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Infineon Technologies TC357TH64F300SABKXUMA1
- Part No.:
- TC357TH64F300SABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC357TH64F300SABKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,589
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Product details
Overview
TC357TH64F300SABKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 4 MB embedded PFlash with ECC, 512 KB LMU RAM, dual MCMCAN (4 CAN nodes), FlexRay™ v2.1, IEEE 802.3 Ethernet MAC (MII/RMII), and hardware safety support compliant with ISO 26262 ASIL D requirements. It targets automotive powertrain and chassis control systems requiring functional safety and real-time deterministic execution.
For engineers reviewing the TC357TH64F300SABKXUMA1 datasheet, TC357TH64F300SABKXUMA1 pinout, TC357TH64F300SABKXUMA1 application, or TC357TH64F300SABKXUMA1 equivalent, this device delivers verified triple-core redundancy, integrated safety management (SMU, MTU, IOM), high-speed serial interfaces (QSPI, ASCLIN, E-Ray), and automotive-qualified flash memory for mission-critical ECU designs.
Technical Context
The TC357TH64F300SABKXUMA1 implements a tri-core architecture with two lockstepped CPU pairs and one independent core, enabling ASIL D decomposition via spatial and temporal redundancy. Its System PLL supports 300 MHz core clock generation with jitter < ±50 ps RMS, while the Peripheral PLL independently clocks Ethernet, CAN, and FlexRay modules.
Memory subsystem includes ECC-protected 4 MB PFlash, 128 KB DFlash for EEPROM emulation, and 512 KB LMU SRAM with configurable access arbitration. Safety features include Memory Test Unit (MTU) with MBIST, Hardware I/O Monitor (IOM), and Safety Management Unit (SMU) with 32 configurable alarm channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Three 32-bit TriCore™ TC1.6.2P CPUs; two in lockstep for ASIL D, one independent for application tasks |
| Max Core Frequency | 300 MHz across full automotive temperature range (−40°C to 150°C) |
| Embedded Flash | 4 MB Program Flash (PFlash) with single-bit error correction and double-bit error detection (ECC) |
| RAM Capacity | 512 KB Local Memory Unit (LMU) SRAM + 240 KB DSPR + 64 KB PSPR, all ECC-protected |
| Serial Interfaces | 2× MCMCAN (4 CAN FD nodes), 1× FlexRay™ v2.1 (2 channels), 1× IEEE 802.3 Ethernet MAC (MII/RMII) |
| Safety Certification | ISO 26262 SEooC certified for ASIL D; AEC-Q100 Grade 1 qualified (−40°C to 125°C ambient) |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free |
Pinout & Package
LFBGA-292 package with 15 × 15 mm body, 0.8 mm ball pitch, and standard JEDEC MO-277 compliance. Pinout defined per Infineon TC35x AB-Step datasheet Section 2.1, supporting dual-voltage I/O (3.3 V/5 V switchable), LVDS signaling, and dedicated safety monitoring pins (e.g., SMU_ALARM, IOM_TRIG).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P2 | Core Power Supply | 1.25 V ±3% supply for CPU cores and caches; requires low-noise regulation and decoupling |
| VDDP_3P3 | I/O Power Supply | 3.3 V ±5% supply for general-purpose I/O banks; supports 5 V-tolerant operation on selected pads |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY configuration; operates at ≤10 MHz with open-drain drive |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Data | Differential pair for FlexRay v2.1 communication; requires 100 Ω termination and controlled impedance routing |
| SMU_ALARM0 | Safety Monitor Output | Active-low asynchronous alarm signal triggered by SMU upon detected fault condition (e.g., ECC error overflow) |
| TCK / TMS / TDI / TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary-scan and debug access; supports OCDS Level 1 for multi-core tracing |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Core Lockstep Execution | Enables ASIL D decomposition by running two cores in lockstep with third core handling non-safety tasks and cross-checking |
| Hardware Security Module (HSM) | Optional on-chip HSM supports AES-128/256, SHA-256, RSA-2048, and secure boot with key injection via JTAG/DAP |
| Memory Built-in Self-Test (MBIST) | MTU executes full SRAM/Flash test during startup and runtime without CPU intervention, meeting ASIL D diagnostic coverage |
| Flexible Clock Generation | Separate SYS_PLL (for CPU/bus) and PER_PLL (for Ethernet/CAN/FlexRay) enable independent frequency scaling and jitter isolation |
| ASIL-D Compliant I/O Monitoring | IOM continuously validates digital I/O states against expected patterns using dedicated monitor logic, independent of CPU |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under extreme thermal and EMI conditions. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL D software partitions with lockstep core verification and hardware memory protection. Use Value: 300 MHz deterministic execution ensures sub-1 µs interrupt latency for spark/fuel actuation; ECC-protected 4 MB PFlash enables field-upgradable calibration maps. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction in steer-by-wire systems. IC Role / Device Role / Timing Role: Dual-lockstep core pair handles safety-critical torque path; independent core manages CAN FD communication and diagnostics. Use Value: Integrated MCMCAN supports 4 concurrent CAN FD nodes for sensor fusion and actuator control; IOM validates steering angle sensor I/O in real time. |
| Brake Control Module (BCM) | Advanced Driver Assistance Systems (ADAS) Domain Controller |
|
Use Scenario: ABS, ESC, and electronic parking brake coordination with hydraulic actuator drivers and wheel speed sensors. IC Role / Device Role / Timing Role: Safety manager executing ISO 26262 ASIL D braking algorithms with hardware-enforced separation between control and monitoring paths. Use Value: SMU monitors 32 configurable alarms including voltage, temperature, and clock failure; MTU performs periodic RAM/Flash tests without CPU load impact. |
Use Scenario: Sensor data aggregation (radar, camera, ultrasonic), path planning, and vehicle-to-vehicle (V2V) communication in L2+ ADAS platforms. IC Role / Device Role / Timing Role: High-bandwidth interconnect hub connecting radar interface, Ethernet AVB, and CAN FD networks with deterministic latency guarantees. Use Value: 64-bit SRI crossbar enables simultaneous 1 Gbps Ethernet + 2× FlexRay + 4× CAN FD traffic; VADC cluster samples 24 analog sensor inputs at 12-bit resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC377TP64F300SABKXUMA1 | Same AB-step silicon, but with 6 MB PFlash, 1 MB LMU, and enhanced HSM (AES-GCM, TRNG); no change in pinout or core count | Preferred for future-proofed ECU designs requiring larger firmware image storage and stronger cryptographic acceleration | Select when >4 MB flash or hardware GCM mode is required; otherwise identical migration path |
| S32K344W1MTAT0ML | NXP S32K344 uses Arm Cortex-R52 cores (dual lockstep), 4 MB flash, but lacks FlexRay and has lower max frequency (320 MHz shared across cores) | Better suited for gateway/communication-focused ECUs; limited real-time determinism vs. TriCore for powertrain control | Choose for Arm ecosystem compatibility or where FlexRay is not required; verify ASIL D toolchain qualification |
Compared with TC357TH64F300SABKXUMA1, the TC377 variant offers expanded memory and crypto capability without footprint change, while the S32K344 provides Arm-based alternatives with different safety architecture trade-offs-neither matches the TriCore's deterministic real-time performance in lockstep mode.
Availability
TC357TH64F300SABKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and ADAS domain controllers requiring stable component supply, long-term automotive lifecycle support, and ASIL D-certified silicon.
Supply support for TC357TH64F300SABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich with global R&D and manufacturing operations.
The AURIX™ TC3xx product line was designed specifically for automotive safety-critical applications-including powertrain, chassis, and ADAS-delivering deterministic real-time performance, hardware-based functional safety, and scalable multi-core architectures compliant with ISO 26262.
FAQ
What is the maximum junction temperature rating for TC357TH64F300SABKXUMA1?
The TC357TH64F300SABKXUMA1 is rated for a maximum junction temperature of 150°C, validated across its full operating voltage range (1.14–1.26 V for VDDP_1P2) and supported by thermal resistance data (θJA = 22.5°C/W typical for LFBGA-292 on 4-layer board). This enables deployment in under-hood automotive environments without active cooling.
Does TC357TH64F300SABKXUMA1 include hardware support for secure boot?
Yes - the device supports secure boot via its optional Hardware Security Module (HSM), which verifies digital signatures of boot images using RSA-2048 or ECDSA-P256 before execution. Boot keys are injected during programming via JTAG/DAP and stored in tamper-resistant HSM memory, meeting EVITA Full requirements.
How many CAN FD interfaces does TC357TH64F300SABKXUMA1 support?
The TC357TH64F300SABKXUMA1 integrates two MCMCAN modules, each supporting two CAN FD nodes - totaling four independent CAN FD interfaces. Each node supports bit rates up to 5 Mbps, programmable data phase arbitration, and hardware timestamping with ±1 cycle accuracy.
Is external RAM required for typical TC357TH64F300SABKXUMA1 applications?
No - the device contains 512 KB on-chip LMU SRAM, 240 KB DSPR, and 64 KB PSPR, all ECC-protected and accessible with zero wait states. This eliminates need for external RAM in most ASIL D ECU implementations, reducing BOM cost, PCB area, and failure points while improving functional safety metrics.
TC357TH64F300SABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 5-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 960K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 16x8b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC357TH64F300SABKXUMA1 FAQ
1.How can I place an order for TC357TH64F300SABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC357TH64F300SABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC357TH64F300SABKXUMA1 reliable?
The price and inventory of TC357TH64F300SABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC357TH64F300SABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC357TH64F300SABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC357TH64F300SABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC357TH64F300SABKXUMA1?
TC357TH64F300SABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC357TH64F300SABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC357TH64F300SABKXUMA1?
For technical support, including TC357TH64F300SABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC357TH64F300SABKXUMA1 requirements.
6.How does Aetrix verify that TC357TH64F300SABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC357TH64F300SABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC357TH64F300SABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC357TH64F300SABKXUMA1?
All TC357TH64F300SABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC357TH64F300SABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC357TH64F300SABKXUMA1 part is unused and in its original packaging.
Return procedure for TC357TH64F300SABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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