Infineon Technologies TC387QP160F300SAEKXUMA1

Overview

TC387QP160F300SAEKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring four TC1.6.2P CPU cores (up to 300 MHz), 10 MB program flash, 512 KB data flash for EEPROM emulation, dual-lockstep safety architecture, and integrated Ethernet MAC (RGMII/RMII/MII), MCMCAN, FlexRay™, and PSI5 interfaces. It targets automotive ASIL-D safety-critical control units such as engine management, transmission, and chassis domain controllers.

For engineers reviewing the TC387QP160F300SAEKXUMA1 datasheet, TC387QP160F300SAEKXUMA1 pinout, TC387QP160F300SAEKXUMA1 application, or TC387QP160F300SAEKXUMA1 equivalent, key selection considerations include dual-lockstep core configuration, 300 MHz real-time execution at full temperature range, ECC-protected memory hierarchy, hardware safety monitoring (SMU, MTU, IOM), and support for AUTOSAR-compliant communication stacks including CAN FD, FlexRay V2.1, and IEEE 802.3 Ethernet.

Technical Context

The TC387QP160F300SAEKXUMA1 implements a quad-core TriCore™ architecture with two lockstepped CPU pairs for functional safety compliance. Each core integrates a fully pipelined FPU, 32 KB instruction cache, 16 KB data cache, and up to 240 KB DSPR RAM. The on-chip bus system uses a 64-bit crossbar (SRI) for concurrent CPU/memory/peripheral access and a 32-bit SPB for peripheral interconnect.

It supports multiple clock domains via SYS_PLL (up to 300 MHz) and PER_PLL, includes an HSSL interface for inter-processor communication at 320 Mbit/s, and integrates safety-critical peripherals: 3 MCMCAN modules (4 CAN nodes), 2 E-Ray channels, 25 SENT inputs, and 16-channel VADC with 0–5.5 V input range. All embedded memories feature ECC protection and built-in test (MBIST).

Key Specifications

Pinout & Package

This device is packaged in a 516-ball BGA (19 mm × 19 mm, 0.8 mm pitch), RoHS-compliant, lead-free, and qualified per AEC-Q100 Grade 1. Pin assignment follows the BGA516 package variant defined in Section 2.1 of the TC38x datasheet (V1.2, 2021-03).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Compared with TC387QP160F300SAEKXUMA1, the TC377 offers reduced integration and footprint for cost-sensitive non-Ethernet applications, while the TC397 extends security and memory capacity for secure zonal gateways - neither is pin-compatible, but all three share TriCore™ toolchain and AUTOSAR stack compatibility.

Availability

TC387QP160F300SAEKXUMA1 is available at Aetrix Electronics and suitable for automotive engine control, brake domain controllers, chassis domain modules, and electric power steering systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 1 qualification.

Supply support for TC387QP160F300SAEKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

The TC38x series belongs to Infineon's AURIX™ family - designed specifically for ASIL-D automotive safety applications including powertrain, chassis, and advanced driver assistance systems (ADAS), emphasizing real-time determinism, fault containment, and hardware-enforced security.

FAQ

What is the maximum operating temperature range for TC387QP160F300SAEKXUMA1?

The TC387QP160F300SAEKXUMA1 is qualified for operation from −40 °C to +125 °C ambient temperature (T_A), meeting AEC-Q100 Grade 1 requirements. All performance specifications-including 300 MHz CPU frequency, memory timing, and peripheral operation-are guaranteed across this full range, validated via extended temperature burn-in and characterization testing.

Does TC387QP160F300SAEKXUMA1 include hardware cryptographic acceleration?

No, the TC387QP160F300SAEKXUMA1 does not integrate a dedicated cryptographic accelerator. It supports software-based TLS/SSL and AES via its TriCore™ CPU cores and optional Hardware Security Module (HSM) in select variants-but the SAEKXUMA1 suffix denotes the standard version without HSM. For hardware crypto, consider TC397 or TC4xx derivatives with integrated HSM and PKA engines.

Can TC387QP160F300SAEKXUMA1 operate without an external crystal oscillator?

Yes. The device integrates a factory-trimmed 12 MHz internal RC oscillator (IRC) usable for boot and low-speed operation. However, for Ethernet, CAN FD, or FlexRay timing compliance, an external 40 MHz crystal is required to feed the SYS_PLL and PER_PLL-internal IRC alone does not meet jitter or stability requirements for these interfaces.

Is the BGA516 package of TC387QP160F300SAEKXUMA1 compatible with reflow soldering per J-STD-020?

Yes. The TC387QP160F300SAEKXUMA1 BGA516 package is qualified for standard Pb-free reflow soldering per J-STD-020D, with peak temperature up to 260 °C and 20-second duration above 220 °C. Its moisture sensitivity level (MSL) is 3, requiring bake-out if exposed to ambient > 30 °C/60% RH for more than 168 hours prior to assembly.