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Infineon Technologies TC327LP16F160SAALXUMA1
- Part No.:
- TC327LP16F160SAALXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC327LP16F160SAALXUMA1.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,482
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Product details
Overview
TC327LP16F160SAALXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a single TC1.6.2P CPU core operating up to 300 MHz, 2 MB program flash, 128 KB data flash (DFLASH0), and ECC-protected SRAM including 192 KB DSPR and 8 KB PSPR. It integrates dual ASCLIN, four QSPI, two MCMCAN modules (4 CAN nodes), one FlexRay™ E-Ray module, and GTM for autonomous I/O timing - deployed in automotive powertrain control units requiring ASIL-D compliance.
For engineers reviewing the TC327LP16F160SAALXUMA1 datasheet, TC327LP16F160SAALXUMA1 pinout, TC327LP16F160SAALXUMA1 application, or TC327LP16F160SAALXUMA1 equivalent, key selection criteria include lockstep safety architecture, 64-channel DMA with safe transfer, on-chip HSM option, SMU alarm handling, and ISO 26262 Safety Element out of Context certification for ASIL-D systems.
Technical Context
The TC327LP16F160SAALXUMA1 implements a super-scalar TriCore CPU with fully pipelined FPU, 2 MAC/cycle capability, and integrated DSP functions. Its memory subsystem includes ECC-protected 2 MB PFLASH, 128 KB DFLASH0, and hierarchical RAM (DSPR/PSPR/DLMU), all accessible via a 64-bit SRI crossbar interconnect supporting concurrent CPU, DMA, and peripheral access.
Real-time peripherals include two MCMCAN modules with FIFO buffering, one E-Ray FlexRay v2.1 controller with dual channels, six SENT receivers, and a dual-kernel GTM running at 200 MHz for deterministic signal generation and capture. Clocking relies on independent SYS_PLL and PER_PLL with backup oscillator support and 5 V/3.3 V switchable I/O pads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single TC1.6.2P TriCore, super-scalar, up to 300 MHz across full automotive temperature range (-40°C to 125°C) |
| Memory | 2 MB ECC-protected PFLASH + 128 KB DFLASH0 for EEPROM emulation; 192 KB DSPR + 8 KB PSPR + 8 KB DLMU, all ECC-protected |
| Safety Architecture | Lockstepped shadow CPU core; SMU for safety monitor alarms; MTU for MBIST/ECC initialization; ISO 26262 SEooC certified up to ASIL-D |
| Communication | 2× MCMCAN (4 CAN nodes), 4× QSPI (50 Mbit/s), 12× ASCLIN (LIN v2.1/J2602), 1× E-Ray FlexRay v2.1 (dual channel), 6× SENT |
| Timing & ADC | Dual GTM clusters @ 200 MHz; 2× VADC clusters (16+28 channels); CCU60/CCU61 capture/compare units; GPT12 timer |
| Debug & Security | JTAG/DAP interface; OCDS Level 1 debug; optional Hardware Security Module (HSM); IOM for digital I/O monitoring |
Pinout & Package
LFBGA-292 package (15 × 15 mm, 0.8 mm pitch) with 292 solder balls; pinout defined per feature package LP in Infineon TC33x/TC32x datasheet Section 2.1. Ball map supports dual power domains (VDDP/VDD), dedicated JTAG/DAP, multiple CAN/FlexRay differential pairs, QSPI/ASCLIN banks, and configurable 5 V/3.3 V I/O groups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP / VDD | Core & I/O supply | Dual-domain power: VDDP (1.25 V core), VDD (3.3 V or 5 V switchable I/O) - enables mixed-voltage interfacing |
| TCK / TMS / TDI / TDO / TRSTN | JTAG boundary scan | IEEE 1149.1-compliant test and debug interface; supports OCDS Level 1 for CPU/DMA/bus visibility |
| ERAY_TXD0/1, ERAY_RXD0/1 | E-Ray differential signaling | Dedicated ball pairs for FlexRay v2.1 channel A/B; require external termination and common-mode bias |
| CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX | MCMCAN differential I/O | Four independent CAN transceiver interfaces (2 per MCMCAN module); support CAN FD framing and hardware filtering |
| QSPI0_SCLK/QSPI0_IO0–3 | Quad SPI master/slave | Full-duplex quad-line interface up to 50 Mbit/s; supports XIP from external flash via QSPI boot mode |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Pair | Primary TC1.6.2P core with hardware-matched shadow core enabling real-time comparison and fault detection per instruction cycle |
| ECC Memory Protection | End-to-end error correction on all embedded memories (PFLASH, DFLASH, DSPR, PSPR, DLMU, caches) - prevents silent data corruption in safety-critical code/data |
| 64-Channel Safe DMA | DMA engine with address/data CRC, destination validation, and channel-specific access rights - ensures integrity during high-bandwidth sensor/actuator transfers |
| GTM Real-Time Timing | Dual GTM clusters running at 200 MHz provide autonomous PWM, capture, sigma-delta modulation, and time-triggered I/O without CPU intervention |
| ASIL-D Ready Safety Unit | Integrated SMU monitors CPU lockstep divergence, memory errors, clock faults, and watchdog timeouts - triggers safe state entry per ISO 26262 requirements |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in ICE powertrains. IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D software partitions with lockstep CPU and ECC memory. Use Value: Deterministic 300 MHz execution enables sub-microsecond interrupt latency for cylinder-specific spark/fuel events while maintaining fault containment. |
Use Scenario: Torque assist calculation, motor phase control, and steering angle feedback processing in 12 V EPS systems. IC Role / Device Role / Timing Role: Central MCU managing CAN communication with vehicle bus, SENT sensor acquisition, and GTM-driven 3-phase PWM generation. Use Value: Integrated 6-channel SENT receivers directly digitize torque/position sensors; GTM TOM units generate synchronized gate drive signals with <100 ns jitter. |
| Brake-by-Wire Control | Vehicle Domain Controller |
|
Use Scenario: Redundant actuation control for electro-hydraulic brake systems with dual-CAN/FlexRay communication. IC Role / Device Role / Timing Role: Safety island processor handling ASIL-D braking logic, E-Ray message scheduling, and MCMCAN redundancy arbitration. Use Value: Dual E-Ray channels enable time-triggered, fault-tolerant communication with brake actuators; SMU enforces fail-safe transition on detected divergence. |
Use Scenario: Consolidated gateway and domain management in zonal architectures with mixed legacy CAN and high-speed Ethernet backhaul. IC Role / Device Role / Timing Role: High-integration MCU providing CAN FD routing, LIN sensor aggregation, QSPI-booted firmware updates, and secure boot via optional HSM. Use Value: 2 MB PFLASH supports dual-bank over-the-air updates; HSM enables AES-128/SHA-256 crypto acceleration for secure firmware signing and key provisioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC337LP16F160SAALXUMA1 | Same LFBGA-292 package and LP feature set, but adds second TriCore CPU core (dual-core) and increases DSPR to 256 KB | Required for asymmetric multi-processing (AMP) designs where one core handles safety-critical ASIL-D tasks and the other runs non-safety middleware | Select when workload partitioning demands dedicated cores - not drop-in compatible due to different memory map and boot configuration |
| TC277TP16F160NACXUMA1 | Legacy AURIX TC2xx family; single TC1.6E core at 200 MHz; 2 MB PFLASH but only 96 KB DFLASH and no HSM option | Suitable for cost-sensitive ASIL-B/C applications lacking FlexRay, E-Ray, or HSM requirements | Choose only if migrating from existing TC2xx designs - lacks ISO 26262 SEooC ASIL-D certification and modern GTM/E-Ray features |
Compared with TC327LP16F160SAALXUMA1, TC337 offers higher compute density for AMP but requires software re-architecture, while TC277 provides legacy compatibility at lower safety capability and peripheral integration - neither matches its balance of ASIL-D readiness, FlexRay support, and single-core efficiency.
Availability
TC327LP16F160SAALXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake-by-wire systems, and vehicle domain controllers requiring stable component supply under AEC-Q100 Grade 1 qualification.
Supply support for TC327LP16F160SAALXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich with global R&D and manufacturing operations.
This device belongs to the AURIX™ TC3xx family - engineered specifically for ISO 26262-compliant automotive safety applications including powertrain, chassis, and ADAS, with emphasis on lockstep reliability, memory safety, and real-time deterministic performance.
FAQ
What is the maximum operating frequency and temperature range for TC327LP16F160SAALXUMA1?
The TC327LP16F160SAALXUMA1 operates at up to 300 MHz across the full automotive temperature range of −40 °C to +125 °C, validated per AEC-Q100 Grade 1 specifications. This frequency is sustained under worst-case voltage (VDDP = 1.25 V ±3%) and thermal conditions without throttling or derating.
Does this microcontroller support FlexRay communication, and which version?
Yes, it integrates a single E-Ray FlexRay module compliant with FlexRay Communication System Specification v2.1, featuring two independent channels (A and B) with full time-triggered scheduling, dynamic segment support, and built-in CRC and header validation logic.
Is Hardware Security Module (HSM) included by default in this part number?
No, the TC327LP16F160SAALXUMA1 does not include an integrated HSM; it is an optional feature available only on specific variants (e.g., TC327LP16F160SAALXUMA2). This part supports secure boot and cryptographic offload only via external HSM or software libraries.
What package type and pin count does TC327LP16F160SAALXUMA1 use?
It uses the LFBGA-292 package: 15 mm × 15 mm body size, 0.8 mm ball pitch, 292 solder balls arranged in a 17 × 17 array with corner balls omitted. Pin definitions follow the LP feature package layout documented in Section 2.1 of the TC33x/TC32x datasheet.
TC327LP16F160SAALXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- DMA, I2S, PWM, WDT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 152K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 16 SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC327LP16F160SAALXUMA1 FAQ
1.How can I place an order for TC327LP16F160SAALXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC327LP16F160SAALXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC327LP16F160SAALXUMA1 reliable?
The price and inventory of TC327LP16F160SAALXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC327LP16F160SAALXUMA1 is usually 5 days.
3.What payment methods are accepted for TC327LP16F160SAALXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC327LP16F160SAALXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC327LP16F160SAALXUMA1?
TC327LP16F160SAALXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC327LP16F160SAALXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC327LP16F160SAALXUMA1?
For technical support, including TC327LP16F160SAALXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC327LP16F160SAALXUMA1 requirements.
6.How does Aetrix verify that TC327LP16F160SAALXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC327LP16F160SAALXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC327LP16F160SAALXUMA1 meets industry standards.
7.What is the process for return or replacement of TC327LP16F160SAALXUMA1?
All TC327LP16F160SAALXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC327LP16F160SAALXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC327LP16F160SAALXUMA1 part is unused and in its original packaging.
Return procedure for TC327LP16F160SAALXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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