BGA516 (27 × 27 mm, 0.8 mm pitch); qualified for automotive under AEC-Q100 Grade 1 (−40°C to +125°C ambient).
Functional Safety Hardware-assisted lockstep, ECC on all SRAM/Flash, memory BIST, CPU self-tests, and safety management unit (SMU) per ISO 26262 ASIL-D requirements.
Peripherals ERAY controller (2 channels), 10/100 Ethernet MAC, 6× ASCLIN, QSPI, I²C, VADC (24-ch), DSADC (4-ch), HSCT (32-bit timer), and EBU parallel interface.
Power Supply 1.3 V core / 3.3 V I/O (5 V-tolerant on select pads); integrated EVR with dynamic voltage scaling for low-power operation modes.

Pinout & Package

BGA516 package (27 mm × 27 mm, 0.8 mm ball pitch) with thermal pad; RoHS-compliant, lead-free finish; designed for automotive PCB assembly with controlled impedance routing support for high-speed interfaces (ERAY, ETH, LVDS).

Pin/Terminal Circuit Role Design Meaning
VDDP_1P3 Core Power Supply 1.3 V supply for CPU, cache, and internal logic; requires low-noise decoupling near package corner balls.
VDDP_3P3 I/O Power Supply 3.3 V supply for GPIO, ASCLIN, QSPI, and analog peripherals; supports 5 V-tolerant inputs on designated pins.
ERAY_TX0 / ERAY_RX0 ERAY Channel 0 Interface Differential pair supporting time-triggered communication at up to 10 Mbit/s; routed as controlled-impedance 100 Ω differential trace.
ETH_MDIO / ETH_MDC Ethernet Management Interface Open-drain MDIO and clocked MDC signals for PHY register configuration; require 1.5 kΩ pull-up on MDIO.
BOOT_MODE[1:0] Boot Configuration Two-pin strap defining boot source (PFLASH, DFLASH, or external via EBU); sampled at power-on reset only.

Key Features

Feature Design Value
TriCore™ Dual-Core Lockstep Hardware-synchronized dual TC1.6P cores with cycle-accurate comparison; detects transient faults in <1 µs for ASIL-D compliance.
ECC Protection Coverage End-to-end ECC on all embedded memories (PFLASH, DFLASH, DSPR, PSPR, LMU, cache tags); corrects single-bit errors, detects double-bit errors.
ERAY Time-Triggered Bus Two independent ERAY controllers supporting up to 64 nodes, 10 Mbit/s, and guaranteed latency ≤ 2 µs for safety-critical actuator commands.
VADC + DSADC Integration 24-channel 12-bit VADC with 0.5 µs conversion time + 4-channel DSADC for high-precision current sensing in motor control loops.
Secure Boot & Debug ROM-based secure boot with SHA-256 signature verification; debug access restricted via DAP with configurable privilege levels and JTAG disable option.

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D software partitions with lockstep CPU validation and flash ECC for calibration data integrity.

Use Value: Enables deterministic sub-10 µs interrupt response for cylinder-specific spark/fuel events while maintaining full ISO 26262 toolchain traceability.

Use Scenario: Torque assist calculation, motor phase current regulation, and fail-safe torque reduction during steering column faults.

IC Role / Device Role / Timing Role: Dual-core coordination between safety monitor (shadow core) and torque computation (main core), synchronized via ERAY to EPS motor driver.

Use Value: Achieves <500 ns inter-core synchronization jitter and DSADC-based current sampling at 200 kSPS for field-oriented control stability.

Brake-by-Wire System Vehicle Domain Controller

Use Scenario: Redundant hydraulic pressure modulation and wheel-speed-based ABS/EBD actuation in electromechanical brake modules.

IC Role / Device Role / Timing Role: Safety island processor managing ASIL-D braking decisions, interfacing with dual-redundant CAN FD and ERAY networks.

Use Value: Delivers <1 ms end-to-end latency from wheel speed input to solenoid drive output using hardware-accelerated CRC and DMA-driven peripheral chaining.

Use Scenario: Centralized vehicle functions including gateway routing, OTA update orchestration, and sensor fusion preprocessing.

IC Role / Device Role / Timing Role: High-bandwidth domain hub connecting CAN FD, Ethernet, and LIN networks via integrated protocol accelerators and memory-mapped buffers.

Use Value: Supports concurrent 100 Mbps Ethernet streaming + 5× CAN FD channels + LIN transceivers without CPU intervention via dedicated DMA channels and SRI bandwidth allocation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC297TP128F300NACXUMA1 Same dual-core TC1.6P @ 300 MHz, but BGA416 package (smaller footprint, reduced peripheral count: no ETH, only 1 ERAY channel). Targeted at cost-sensitive chassis modules where Ethernet connectivity and dual ERAY are not required. Select when board space is constrained and ASIL-D safety is needed without full TC299 peripheral set.
S32K344WAT0VLQY NXP S32K3 series with Arm Cortex-M7 + Cortex-M33 lockstep; 320 MHz, 4 MB flash, supports AUTOSAR Adaptive but lacks ERAY and VADC/DSADC integration. Focused on zonal ECU architectures with Linux/AUTOSAR Adaptive middleware; no native support for legacy time-triggered buses. Prefer for next-gen software-defined vehicles requiring POSIX-compliant RTOS and Ethernet TSN, not legacy ERAY/CAN FD hybrid systems.

Compared with TC299TP128F300NBCKXUMA2, TC297 offers footprint reduction at the cost of Ethernet and second ERAY channel, while S32K344 trades mature time-triggered peripheral integration for adaptive compute flexibility - making TC299 optimal for safety-critical powertrain systems demanding deterministic ERAY/Ethernet coexistence.

Availability

TC299TP128F300NBCKXUMA2 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and vehicle domain controllers requiring stable component supply across extended automotive production lifecycles.

Supply support for TC299TP128F300NBCKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing facilities.

The AURIX™ TC29x product line was engineered specifically for ISO 26262 ASIL-D automotive applications - emphasizing hardware-based safety mechanisms, time-deterministic execution, and robust integration of legacy (CAN, LIN) and emerging (ERAY, Ethernet) vehicle networks.

FAQ

What is the maximum operating temperature range for TC299TP128F300NBCKXUMA2?

The TC299TP128F300NBCKXUMA2 is qualified per AEC-Q100 Grade 1, supporting continuous operation from −40°C to +125°C ambient temperature. Junction temperature must remain below +150°C under worst-case power dissipation, verified via thermal simulation using the provided ΨJB and ΨJT values in the package outline document.

Does TC299TP128F300NBCKXUMA2 support secure boot with cryptographic verification?

Yes - it features ROM-based secure boot with SHA-256 hash verification of the first boot image loaded from PFLASH or external memory. Public key storage is implemented in one-time-programmable (OTP) fuses, and signature validation occurs before any user code execution, preventing unauthorized firmware loading.

How many independent clock domains does TC299TP128F300NBCKXUMA2 support?

The device integrates four independent clock domains: CPU core (PLL-derived up to 300 MHz), peripheral bus (divided from core clock), ERAY/ETH (separate PLL with spread-spectrum capability), and low-power domain (RTC, WDT, backup registers). Each domain has configurable gating and frequency scaling via the Clock Generation Unit (CGU).

Can TC299TP128F300NBCKXUMA2 directly interface with 5 V sensors without level-shifting?

Yes - selected GPIO pins (including ASCLIN, QSPI, and EBU address/data lines) are 5 V-tolerant when configured as inputs. This allows direct connection to 5 V analog sensors or legacy digital peripherals without external level shifters, provided VDDP_3P3 remains at 3.3 V and input voltage does not exceed 5.5 V.

TC299TP128F300NBCKXUMA2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
516-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
263
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
768K x 8
RAM Size:
728K x 8
Voltage - Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 94x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC299TP128F300NBCKXUMA2 FAQ

1.How can I place an order for TC299TP128F300NBCKXUMA2 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC299TP128F300NBCKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC299TP128F300NBCKXUMA2 reliable?

The price and inventory of TC299TP128F300NBCKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC299TP128F300NBCKXUMA2 is usually 5 days.

3.What payment methods are accepted for TC299TP128F300NBCKXUMA2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC299TP128F300NBCKXUMA2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC299TP128F300NBCKXUMA2?

TC299TP128F300NBCKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC299TP128F300NBCKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC299TP128F300NBCKXUMA2?

For technical support, including TC299TP128F300NBCKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC299TP128F300NBCKXUMA2 requirements.

6.How does Aetrix verify that TC299TP128F300NBCKXUMA2 is sourced from the original manufacturer or authorized distributors?

All TC299TP128F300NBCKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC299TP128F300NBCKXUMA2 meets industry standards.

7.What is the process for return or replacement of TC299TP128F300NBCKXUMA2?

All TC299TP128F300NBCKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC299TP128F300NBCKXUMA2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC299TP128F300NBCKXUMA2 part is unused and in its original packaging.

Return procedure for TC299TP128F300NBCKXUMA2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC299TP128F300NBCKXUMA2 Tags

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