Infineon Technologies TC389QP160F300SAEKXUMA1

Overview

TC389QP160F300SAEKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring four lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 10 MB ECC-protected program flash, 512 KB data flash for EEPROM emulation, integrated HSM security module, and dual CAN FD + FlexRay + Ethernet MAC (RGMII/RMII/MII) interfaces. It targets automotive safety-critical ADAS and powertrain control systems requiring ASIL-D compliance.

For engineers reviewing the TC389QP160F300SAEKXUMA1 datasheet, TC389QP160F300SAEKXUMA1 pinout, TC389QP160F300SAEKXUMA1 application, or TC389QP160F300SAEKXUMA1 equivalent, key selection criteria include dual-core lockstep configuration, hardware safety monitoring (SMU/MTU/IOM), real-time deterministic latency via GTM and CCU6 timers, and support for AUTOSAR-compliant communication stacks including MCMCAN, E-Ray, and ETH.

Technical Context

The TC389QP160F300SAEKXUMA1 implements a multi-master 64-bit SRI crossbar interconnect with dedicated SPB peripheral bus, enabling concurrent access to PFLASH, DFLASH, DSPR, PSPR, and LMU memories while maintaining ECC protection across all on-chip SRAM and NVM. Its safety architecture integrates SMU alarms, MTU memory test logic, and IOM digital I/O monitoring to meet ISO 26262 ASIL-D requirements.

It features two independent PLLs - SYS_PLL for core clock generation and PER_PLL for peripheral domain timing - plus redundant clock sources including internal 12 MHz oscillator, external crystal input, and backup clock path. Communication subsystems include three MCMCAN modules (4 total CAN FD nodes), two E-Ray controllers (V2.1), and IEEE 802.3-compliant Ethernet MAC supporting RGMII at 1 Gbps line rate.

Key Specifications

Pinout & Package

TC389QP160F300SAEKXUMA1 uses a 516-ball BGA package (27 mm × 27 mm, 0.8 mm pitch) with thermal pad. Pin assignment follows the BGA516 variant defined in Section 2.1 of the datasheet, supporting high-density routing for automotive ECU designs requiring signal integrity and thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Compared with TC389QP160F300SAEKXUMA1, TC397 offers expanded memory and crypto capability for future-proofing, while S32K344 trades interface breadth for lower cost and simpler toolchain - making TC389 the optimal balance of ASIL-D readiness, automotive protocol coverage, and production scalability.

Availability

TC389QP160F300SAEKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS sensor fusion, brake-by-wire systems, and vehicle domain controllers requiring stable component supply and long-term automotive lifecycle support.

Supply support for TC389QP160F300SAEKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

The AURIX™ TC3xx family delivers ASIL-D capable multicore microcontrollers optimized for automotive real-time safety-critical applications including powertrain, chassis, and ADAS - built on TriCore™ architecture with integrated safety mechanisms.

FAQ

What safety certifications does TC389QP160F300SAEKXUMA1 support?

TC389QP160F300SAEKXUMA1 is designed to comply with ISO 26262 up to ASIL-D for hardware elements and supports ASIL-B decomposition for software. It includes certified safety libraries (SafeTcore), FMEDA reports, and hardware safety mechanisms such as lockstep CPUs, SMU, MTU, and ECC-protected memories - validated per ISO 26262-5 Annex D.

Does this part include an integrated Ethernet PHY?

No, TC389QP160F300SAEKXUMA1 integrates only the IEEE 802.3-compliant Ethernet MAC layer with RGMII, RMII, and MII interfaces. An external PHY (e.g., Infineon's TLF35584 or compatible 100/1000BASE-T PHY) is required for physical layer connectivity and must be connected via the RGMII interface with controlled trace length and impedance matching.

Can the HSM be enabled on this specific variant?

Yes, TC389QP160F300SAEKXUMA1 includes an optional Hardware Security Module (HSM) that is silicon-present but requires activation via fuse programming during manufacturing. The HSM supports AES-128/256, SHA-256, RSA-2048, and secure boot key storage - accessible only through protected debug interfaces after secure provisioning.

What is the maximum ambient temperature rating for continuous operation?

TC389QP160F300SAEKXUMA1 is qualified for continuous operation at ambient temperatures from –40°C to +125°C, meeting AEC-Q100 Grade 1 requirements. Junction temperature limits are defined by thermal resistance (θJA = 17.5°C/W typical) and power dissipation - derating applies above 105°C ambient depending on PCB layout and airflow.