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Infineon Technologies TC387QP160F300SAELXUMA1

Part No.:
TC387QP160F300SAELXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
292-LFBGA
Datasheet:
AetrixTC387QP160F300SAELXUMA1.pdf
Description:
IC MCU 32BIT 10MB FLASH 292LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,806

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Product details

Overview

TC387QP160F300SAELXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring four lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 10 MB embedded PFlash with ECC, 512 KB DFlash for EEPROM emulation, and integrated safety features including SMU, MTU, and optional HSM. It supports automotive ASIL-D functional safety compliance and is deployed in engine control units (ECUs), battery management systems (BMS), and vehicle domain controllers.

For engineers reviewing the TC387QP160F300SAELXUMA1 datasheet, TC387QP160F300SAELXUMA1 pinout, TC387QP160F300SAELXUMA1 application, or TC387QP160F300SAELXUMA1 equivalent, key selection criteria include dual-core lockstep configuration, RGMII/Ethernet MAC support, MCMCAN with FIFO buffering, SENT sensor interface count, and ASIL-D certification readiness.

Technical Context

The TC387QP160F300SAELXUMA1 implements a distributed safety architecture with dedicated Safety Management Unit (SMU) monitoring CPU, memory, and peripheral integrity. Its System PLL delivers stable 300 MHz core clock with jitter < ±50 ps RMS, while Peripheral PLL independently clocks Ethernet, CAN, and ADC subsystems.

It integrates three MCMCAN modules (4 total CAN nodes), each with configurable message RAM and hardware FIFOs supporting ISO 11898-1:2015 and CAN FD up to 5 Mbit/s. The GTM provides autonomous I/O timing with 32-bit resolution and sub-microsecond latency for motor control PWM generation and position capture.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Four 32-bit TriCore™ TC1.6.2P CPUs; two configured in lockstep for ASIL-D compliance
Max Core Frequency 300 MHz across full industrial temperature range (–40°C to +125°C)
Embedded Memory 10 MB ECC-protected PFlash + 512 KB DFlash (EEPROM emulation) + 128 KB LMU SRAM
ADC System VADC cluster with 16 kernels; 12-bit resolution, 1.2 µs conversion time, 0–5.5 V input range
Communication Interfaces 3× MCMCAN (4 nodes), 2× FlexRay™ E-Ray v2.1, 1× IEEE 802.3 Ethernet MAC (RGMII/RMII/MII), 5× QSPI, 24× ASCLIN
Safety Features SMU, MTU (MBIST + ECC), IOM, lockstep CPU pairs, and optional Hardware Security Module (HSM)
Sensor Interfaces 25× SENT channels (v1.3), 4× PSI5 (v1.3), 1× PSI5-S with serial PHY

Pinout & Package

TC387QP160F300SAELXUMA1 is housed in a 160-pin LQFP package (14 × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignment follows Infineon's standardized BGA/LQFP mapping for TC38x AD/AE-step devices, optimized for automotive PCB layout and thermal dissipation.

Pin/Terminal Circuit Role Design Meaning
VDDP_1P3 1.3 V Core Power Supply Supplies CPU, cache, and logic domains; requires low-noise regulation and local decoupling
VDDP_3V3 3.3 V I/O Power Supply Drives GPIO, ASCLIN, QSPI, and SENT interfaces; supports 5 V-tolerant inputs on select pins
ETH_TXD0–ETH_TXD3 Ethernet Transmit Data (RGMII) 4-bit parallel RGMII transmit path; requires matched trace length ≤10 mm and 50 Ω impedance
ETH_RXD0–ETH_RXD3 Ethernet Receive Data (RGMII) 4-bit parallel RGMII receive path; includes embedded clock recovery for deterministic sampling
OSC_IN / OSC_OUT External Crystal Oscillator Interface Supports 20–40 MHz fundamental-mode crystals; internal oscillator circuit enables fast startup (< 100 µs)
TRSTN / TCK / TMS / TDI / TDO JTAG Debug Interface IEEE 1149.1-compliant boundary scan and debug access; supports real-time trace via DAP

Key Features

Feature Design Value
Lockstep CPU Pairing Two TC1.6.2P cores run identical code with cycle-accurate comparison; detects transient faults for ASIL-D diagnostic coverage
Hardware Security Module (HSM) Optional secure co-processor supporting AES-128/256, SHA-256, RSA-2048, and secure boot with key provisioning
GTM Timer Subsystem Autonomous signal processing unit with 32-bit timers, pattern generators, and event-triggered DMA for motor control without CPU load
MCMCAN Message RAM Configurable 64 KB on-chip RAM per MCMCAN module; enables zero-copy message filtering and FIFO-based transmission scheduling
VADC Parallel Sampling Simultaneous sampling across all 16 kernels with synchronized trigger; supports multi-sensor phase alignment in BMS applications

Applications

Engine Control Unit (ECU) Battery Management System (BMS)

Use Scenario: Real-time combustion timing, fuel injection control, and exhaust gas recirculation in ICE powertrains.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software; GTM generates precise PWM for injectors and ignition coils.

Use Value: Lockstep CPU execution ensures fault detection within < 10 µs, meeting ISO 26262 ASIL-D timing requirements for torque-limiting functions.

Use Scenario: Cell voltage, temperature, and current monitoring across 12–24 series Li-ion cells in EV traction batteries.

IC Role / Device Role / Timing Role: Central BMS controller interfacing with analog front-ends via VADC and SENT sensors; manages isolation and communication over CAN FD.

Use Value: 16-channel VADC with simultaneous sampling enables synchronized cell voltage acquisition at 10 kSps per channel, reducing SOC estimation error by ≤0.5%.

Vehicle Domain Controller Advanced Driver Assistance System (ADAS) Sensor Hub

Use Scenario: Consolidated control of chassis, powertrain, and body functions in zonal architecture vehicles.

IC Role / Device Role / Timing Role: High-integration domain MCU hosting AUTOSAR Classic and Adaptive platforms; Ethernet (RGMII) connects to central gateway.

Use Value: Integrated 1 Gbps Ethernet MAC eliminates external PHY, reducing BOM cost and board area by 35% vs discrete solutions.

Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS ECU.

IC Role / Device Role / Timing Role: Sensor fusion hub using PSI5-S and SENT interfaces to acquire raw sensor streams; GTM performs time-of-flight calculation for ultrasonics.

Use Value: 25 SENT receivers support direct connection to 25+ ultrasonic transducers, enabling full-vehicle parking assist without external signal conditioners.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC377TP160F300SJLXUMA1 Same core and memory size but lacks Ethernet MAC and one MCMCAN module; no RGMII interface Suitable for non-networked ECUs where CAN-only communication suffices Select when Ethernet connectivity is unnecessary and cost optimization is prioritized over future-proofing
S32K344WAT0MLT NXP S32K344: Arm Cortex-M7 + Cortex-M33 lockstep; 8 MB Flash, no integrated Ethernet MAC (requires external PHY) Targets similar ASIL-D applications but uses different toolchain and safety library ecosystem Prefer if existing NXP S32K development infrastructure and AUTOSAR stack licensing are already in place

Compared with TC377TP160F300SJLXUMA1, this part adds critical Ethernet and CAN FD bandwidth for domain controller use; versus S32K344WAT0MLT, it delivers integrated RGMII and higher Flash density without external components, reducing system-level validation effort.

Availability

TC387QP160F300SAELXUMA1 is available at Aetrix Electronics and suitable for engine control units, battery management systems, vehicle domain controllers, and ADAS sensor hubs requiring stable component supply across extended automotive lifecycles.

Supply support for TC387QP160F300SAELXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, security controllers, and automotive MCUs, headquartered in Munich.

The TC38x AURIX™ family targets ASIL-D automotive applications-especially powertrain, chassis, and domain control-with emphasis on functional safety, real-time determinism, and integrated security.

FAQ

What safety certifications does TC387QP160F300SAELXUMA1 support?

This MCU is designed to meet ISO 26262 ASIL-D requirements at the hardware level. It includes certified safety mechanisms such as lockstep CPU pairs, ECC-protected memories, SMU, MTU, and IOM. Infineon provides certified safety manuals, FMEDA reports, and diagnostic software libraries compliant with ASIL-D decomposition rules.

Does TC387QP160F300SAELXUMA1 include an integrated Ethernet PHY?

No-it integrates a full IEEE 802.3-compliant Ethernet MAC with RGMII, RMII, and MII interfaces but requires an external PHY for physical layer signaling. RGMII mode supports 10/100/1000 Mbps operation with precise timing alignment between TXCLK and RXCLK signals.

How many CAN FD interfaces does TC387QP160F300SAELXUMA1 support?

The device integrates three MCMCAN modules supporting up to four CAN FD nodes total. Each node operates at up to 5 Mbit/s with flexible data field lengths (up to 64 bytes), configurable message RAM, and hardware FIFOs for deterministic message handling in safety-critical networks.

Is the Hardware Security Module (HSM) included in TC387QP160F300SAELXUMA1?

The HSM is optional and enabled only in specific variants denoted by suffix "H" (e.g., TC387H…). TC387QP160F300SAELXUMA1 does not include the HSM; it supports software-based cryptographic acceleration via the main CPU and dedicated crypto instructions, but lacks secure key storage or tamper-resistant execution environment.

TC387QP160F300SAELXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
292-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Quad-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
-
Program Memory Size:
10MB (10M x 8)
Program Memory Type:
FLASH
EEPROM Size:
512K x 8
RAM Size:
1.53K x 8
Voltage - Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 142 SAR, Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC387QP160F300SAELXUMA1 FAQ

1.How can I place an order for TC387QP160F300SAELXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC387QP160F300SAELXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC387QP160F300SAELXUMA1 reliable?

The price and inventory of TC387QP160F300SAELXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC387QP160F300SAELXUMA1 is usually 5 days.

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TC387QP160F300SAELXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC387QP160F300SAELXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC387QP160F300SAELXUMA1?

For technical support, including TC387QP160F300SAELXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC387QP160F300SAELXUMA1 requirements.

6.How does Aetrix verify that TC387QP160F300SAELXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC387QP160F300SAELXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC387QP160F300SAELXUMA1 meets industry standards.

7.What is the process for return or replacement of TC387QP160F300SAELXUMA1?

All TC387QP160F300SAELXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC387QP160F300SAELXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC387QP160F300SAELXUMA1 part is unused and in its original packaging.

Return procedure for TC387QP160F300SAELXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC387QP160F300SAELXUMA1 Tags

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