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Infineon Technologies TC389QP160F300SAELXUMA1
- Part No.:
- TC389QP160F300SAELXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-FBGA
- Datasheet:
-
TC389QP160F300SAELXUMA1.pdf
- Description:
- IC MCU 32BIT 10MB FLASH 516FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,203
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Product details
Overview
TC389QP160F300SAELXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring four lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 10 MB ECC-protected program flash, 512 KB data flash for EEPROM emulation, integrated HSM security module, and dual CAN FD + FlexRay™ + Ethernet MAC (RGMII/RMII/MII) interfaces. It targets ASIL-D automotive safety-critical applications including electric powertrain control, battery management systems, and ADAS domain controllers.
For engineers reviewing the TC389QP160F300SAELXUMA1 datasheet, TC389QP160F300SAELXUMA1 pinout, TC389QP160F300SAELXUMA1 application, or TC389QP160F300SAELXUMA1 equivalent, key selection criteria include dual-core lockstep configuration, 300 MHz real-time execution at full industrial temperature range (–40°C to 125°C), hardware safety monitoring (SMU/MTU/IOM), and support for AUTOSAR-compliant functional safety development per ISO 26262.
Technical Context
The TC389QP160F300SAELXUMA1 implements a quad-core TriCore architecture with two lockstepped core pairs for ASIL-D compliance, each core delivering 300 MHz operation with fully pipelined FPU, 2-cycle MAC throughput, and dedicated DSPR/PSPR scratchpad RAM. Its memory subsystem includes 10 MB PFLASH with ECC, 512 KB DFLASH for wear-leveling EEPROM emulation, and 128 KB LMU SRAM - all protected by on-chip MTU and SMU.
Peripheral integration centers on deterministic real-time I/O: three MCMCAN modules (4 CAN FD nodes), two E-Ray FlexRay™ v2.1 channels, IEEE 802.3-compliant ETH MAC with RGMII/RMII/MII PHY options, 24 ASCLIN (LIN v2.1/J2602), five QSPI (50 Mbit/s), and GTM-based autonomous signal conditioning. Safety is enforced via hardware I/O monitor (IOM), lockstep error detection, and optional HSM for secure boot and cryptographic acceleration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Four 32-bit TriCore™ TC1.6.2P cores; two lockstepped pairs for ASIL-D fault containment. |
| Max Clock Frequency | 300 MHz across full industrial temperature range (–40°C to +125°C); enables deterministic real-time response in powertrain control loops. |
| Flash Memory | 10 MB ECC-protected PFLASH + 512 KB DFLASH; supports EEPROM emulation with wear leveling and atomic update capability. |
| Safety Features | Integrated SMU, MTU, IOM, and lockstep CPU monitoring; certified for ISO 26262 ASIL-D system-level compliance. |
| Communication Interfaces | 3× MCMCAN (4 CAN FD nodes), 2× E-Ray FlexRay™ v2.1, 1× ETH MAC (RGMII/RMII/MII), 5× QSPI, 24× ASCLIN (LIN v2.1). |
| ADC System | VADC cluster with 16 independent kernels; 0–5.5 V input range, configurable resolution up to 12-bit, hardware-triggered sampling for motor current sensing. |
| Package | BGA516 (27 mm × 27 mm, 0.8 mm pitch); qualified for automotive under AEC-Q100 Grade 1 (–40°C to +125°C). |
Pinout & Package
TC389QP160F300SAELXUMA1 uses a 516-ball BGA package (27 mm × 27 mm, 0.8 mm pitch) with thermal pad, compliant with AEC-Q100 Grade 1 and JEDEC J-STD-020 moisture sensitivity level 3. Pin functions are defined across multiple voltage domains (VDDP/VDDC/VDDIO), safety-redundant signal routing, and dedicated JTAG/DAP debug interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 / VDDP_1 | Core Power Supply | 1.25 V ±3% supply for CPU cores and caches; requires low-noise regulation and decoupling for 300 MHz stability. |
| VDDC_0 / VDDC_1 | Analog & Peripheral Power | 3.3 V ±5% supply for VADC, DSADC, and analog peripherals; isolated from digital domains to minimize noise coupling. |
| VDDIO_0–VDDIO_7 | I/O Bank Power | Configurable 3.3 V or 5 V supply per bank; enables mixed-voltage interfacing with legacy sensors and actuators. |
| TCK/TMS/TDO/TDI | JTAG Debug Interface | IEEE 1149.1-compliant boundary scan and debug access; supports real-time trace and safety verification during runtime. |
| ETH_RXD[3:0]/TXD[3:0] | Ethernet PHY Interface | RGMII mode signals; require controlled impedance PCB routing (50 Ω differential) and matched trace lengths for <100 ns skew. |
| ERAY_A_TX/ERAY_A_RX | FlexRay™ Channel A | Differential high-speed serial interface (up to 10 Mbit/s); mandates termination resistors and shielded routing for EMC robustness. |
Key Features
| Feature | Design Value |
|---|---|
| Quad-core TriCore™ with lockstep | Two independent lockstep core pairs enable ASIL-D fault detection without software overhead; supports split-mode operation for heterogeneous task partitioning. |
| Hardware Security Module (HSM) | Dedicated ARM® Cortex®-M3 co-processor with AES-128/256, SHA-256, RSA-2048, and secure key storage; isolates cryptographic operations from main application cores. |
| GTM timer subsystem | Programmable digital signal processing unit with 128 timers, 32 pattern generators, and 64 capture units; offloads CPU from PWM generation, sensor signal filtering, and time-triggered I/O sequencing. |
| ECC-protected memory hierarchy | End-to-end ECC on PFLASH, DFLASH, SRAM, caches, and bus interconnects; detects and corrects single-bit errors, reports double-bit faults for safe shutdown. |
| MCMCAN with FIFO buffering | Three independent CAN FD controllers with 64-entry message RAM per node; enables zero-copy reception/transmission and hardware timestamping for time-synchronized diagnostics. |
Applications
| Electric Powertrain Control | Battery Management System (BMS) |
|---|---|
|
Use Scenario: Real-time torque vectoring, inverter gate drive timing, and motor phase current regulation in 400 V/800 V traction inverters. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with sub-1 µs interrupt latency and hardware-enforced timing supervision. Use Value: Lockstep CPU pair ensures fault detection within 10 µs; GTM generates precise PWM with <±1 ns jitter; VADC achieves 12-bit resolution at 1 MSps for current sensing. |
Use Scenario: Cell voltage monitoring, thermal management, SOC/SOH estimation, and isolation monitoring in high-voltage EV battery packs. IC Role / Device Role / Timing Role: Central BMS controller managing up to 96 cell measurements via daisy-chained PSI5 interfaces and redundant CAN FD communication to vehicle gateway. Use Value: Integrated DSADC supports simultaneous 24-channel 16-bit measurement; DFLASH provides reliable parameter storage across 100k+ write cycles; SMU validates sensor integrity every 10 ms. |
| ADAS Domain Controller | Brake-by-Wire System |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+/L3 automated driving functions. IC Role / Device Role / Timing Role: High-bandwidth data concentrator with Ethernet (100BASE-T1), FlexRay™, and CAN FD interfaces synchronizing multi-sensor timestamps via GTM-based hardware triggers. Use Value: RGMII interface delivers 100 Mbps full-duplex link to radar SoC; E-Ray ensures deterministic 10 Mbit/s communication with <5 µs jitter for fail-operational redundancy. |
Use Scenario: Redundant electro-hydraulic brake actuation with dual independent control paths and mechanical fallback. IC Role / Device Role / Timing Role: Dual-lockstep safety controller executing ISO 26262-compliant brake pressure modulation algorithms with hardware-monitored watchdog chains and IOM-checked I/O pins. Use Value: IOM continuously verifies output driver states against expected values; HSM signs firmware updates over secure CAN FD; MTU performs periodic memory self-tests during idle cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XPV160F300SAAKXUMA1 | Higher integration: 16 MB PFLASH, 1 MB DFLASH, enhanced HSM (AES-GCM, TRNG), additional GTM I/O channels. | Targeted at next-gen zonal architectures requiring larger OTA update partitions and stronger cryptographic agility. | Select when needing >10 MB flash, GCM-based secure boot, or extended GTM resource count for complex I/O orchestration. |
| S32K344WAT0VLQY | NXP S32K3 series; Arm Cortex-M7 dual-core, 32 MB flash, ASIL-D certified, but lacks FlexRay™ and RGMII Ethernet. | Preferred for non-FlexRay™ chassis networks and where Arm ecosystem tooling (S32DS, MCAL) is mandated. | Choose if project mandates Arm-based toolchain compatibility, higher flash density, or absence of FlexRay™ requirements. |
Compared with TC389QP160F300SAELXUMA1, TC397XPV160F300SAAKXUMA1 extends flash capacity and cryptographic capabilities for future-proof OTA and security needs, while S32K344WAT0VLQY offers Arm-native development flow at the cost of FlexRay™ and RGMII support - making TC389 optimal for established AURIX™-based powertrain and chassis platforms requiring full legacy interface coverage.
Availability
TC389QP160F300SAELXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, battery management systems, ADAS domain controllers, and brake-by-wire systems requiring stable component supply, long-term automotive lifecycle support, and ASIL-D-certified silicon.
Supply support for TC389QP160F300SAELXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing facilities.
The TC38x AURIX™ family is engineered for ISO 26262 ASIL-D automotive safety applications, emphasizing deterministic real-time performance, hardware-based fault containment, and comprehensive safety documentation for powertrain, chassis, and ADAS systems.
FAQ
What is the maximum operating temperature range for TC389QP160F300SAELXUMA1?
The TC389QP160F300SAELXUMA1 is qualified per AEC-Q100 Grade 1, supporting continuous operation from –40°C to +125°C ambient temperature. This rating applies to all core logic, memory, and peripheral blocks, with thermal derating not required up to the upper limit. Junction temperature monitoring is implemented via on-die sensor with programmable thresholds linked to SMU alarms.
Does TC389QP160F300SAELXUMA1 support AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR 4.3/4.4-compliant MCAL drivers (including Can, Eth, Fls, Fee, Gpt, Icu, Port, Spi, Wdg) and basic software modules compatible with leading RTOS vendors. The device's lockstep architecture, memory protection units, and interrupt latency guarantees meet AUTOSAR OS timing and safety requirements for ASIL-D configurations.
How is the Hardware Security Module (HSM) accessed and configured?
The HSM is a physically isolated ARM Cortex-M3 subsystem accessible only via secure mailbox interface from the main TriCore cores. Configuration occurs through dedicated HSM-specific registers and firmware loaded into its internal ROM/RAM; it supports AES-128/256 encryption, SHA-256 hashing, RSA-2048 signing, and true random number generation. Secure boot validation and key provisioning are handled entirely within HSM boundaries.
What debug and trace capabilities does TC389QP160F300SAELXUMA1 provide for safety-critical development?
The device integrates JTAG (IEEE 1149.1), DAP (ARM CoreSight), and real-time trace via Embedded Trace Macrocell (ETM) and Instrumentation Trace Macrocell (ITM). Full visibility into both lockstep core pairs is supported, including cycle-accurate instruction trace, data watchpoints, and safety register snapshots. Trace data is routed externally via 4-bit parallel trace port or SWO, enabling runtime fault injection testing and certification evidence capture.
TC389QP160F300SAELXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-FBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 10MB (10M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512K x 8
- RAM Size:
- 1.54M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 142 SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC389QP160F300SAELXUMA1 FAQ
1.How can I place an order for TC389QP160F300SAELXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC389QP160F300SAELXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC389QP160F300SAELXUMA1 reliable?
The price and inventory of TC389QP160F300SAELXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC389QP160F300SAELXUMA1 is usually 5 days.
3.What payment methods are accepted for TC389QP160F300SAELXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC389QP160F300SAELXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC389QP160F300SAELXUMA1?
TC389QP160F300SAELXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC389QP160F300SAELXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC389QP160F300SAELXUMA1?
For technical support, including TC389QP160F300SAELXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC389QP160F300SAELXUMA1 requirements.
6.How does Aetrix verify that TC389QP160F300SAELXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC389QP160F300SAELXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC389QP160F300SAELXUMA1 meets industry standards.
7.What is the process for return or replacement of TC389QP160F300SAELXUMA1?
All TC389QP160F300SAELXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC389QP160F300SAELXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC389QP160F300SAELXUMA1 part is unused and in its original packaging.
Return procedure for TC389QP160F300SAELXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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